Semiconductor device and electronic apparatus with O-ring reinforcement structure

Patent metadata

Field	Value
Publication number	US-12385796-B2
Application number	US-202318136952-A
Country	US
Kind code	B2
Filing date	Apr 20, 2023
Priority date	Nov 16, 2020
Publication date	Aug 12, 2025
Grant date	Aug 12, 2025

Abstract

A semiconductor device includes a detector mounted on a base substrate and including a pressure detector to detect pressure, a base portion on the base substrate where the detector is buried, a protruding portion protruding upward from the base portion and including an exposure hole which causes the pressure detector to be exposed upward, and a lid supported by an upper surface of the protruding portion to close the exposure hole. An outer circumferential portion of the lid extends outward from the protruding portion in plan view. The lid includes a slit that is open to an outer side surface and causes the exposure hole to communicate with outside sideward of the semiconductor device.

First claim

What is claimed is:

1. A semiconductor device which detects pressure, the semiconductor device comprising:
a base substrate;
a detector mounted on an upper surface of the base substrate and including a pressure detector to detect pressure;
a resin package provided on the upper surface of the base substrate, with the detector buried therein, and including a cavity which exposes the pressure detector upward;
a lid supported by the resin package so as to close the cavity; and
a communicating portion to cause the cavity to communicate with outside of the semiconductor device; wherein the resin package includes:
a base portion where the detector is buried; and
a protruding portion protruding upward from the base portion and including the cavity;

in plan view, the base portion extends outward from an outer side surface of the protruding portion;
the lid is supported by an upper surface of the protruding portion;
the lid includes an extending portion in at least a portion of an outer circumferential portion of the lid, the extending portion extending outward from the outer side surface of the protruding portion in plan view; and
the communicating portion is open sideward of the semiconductor device to communicate with outside.

2. The semiconductor device according to claim 1 , wherein the communicating portion includes a space defined by a slit located inward of the outer circumferential portion of the lid in plan view.

3. The semiconductor device according to claim 2 , wherein the slit is at a position outside of the pressure detector in plan view.

4. The semiconductor device according to claim 2 , wherein the slit includes:
a wide portion at least a portion of which overlaps the cavity in plan view; and
a narrow portion connected to the wide portion and not overlapping the cavity in plan view.

5. The semiconductor device according to claim 2 , wherein the lid includes three or more of the slits.

6. The semiconductor device according to claim 1 , further comprising:
an adhering portion interposed partially between the upper surface of the protruding portion and the lid to fix the lid to the protruding portion; wherein
the communicating portion includes a space between the upper surface of the protruding portion and the lid which are opposed to each other in a portion between the upper surface of the protruding portion and the lid where the adhering portion is not interposed.

7. The semiconductor device according to claim 1 , wherein
the protruding portion includes a first concave portion recessed downward from the upper surface of the protruding portion; and
the communicating portion includes a space defined by the first concave portion.

8. The semiconductor device according to claim 1 , wherein
the lid includes a second concave portion recessed upward from a lower surface of the lid; and
the communicating portion includes a space defined by the second concave portion.

9. The semiconductor device according to claim 1 , further comprising:
at least two of a slit located inward of the outer circumferential portion of the lid in plan view, an adhering portion interposed partially between the upper surface of the protruding portion and the lid to fix the lid to the protruding portion, a first concave portion recessed downward from the upper surface of the protruding portion, and a second concave portion recessed upward from a lower surface of the lid; wherein
when the semiconductor device includes the slit, the communicating portion includes a first space defined by the slit;
when the semiconductor device includes the adhering portion, the communicating portion includes a second space between the upper surface of the protruding portion and the lid which are opposed to each other in a portion between the upper surface of the protruding portion and the lid where the adhering portion is not provided;
when the semiconductor device includes the first concave portion, the communicating portion includes a third space defined by the first concave portion;
when the semiconductor device includes the second concave portion, the communicating portion includes a fourth space defined by the second concave portion; and
in plan view, the first space, the second space, the third space, and the fourth space overlap one another.

10. The semiconductor device according to claim 1 , further comprising:
at least two of a slit located inward of the outer circumferential portion of the lid in plan view, an adhering portion interposed partially between the upper surface of the protruding portion and the lid to fix the lid to the protruding portion, a first concave portion recessed downward from the upper surface of the protruding portion, and a second concave portion recessed upward from a lower surface of the lid; wherein
when the semiconductor device includes the slit, the communicating portion includes a first space defined by the slit;
when the semiconductor device includes the adhering portion, the communicating portion includes a second space between the upper surface of the protruding portion and the lid which are opposed to each other in a portion between the upper surface of the protruding portion and the lid where the adhering portion is not provided;
when the semiconductor device includes the first concave portion, the communicating portion includes a third space defined by the first concave portion;
when the semiconductor device includes the second concave portion, the communicating portion includes a fourth space defined by the second concave portion; and
in plan view, the first space, the second space, the third space, and the fourth space do not overlap one another.

11. The semiconductor device according to claim 1 , further comprising:
a circuit element mounted on the upper surface of the base substrate; and
a connector electrically connecting the circuit element and the detector together.

12. An electronic apparatus comprising:
the semiconductor device according to claim 1 ;
an O ring surrounding the protruding portion of the resin package of the semiconductor device in plan view and including an inner circumferential portion in contact with the outer side surface of the protruding portion; and
a casing to which the semiconductor device is attached.

13. The electronic apparatus according to claim 12 , wherein the communicating portion includes a space defined by a slit located inward of the outer circumferential portion of the lid in plan view.

14. The electronic apparatus according to claim 13 , wherein the slit is at a position outside of the pressure detector in plan view.

15. The electronic apparatus according to claim 13 , wherein the slit includes:
a wide portion at least a portion of which overlaps the cavity in plan view; and
a narrow portion connected to the wide portion and not overlapping the cavity in plan view.

16. The electronic apparatus according to claim 13 , wherein the lid includes three or more of the slits.

17. The electronic apparatus according to claim 12 , further comprising:
an adhering portion interposed partially between the upper surface of the protruding portion and the lid to fix the lid to the protruding portion; wherein
the communicating portion includes a space between the upper surface of the protruding portion and the lid which are opposed to each other in a portion between the upper surface of the protruding portion and the lid where the adhering portion is not interposed.

18. The electronic apparatus according to claim 12 , wherein
the protruding portion includes a first conc

Assignees

• Murata Manufacturing Co

Inventors

• Yoshida Yoshihiro

Classifications

• G01L9/0041

  Transmitting or indicating the displacement of flexible diaphragms · CPC title

• B81B7/0061

  suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound · CPC title

• B81B2201/0264

  Pressure sensors · CPC title

• G01L9/0002

  using variations in ohmic resistance (G01L9/0051 takes precedence) · CPC title

• G01L19/0038 Primary

  being part of the housing (other details about the housing G01L19/14) · CPC title