Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board

Patent metadata

Field	Value
Publication number	US-10240015-B2
Application number	US-201314414992-A
Country	US
Kind code	B2
Filing date	Aug 27, 2013
Priority date	Aug 29, 2012
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

A modified polyphenylene ether according to one aspect of the invention has an intrinsic viscosity, as measured in 25° C. methylene chloride, of from 0.03 to 0.12 dL/g, has on molecular ends thereof an average of 1.5 to 3 groups represented by formula (1) below per molecule, and includes not more than 5 mass % of a high-molecular-weight component having a molecular weight of 13,000 or more.

In formula (1), R 1 is a hydrogen atom or an alkyl group of 1 to 10 carbons, and R 2 is an alkylene group of 1 to 10 carbons.

First claim

The invention claimed is:

1. A modified polyphenylene ether having groups represented by formula (1) below on molecular ends of a polyphenylene ether represented by formula (4) below,
having an intrinsic viscosity, as measured in 25° C. methylene chloride, of from 0.03 to 0.12 dL/g, having on molecular ends thereof an average of 1.5 to 3 groups represented by formula (1) below per molecule, and including not more than 5 mass % of a high-molecular-weight component having a molecular weight of 13,000 or more:

where R 1 is a hydrogen atom or an alkyl group of 1 to 10 carbons, and R 2 is an alkylene group of 1 to 10 carbons, and

where s is from 1 to 20, t is from 1 to 20, and the combined value of s and t is from 1 to 30.

2. The modified polyphenylene ether according to claim 1 , wherein the group represented by formula (1) is at least one selected from the group consisting of p-ethenylbenzyl and m-ethenylbenzyl.

3. A polyphenylene ether resin composition comprising:
the modified polyphenylene ether according to claim 2 ; and
a heat-curing type curing agent.

4. The polyphenylene ether resin composition according to claim 3 , wherein the heat-curing type curing agent is at least one selected from the group consisting of trialkenyl isocyanurate compounds, polyfunctional acrylate compounds having at least two acryl groups on the molecule, polyfunctional methacrylate compounds having at least two methacryl groups on the molecule and polyfunctional vinyl compounds having at least two vinyl groups on the molecule.

5. The polyphenylene ether resin composition according to claim 3 , wherein the content of the modified polyphenylene ether, based on a total combined amount of the modified polyphenylene ether and the heat-curing type curing agent, is from 30 to 95 mass %.

6. A resin varnish comprising the polyphenylene ether resin composition according to claim 3 , and a solvent.

7. The resin varnish according to claim 6 , wherein the solvent is toluene.

8. A prepreg obtained by impregnating the polyphenylene ether resin composition according to claim 3 into a fibrous base material.

9. A metal-clad laminate obtained by laminating metal foil on the prepreg according to claim 8 , and molding under applied heat and pressure.

10. A printed circuit board manufactured using the prepreg according to claim 8 .

11. A method of preparing the modified polyphenylene ether according to claim 1 , comprising
reacting a polyphenylene ether represented by formula (4) below and having an intrinsic viscosity, as measured in 25° C. methylene chloride, of from 0.03 to 0.12 dL/g, having on molecular ends thereof an average of from 1.5 to 3 phenolic hydroxyl groups per molecule, and including not more than 5 mass % of a high-molecular-weight component having a molecular weight of 13,000 or more with a compound represented by formula (3) below:

where R 1 is a hydrogen atom or an alkyl group of 1 to 10 carbons, R 2 is an alkylene group of 1 to 10 carbons, and X is a halogen atom, and

where s is from 1 to 20, t is from 1 to 20, and the combined value of s and t is from 1 to 30.

12. The modified polyphenylene ether preparation method according to claim 11 , wherein the reaction is carried out in the presence of an alkali metal hydroxide.

13. The modified polyphenylene ether preparation method according to claim 12 , wherein the reaction is carried out in the presence of a phase transfer catalyst.

14. The modified polyphenylene ether preparation method according to claim 11 , wherein the compound represented by formula (3) is at least one selected from the group consisting of p-chloromethylstyrene and m-chloromethylstyrene.

15. The modified polyphenylene ether preparation method according to claim 11 , wherein the reaction is carried out in the presence of toluene.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Kitai Yuki
• Fujiwara Hiroaki

Classifications

• Y10T428/249921

  Web or sheet containing structurally defined element or component · CPC title

• H05K2201/0284

  Paper, e.g. as reinforcement · CPC title

• Y10T442/656

  Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the nonwoven fabric] · CPC title

• B32B2260/021

  Fibrous or filamentary layer · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title