Package imaging for die location correction in digital lithography

Patent metadata

Field	Value
Publication number	US-12379676-B2
Application number	US-202217693356-A
Country	US
Kind code	B2
Filing date	Mar 12, 2022
Priority date	Mar 12, 2022
Publication date	Aug 5, 2025
Grant date	Aug 5, 2025

Abstract

Actual physical locations of dies on a substrate package may be identified without using a full metrology scan of the substrate. Instead, one or more cameras may be used to efficiently locate the approximate location of any of the alignment features based on their expected positioning in the design file for the packages are substrate. The cameras may then be moved to locations where alignment features should be, and images may be captured to determine the actual location of the alignment feature. These actual locations of the alignment features may then be used to identify coordinates for the dies, as well as rotations and/or varying heights of the dies on the packages. A difference between the expected location from the design file and the actual physical location may be used to adjust instructions for the digital lithography system to compensate for the misalignment of the dies.

First claim

What is claimed is:

1. A system comprising:
a first semiconductor processing station comprising:
one or more cameras; and
a first controller configured to perform first operations comprising:
receiving first locations for a plurality of dies on a substrate from a design file of the substrate;
causing the one or more cameras to capture images of the plurality of dies at the first locations;
determining, based on the images of the dies at the first locations, second locations for the plurality of dies associated with actual locations of the plurality of dies on the substrate; and
determining differences between the first locations and the second locations; and

a second semiconductor processing station that is separate and distinct from the first semiconductor processing station and configured to receive the substrate after images are captured by the first semiconductor processing station, the second semiconductor processing station comprising:
a digital lithography system; and
a second controller configured to perform second operations comprising:
generating or adjusting instructions for the digital lithography system to change trace routes between the plurality of dies to compensate for the differences between the first locations and the second locations; and
causing the digital lithography system to execute a digital lithography process on the substrate using the instructions to form the trace routes between connections on first sides of the plurality of dies, wherein the first sides are opposite second sides of the plurality of dies that are mounted to the substrate.

2. The system of claim 1 , wherein the one or more cameras comprises a plurality of cameras.

3. The system of claim 2 , wherein the first operations further comprise:
receiving a number of dies in rows on the substrate; and
causing the plurality of cameras to be spaced such that the plurality of cameras are arranged in rows and spaced based on the number of dies in the rows on the substrate.

4. The system of claim 3 , wherein the first operations further comprise:
receiving a number of dies in columns on the substrate; and
causing the plurality of cameras to be spaced such that the plurality of cameras are also arranged in columns and spaced based on the number of dies in the columns on the substrate.

5. The system of claim 1 , further comprising a robotic arm that moves the substrate between the first semiconductor processing station and the second semiconductor processing station.

6. The system of claim 1 , further comprising one or more displacement sensors located with the one or more cameras that are configured to measure a distance between the one or more cameras and the substrate at the locations where the one or more cameras capture the images of the plurality of dies at the first locations.

7. The system of claim 6 , wherein the first operations further comprise:
determining the distance between the one or more cameras and the substrate; and
adjusting a focus of the one or more cameras based on the distance.

8. The system of claim 1 , wherein the differences between the first locations and the second locations of the plurality of dies result from a misalignment when the plurality of dies are adhered to the substrate.

9. One or more non-transitory computer-readable media comprising instructions that, when executed by one or more processors, cause the one or more processors to perform operations comprising:
receiving first locations for a plurality of dies on a substrate from a design file of the substrate;
causing one or more cameras to capture images of the plurality of dies at the first locations;
determining, based on the images of the dies at the first locations, second locations for the plurality of dies associated with actual locations of the plurality of dies of the substrate;
determining differences between the first locations and the second locations; and
causing instructions for a digital lithography station to be generated or adjusted to change trace routes between the plurality of dies to compensate for the differences between the first locations and the second locations, wherein the trace routes run between connections on first sides of the plurality of dies that are opposite second sides of the plurality of dies that are mounted to the substrate.

10. The one or more non-transitory computer-readable media of claim 9 , wherein the first locations comprise expected locations of alignment features on the plurality of dies.

11. The one or more non-transitory computer-readable media of claim 10 , wherein the second locations comprise actual locations of the alignment features on the plurality of dies after being mounted to a substrate.

12. The one or more non-transitory computer-readable media of claim 9 , wherein the one or more cameras comprises one or more lines scan cameras configured to perform a line scan capture of the images of the dies.

13. The one or more non-transitory computer-readable media of claim 12 , wherein the images of the dies comprise a line scan along lines where the first locations indicate locations of alignment features on the plurality of dies.

14. The one or more non-transitory computer-readable media of claim 9 , wherein the operations further comprise causing the one or more cameras to capture images of one or more global alignment features on the substrate to align the substrate.

15. A method of adjusting digital lithography to compensate for die placement errors, the method comprising:
receiving first locations for a plurality of dies on a substrate from a design file of the substrate;
causing one or more cameras to capture images of the plurality of dies at the first locations;
determining, based on the images of the dies at the first locations, second locations for the plurality of dies associated with actual locations of the plurality of dies of the substrate;
determining differences between the first locations and the second locations; and
causing instructions for a digital lithography station to be generated or adjusted to change trace routes between the plurality of dies to compensate for the differences between the first locations and the second locations, wherein the trace routes run between connections on first sides of the plurality of dies that are opposite second sides of the plurality of dies that are mounted to the substrate.

16. The method of claim 15 , wherein the first locations indicate a bevel edge or die corner of one of the plurality of dies.

17. The method of claim 15 , further comprising updating a universal metrology file with X/Y coordinates of the actual locations of the plurality of dies on the substrate.

18. The method of claim 15 , wherein an image in the images of the plurality of dies comprises a field of view that captures a plurality of the first locations in the image.

19. The method of claim 15 , further comprising maximizing fields of view of the one or more cameras such that a resolution of the one or more cameras is still able to accurately identify the second locations.

20. The method of claim 15 , wherein the one or more cameras comprises a plurality of cameras that are spaced based on fields of view of the plurality of cameras.

Assignees

• Applied Materials Inc

Inventors

• Mueller Ulrich
• Wang Hsiu-Jen
• Kuo Shih-Hao
• Chen Jang Fung

Classifications

• G01B11/272

  using photoelectric detection means · CPC title

• G03F7/70441

  Optical proximity correction [OPC] · CPC title

• G03F7/70508

  Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus · CPC title

• G03F7/70291 Primary

  Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices · CPC title

• G03F9/7003 Primary

  Alignment type or strategy, e.g. leveling, global alignment · CPC title