Resin composition

Patent metadata

Field	Value
Publication number	US-12404398-B2
Application number	US-202218087757-A
Country	US
Kind code	B2
Filing date	Dec 22, 2022
Priority date	Nov 11, 2022
Publication date	Sep 2, 2025
Grant date	Sep 2, 2025

Abstract

A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture comprising styrene, divinylbenzene and ethylene, a second resin polymerized by modified dicyclopentadiene diamine and maleic anhydride, and a SBS resin. The resin composition of the disclosure may have a high glass transition temperature and a low dielectric constant and a low dissipation factor after curing.

First claim

What is claimed is:

1. A resin composition, comprising:
a resin mixture, comprising:
a first resin, polymerized by a monomer mixture comprising styrene, divinylbenzene, and ethylene;
a second resin, polymerized by modified dicyclopentadiene diamine and maleic anhydride; and
a SBS resin;

a flame retardant;
a spherical silica; and
a siloxane coupling agent.

2. The resin composition of claim 1 , wherein based on a total weight of the resin mixture, a content of the first resin is 30 wt % to 60 wt %, a content of the second resin is 20 wt % to 40 wt %, and a content of the SBS resin is 10 wt % to 30 wt %.

3. The resin composition of claim 1 , wherein based on 100 parts by weight of the resin mixture, an added amount of the spherical silica is 20 to 50 parts by weight.

4. The resin composition of claim 1 , wherein based on 100 parts by weight of the resin mixture, an added amount of the flame retardant is 10 to 50 parts by weight.

5. The resin composition of claim 1 , wherein based on 100 parts by weight of the resin mixture, an added amount of the siloxane coupling agent is 0.1 to 5 parts by weight.

6. The resin composition of claim 1 , wherein a molar ratio of styrene: divinylbenzene: ethylene in the monomer mixture is 1:1:1 to 2:2:1.

7. The resin composition of claim 1 , wherein a number average molecular weight of the first resin is 4500 to 6500.

8. The resin composition of claim 1 , wherein a weight average molecular weight of the second resin is 800 to 10,000.

9. The resin composition as claimed in claim 1 , wherein the SBS resin is polymerized by the monomer mixture comprising 5% to 40% styrene, 55% to 90% 1,2 butadiene and 5% to 30% 1,4 butadiene.

10. The resin composition of claim 1 , wherein a weight average molecular weight of the SBS resin is 3500 to 5500.

11. The resin composition of claim 1 , wherein the resin mixture further comprises polyphenylene ether resin.

12. The resin composition of claim 1 , wherein the spherical silica has acrylic or vinyl surface modification.

13. The resin composition of claim 1 , wherein an average particle diameter D50 of the spherical silica is 2.0 μm to 3.0 μm.

Assignees

• Nan Ya Plastics Corp

Inventors

• Liao Te-Chao
• Huang Wei-Ru
• Chang Hung-Yi
• Liu Chia-Lin

Classifications

• C08K9/04

  Ingredients treated with organic substances {(treated with macromolecular compounds C08K9/08)} · CPC title

• C08K3/36 Primary

  Silica · CPC title

• C08K7/18

  inorganic · CPC title

• C08K2201/003

  Additives being defined by their diameter · CPC title

• C08L77/00

  Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain (of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08); Compositions of derivatives of such polymers · CPC title