Apparatus for a micro-LED display

Patent metadata

Field	Value
Publication number	US-12380834-B2
Application number	US-202217710098-A
Country	US
Kind code	B2
Filing date	Mar 31, 2022
Priority date	Mar 31, 2022
Publication date	Aug 5, 2025
Grant date	Aug 5, 2025

Abstract

Apparatus, methods, and articles of manufacture for a micro-LED display are disclosed. An example apparatus for a micro-LED display includes a substrate, a micro-LED matrix on a first side of the substrate, a driver circuit on a second side of the substrate, the second side opposite the first side, and a conductive path in the substrate to extend between the first side and the second side to electrically couple the micro-LED matrix to the driver circuit.

First claim

What is claimed is:

1. An apparatus for a micro-light emitting diode (micro-LED) display, the apparatus comprising:
a substrate;
a micro-LED matrix on a first side of the substrate;
a matrix driver circuit on a second side of the substrate, the second side opposite the first side;
at least one of an assist driver circuit or a timing controller on the second side of the substrate;
a first conductive path in the substrate to extend between the first side and the second side to electrically couple the micro-LED matrix to the matrix driver circuit; and
a second conductive path in the substrate to electrically couple the at least one of the assist driver circuit or the timing controller to the matrix driver circuit.

2. The apparatus of claim 1 , wherein the substrate is a polyimide substrate.

3. The apparatus of claim 1 , wherein the matrix driver circuit is to control a plurality of pixels of the micro-LED display.

4. The apparatus of claim 1 , further including a package resin layer to envelop the micro-LED matrix.

5. The apparatus of claim 1 , wherein the matrix driver circuit is a first matrix driver circuit to control operation of first LEDs in the micro-LED matrix, further including a second matrix driver circuit on the second side of the substrate, the second matrix driver circuit to control operation of second LEDs in the micro-LED matrix.

6. The apparatus of claim 1 , further including a second substrate coupled to the first side of the substrate, the first side of the substrate facing a third side of the second substrate, the micro-LED matrix coupled to a fourth side of the second substrate, the fourth side opposite the third side, the second substrate to electrically couple the micro-LED matrix to the matrix driver circuit.

7. The apparatus of claim 1 , further including:
a first contact pad on the first side of the substrate, the first contact pad to protrude from the first side of the substrate; and
a second contact pad on the second side of the substrate, the second contact pad substantially level with the second side of the substrate, the first conductive path coupled between the first contact pad and the second contact pad.

8. The apparatus of claim 1 , wherein the micro-LED matrix is a first micro-LED matrix, the matrix driver circuit is a first matrix driver circuit, further including:
a second micro-LED matrix on the first side of the substrate;
a second matrix driver circuit on the second side of the substrate;
a second substrate disposed between the first micro-LED matrix and the substrate, the substrate and the second substrate to electrically couple the first matrix driver circuit to the first micro-LED matrix; and
a third substrate disposed between the second micro-LED matrix and the substrate, the substrate and the third substrate to electrically couple the second matrix driver circuit to the second micro-LED matrix.

9. An apparatus for a micro-light emitting diode (micro-LED) display, the apparatus comprising:
a polyimide substrate;
a micro-LED matrix on a first side of the polyimide substrate;
a driver circuit on a second side of the polyimide substrate; and
a printed circuit board coupled to the second side of the polyimide substrate, the second side of the polyimide substrate facing a third side of the printed circuit board, the driver circuit coupled to a fourth side of the printed circuit board opposite the third side, the polyimide substrate and the printed circuit board to electrically couple the driver circuit to micro-LEDs of the micro-LED matrix.

10. An apparatus for a micro-light emitting diode (micro-LED) display, the apparatus comprising:
a first substrate;
a first micro-LED matrix on a first side of the first substrate;
a driver circuit on a second side of the first substrate;
a second substrate coupled to the second side of the first substrate, the second side of the first substrate facing a third side of the second substrate, the driver circuit coupled to a fourth side of the second substrate opposite the third side, the first substrate and the second substrate to electrically couple the driver circuit to micro-LEDs of the first micro-LED matrix; and
a second micro-LED matrix coupled to a third substrate on the third side of the second substrate.

11. The apparatus of claim 10 , wherein the driver circuit is a first matrix driver circuit and the micro-LEDs are first micro-LEDs, further including a second matrix driver circuit on the fourth side of the second substrate, the second substrate to electrically couple the second matrix driver circuit to second micro-LEDs of the second micro-LED matrix.

12. An apparatus, comprising:
an array of micro-light emitting diodes (micro-LEDs);
an integrated circuit (IC) chip to drive micro-LEDs in the array of micro-LEDs;
a substrate disposed between the array of micro-LEDs and the IC chip, the substrate to electrically couple the array of micro-LEDs and the IC chip;
a first contact pad on a first side of the substrate, the first contact pad to protrude from a first surface of the substrate;
a second contact pad on a second side of the substrate, the second contact pad substantially level with a second surface of the substrate; and
a conductive path in the substrate, the conductive path coupled between the first contact pad and the second contact pad.

13. The apparatus of claim 12 , wherein the IC chip is a first IC chip and the array of micro-LEDs is a first array of micro-LEDs, further including a second IC chip to drive micro-LEDs in a second array of micro-LEDs, the substrate disposed between the second array of micro-LEDs and the second IC chip.

14. The apparatus of claim 13 , wherein the substrate is a first substrate, further including:
a second substrate disposed between the first array of micro-LEDs and the first substrate; and
a third substrate disposed between the second array of micro-LEDs and the first substrate.

15. An apparatus comprising:
a first array of micro-light emitting diodes (micro-LEDs) and a second array of micro-LEDs;
a first integrated circuit (IC) chip to drive first micro-LEDs in the first array of micro-LEDs;
a second IC chip to drive second micro-LEDs in the second array of micro-LEDs;
a first substrate disposed between the first array of micro-LEDs and the first IC chip and between the second array of micro-LEDs and the second IC chip;
a second substrate disposed between the first array of micro-LEDs and the first substrate, the first substrate and the second substrate to electrically couple the first array of micro-LEDs and the first IC chip; and
a third substrate disposed between the second array of micro-LEDs and the first substrate, the first substrate and the third substrate to electrically couple the second array of micro-LEDs and the second IC chip.

16. The apparatus of claim 15 , wherein the first substrate is a printed circuit board and the second and third substrates include a polyimide material.

17. The apparatus of claim 15 , further including:
a first contact pad on a first side of the second substrate, the first contact pad to protrude from the first side of the second substrate;
a second contact pad on a second side of the second substrate opposite the first side, the second contact pad substantially level with the second side of the second substrate; and
a conductive path in the second substrate, the conductive path coupled between the first contact pad and the second contact pad.

18. An apparatus for a micro-light emitting diode (micro-LED) display, the apparatus comprising:
a first su

Assignees

• Intel Corp

Inventors

• Xi Peng-Bo
• Liu Yi-Chuan
• Tsai Jackson

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/0364

  of interconnections · CPC title

• H10H20/0362

  of encapsulations · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title