Lighting element alignment

Patent metadata

Field	Value
Publication number	US-12408482-B2
Application number	US-202118018466-A
Country	US
Kind code	B2
Filing date	Jul 28, 2021
Priority date	Jul 29, 2020
Publication date	Sep 2, 2025
Grant date	Sep 2, 2025

Abstract

The invention refers to a method for assembling at least one lighting element onto a substrate, the method comprising: pre-assembling at least one lighting element onto a temporary carrier; pre-assembling at least one reference element onto the temporary carrier; aligning the pre-assembled temporary carrier onto the substrate based, at least in part, on the at least one reference element of the temporary carrier; and mounting the at least one lighting element onto the substrate. The invention further relates to substrate comprising: at least one lighting element, wherein the at least one lighting element is assembled onto the substrate, in particular by a method according to the first aspect of the present invention, and to a use of a method for assembling at least one lighting element onto a substrate.

First claim

The invention claimed is:

1. A method for assembling at least one lighting element onto a substrate, comprising:
pre-assembling at least one lighting element onto a temporary carrier;
pre-assembling at least one reference element onto the temporary carrier, the at least one reference element having an equal or greater thickness as the at least one lighting element and providing a mechanical stop for aligning the pre-assembled temporary carrier in at least one direction chosen from a first direction, a second direction perpendicular to the first direction, and a third direction perpendicular to the second direction, the at least one reference element comprising at least one fiducial providing a mechanical stop for aligning the pre-assembled temporary carrier in the first direction and/or for enabling optical alignment of the pre-assembled temporary carrier;
aligning the pre-assembled temporary carrier onto the substrate based, at least in part, on the at least one reference element of the temporary carrier; and
mounting the at least one lighting element onto the substrate, wherein the at least one light element comprises a material not comprised in the at least one reference element.

2. The method according to claim 1 , further comprising:
removing the temporary carrier from the substrate when the at least one lighting element is permanently attached to the substrate.

3. The method according to claim 1 , wherein at least one fiducial is a dent or recess on a top side of the at least one reference element.

4. The method according to claim 1 , wherein the pre-assembled temporary carrier is aligned to the substrate by a pick and place process.

5. The method according to claim 1 , wherein the substrate is a printed circuit board.

6. The method according to claim 1 , wherein the at least one lighting element is mounted to the substrate by gluing or soldering it onto the substrate.

7. The method according to claim 1 , further comprising:
mounting the at least one reference element onto the substrate prior to or after the mounting of the at least one lighting element.

8. The method according to claim 1 , wherein the temporary carrier comprises an adhesive layer enabling the pre-assembling of the at least one lighting element and the at least one reference element onto the temporary carrier.

9. The method according to claim 1 , wherein a plurality of lighting elements are pre-assembled onto the temporary carrier in a single or M×N array structure.

10. The method according to claim 1 , wherein the at least one reference element is a frame that enables alignment of at least one optical element to the substrate.

11. A substrate comprising:
at least one lighting element, wherein the at least one lighting element is assembled onto the substrate by a method according to claim 1 .

12. The substrate according to claim 11 , wherein the substrate is a printed circuit board.

13. Use of a method according to claim 1 for assembling optical components with one or more lighting elements.

14. The method according to claim 1 , wherein the temporary carrier comprises a foil.

15. The method according to claim 1 , wherein mounting the at least one lighting element onto the substrate comprises reflow soldering the at least one lighting element onto the substrate.

16. The method according to claim 1 , further comprising reflow soldering the at least one reference element to the substrate.

17. The method according to claim 1 , wherein aligning the pre-assembled temporary carrier onto the substrate comprises aligning each of the at least one lighting element and the at least one reference element to solder paste coated on the substrate.

18. The method according to claim 1 , wherein the temporary carrier is or comprises a tape.

19. The method according to claim 1 , the substrate comprises at least one conductive trace, and aligning the pre-assembled temporary carrier onto the substrate is based, at least in part, on aligning the at least one lighting element to a respective one of the at least one conductive trace, without aligning the at least one reference element to a respective one of the at least one conductive trace.

Assignees

• Lumileds Llc

Inventors

• Deckers Michael

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07351

  characterised by changes in properties of the die-attach connectors during connecting · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/07327

  involving guiding structures, e.g. spacers or supporting members · CPC title

• H10W72/367

  Multiple die-attach connectors having different functions · CPC title