Regenerating method of removal liquid and regenerated removal liquid preliminary

US12371798B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12371798-B2
Application numberUS-202117998980-A
CountryUS
Kind codeB2
Filing dateNov 16, 2021
Priority dateNov 24, 2020
Publication dateJul 29, 2025
Grant dateJul 29, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1):where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.

First claim

Opening claim text (preview).

The invention claimed is: 1. A regenerating method of a removal liquid comprising: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1): where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and some of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom. 2. The regenerating method according to claim 1 , the functional group is a bis(2-pyridylmethyl)amino group. 3. A regenerated removal liquid used in a semi-additive method obtained by the regenerating method according to claim 1 , the regenerated removal liquid comprising: a pyridine-based compound that includes the functional group represented by the following formula (1): chloride ions; and copper ions, wherein the pyridine-based compound is present at a concentration of more than 0 ppm and 5,000 ppm or less, the copper ions are present at a concentration of 1 ppm or more and 2,000 ppm or less, and a pH of the regenerated removal liquid is 1 or less.

Assignees

Inventors

Classifications

  • the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

  • C23F1/46Primary

    Regeneration of etching compositions · CPC title

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What does patent US12371798B2 cover?
A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal l…
Who is the assignee on this patent?
Sumitomo Electric Industries, Sumitomo Electric Printed Circuits Inc, Mec Co Ltd
What technology area does this patent fall under?
Primary CPC classification C23F1/46. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 29 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).