Metallocene polyolefin based low activation temperature heat seal hot melt adhesive

Patent metadata

Field	Value
Publication number	US-12371595-B2
Application number	US-201615004312-A
Country	US
Kind code	B2
Filing date	Jan 22, 2016
Priority date	Jan 23, 2015
Publication date	Jul 29, 2025
Grant date	Jul 29, 2025

Abstract

A low activation temperature heat seal hot melt adhesive for packaging applications based on a blend of metallocene catalyzed polyolefin polymer, tackifying resin, wax and other optional additives. In order to achieve the high viscosity suitable for an extrusion heat seal application, the adhesive composition of the invention is highly loaded with polymer, and thus should have a viscosity of about 50,000 centipoise or more measured at a temperature of 300° F. Accordingly, the hot melt adhesive composition contains about 50% to about 90% by weight of metallocene catalyzed polyolefin polymer, about 5% to about 50% by weight of tackifying resin, about 0.5% to about 40% by weight of wax, about 0.1% to about 5% by weight of a stabilizer or antioxidant, and 0% to about 25% by weight of optional additives. The hot melt adhesive composition must have an activation temperature of about 160° F. or less, and provide a minimum peel force of about 1.0 pound per inch in order to meet the sealing performance requirements for packaging food and other consumer goods.

First claim

The invention claimed is:

1. A low activation temperature hot melt adhesive for packaging applications, comprising:
a) about 50% to about 90% by weight of a metallocene catalyzed polyolefin polymer having: a density of 0.900 g/cc or less according to ASTM D792; a melt enthalpy of 70 Joules/gram or less; and a melt index of 1 g/10 min to 35 g/10 min as measured in accordance with ASTM D1238 for 10 min with a weight of 2.16 kg, and at 190° C.;
b) about 5% to about 50% by weight of a tackifying resin;
c) about 0.5% to about 40% by weight of a wax, wherein the wax is selected from the group consisting of a paraffin wax having a melting point between about 130° F. to about 170° F., a microcrystalline wax having a melting point between about 135° F. to about 200° F., and a hard wax having a melting point below about 105° C., wherein the melting point is determined by ASTM method D127-60;
d) about 0.1% to about 5% by weight of a stabilizer or antioxidant; and

wherein the adhesive has an activation temperature of 160° F. or less, and has a viscosity of greater than 50,000 centipoise at 300° F.

2. The hot melt adhesive of claim 1 wherein the metallocene catalyzed polyolefin polymer is a copolymer of ethylene with C 4 to C 10 -alpha-olefins.

3. The hot melt adhesive of claim 2 wherein the metallocene catalyzed polyolefin polymer is an ethylene/octene copolymer.

4. The hot melt adhesive of claim 1 comprising about 55% to about 70% by weight of the metallocene catalyzed polyolefin polymer.

5. The hot melt adhesive of claim 1 wherein the tackifying resin has a softening point of from about 80° C. to about 140° C.

6. The hot melt adhesive of claim 5 wherein said tackifying resin is a non-polar tackifying resin.

7. The hot melt adhesive of claim 1 comprising about 5% to about 30% by weight of the wax.

8. The hot melt adhesive of claim 7 wherein said wax is the paraffin wax.

9. An article comprising the adhesive of claim 1 .

10. The article of claim 9 which is a multilayer film laminate.

11. The article of claim 10 wherein one layer of said laminate is a polyolefin film.

12. The article of claim 11 wherein said polyolefin film is a polyethylene film.

13. The article of claim 9 which is a foodstuffs package.

14. The hot melt adhesive of claim 1 wherein the metallocene catalyzed polyolefin polymer comprises the highest molecular weight component in the hot melt adhesive.

15. A low activation temperature hot melt adhesive for packaging applications, consisting essentially of:
a) about 50% to about 90% by weight of a metallocene catalyzed polyolefin polymer having: a density of 0.900 g/cc or less according to ASTM D792; a melt enthalpy of 70 Joules/gram or less; and a melt index of 1 g/10 min to 35 g/10 min as measured in accordance with ASTM D1238 for 10 min with a weight of 2.16 kg, and at 190° C.;
b) about 5% to about 50% by weight of a tackifying resin;
c) about 0.5% to about 40% by weight of a wax, wherein the wax is selected from the group consisting of a paraffin wax having a melting point between about 130° F. to about 170° F., a microcrystalline wax having a melting point between about 135° F. to about 200° F., and a hard wax having a melting point below about 105° C., wherein the melting point is determined by ASTM method D127-60;
d) about 0.1% to about 5% by weight of a stabilizer or antioxidant; and
e) 0 to 25% by weight of additives selected from colorants, fillers, crosslinking agents, nucleating agents, reactive compounds, fire-retardant mineral or organic agents, ultraviolet light (UV) absorbing agents and UV fluorescing agents;
wherein the adhesive has an activation temperature of 160° F. or less, and has a viscosity of greater than 50,000 centipoise at 300° F.

16. The hot melt adhesive of claim 1 comprising about 55% to about 80% by weight of the metallocene catalyzed polyolefin polymer.

17. The hot melt adhesive of claim 1 wherein the weight of the tackifying resin comprises about 10% to about 40%.

18. The hot melt adhesive of claim 15 wherein the metallocene catalyzed polyolefin polymer comprises the highest molecular weight component in the hot melt adhesive.

Assignees

• Bostik Inc

Inventors

• Kanderski Monina D
• Vitrano Michael D

Classifications

• B32B2439/70

  Food packaging · CPC title

• B32B2250/242

  All polymers belonging to those covered by group B32B27/32 · CPC title

• B32B27/327

  comprising polyolefins obtained by a metallocene or single-site catalyst · CPC title

• B32B27/32

  comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} · CPC title

• B32B27/08

  of synthetic resin · CPC title