Process for the preparation of a flame-retardant modified styrene-maleic anhydride resin and a composition of epoxy resins and their application to copper clad laminate and prepreg

Patent metadata

Field	Value
Publication number	US-10815372-B2
Application number	US-201815935917-A
Country	US
Kind code	B2
Filing date	Mar 26, 2018
Priority date	Mar 27, 2017
Publication date	Oct 27, 2020
Grant date	Oct 27, 2020

Abstract

This invention relates to flame-retardant modified maleic anhydride resins. This resin copolymer consists of styrene, maleic anhydride and, along with a halogen-free epoxy resin, interacts with a hydroxyl group to become a flame-retardant maleic anhydride copolymer that can be applied to copper clad laminate and prepreg. This composition comprises: (A) one or more epoxy resin mixtures; (B) modified styrene-maleic anhydride curing agent copolymer; (C) additives; (D) inorganic fillers. When the aggregate amount of components (A), (B) and (C) equals 100%, component (A), epoxy resin mixture, is 60%-80% in total weight, component (B), modified styrene-maleic anhydride curing agent copolymer, equals 10%-40% in total weight. This invention uses the copolymer of Styrene and Maleic anhydride to generate a flame-retardant hydroxyl group, and with the phosphorus additive, the above components eventually interact to form a flame-retardant modified maleic anhydride copolymer curing agent.

First claim

What we claimed is:

1. A resin composition comprising the following components (A) a mixture of one or more epoxy resins, (B) a copolymer of a modified flame-retardant styrene maleic anhydride (SMA), (C) an additive, and (D) an inorganic filler, wherein the structure of the copolymer of the modified flame-retardant styrene maleic anhydride of (B) is as following formula:

wherein m and n are positive integers, and m and n are the same or different;
wherein R 1 is an epoxy resin polymer chain, and the epoxy resin polymer chain is bisphenol A epoxy resin or bisphenol F epoxy resin;
wherein R 2 is a DOPO(9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) derivative of a phosphorus-based compound; the DOPO derivative of a phosphorus-based compound is DOPO(9,10-dihydro-9-oxa-10-phosphine-10-oxide), DOPO-HQ (10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide), or DOPO-NQ (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide quinone compound

2. The resin composition as claimed in claim 1 , wherein the component (A) epoxy resin mixture includes a resin mixture of one or more heterocyclic epoxy resins and at least one of bisphenol F epoxy resin, bisphenol A epoxy resin, and polyfunctional epoxy resin; wherein an epoxy equivalent of bisphenol F epoxy resin is 150-3,000 g/eq, an epoxy equivalent of bisphenol A epoxy resin is 150 to 3,000 g/eq, and an epoxy equivalent of the polyfunctional epoxy resin 150 to 3,000 g/eq.

3. The resin composition as claimed in claim 1 , wherein the component (A) epoxy resin mixture accounts for 60% to 80% of the total weight of the solid composition excluding the inorganic filler.

4. The resin composition as claimed in claim 1 , wherein the component (B) modified flame-retardant styrene maleic anhydride (SMA) copolymer accounts for 10% to 40% of the weight of composition solids excluding the inorganic filler.

5. The resin composition as claimed in claim 1 , wherein the component (C) additive is added according to the properties of the composition, which is one or more mixtures of high-molecular weight phenoxy resins, rubbers, phosphorus phenolic resins and flame retardants.

6. The resin composition as claimed in claim 1 , wherein component (D), the inorganic filler, is selected from the group consisting of crystalline, spherical and molten silica, aluminum hydroxide, magnesium hydroxide, and aluminum oxide, totaling 10% to 40% of the weight of the composition solids.

7. The resin composition as claimed in claim 1 , wherein the molecular weight range of the modified flame-retardant styrene maleic anhydride (SMA) copolymer ranges from 2,000 to 15,000.

8. A prepreg which is formed by impregnating or coating a reinforcing material in the resin composition claimed in claim 1 .

9. An adhesive sheet which is formed by impregnating or coating a reinforcing material in the resin composition claimed in claim 1 .

10. A copper foil laminate which is prepared by hot pressing the prepreg as claimed in claim 8 .

11. A printed circuit board comprising the copper foil laminate as claimed in claim 10 .

Assignees

• Nanya Plastics Corp

Inventors

• Lee Cheng-Chung
• Huang Jung-Hai
• Lee Chien-Hsing
• YANG Chun-Hsiung

Classifications

• C08J5/249

  characterised by the additives used in the prepolymer mixture · CPC title

• C08J5/244

  using glass fibres · CPC title

• H05K1/0353

  consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• C08K3/36

  Silica · CPC title