Photonics optoelectrical system

US12366705B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12366705-B2
Application numberUS-202318151900-A
CountryUS
Kind codeB2
Filing dateJan 9, 2023
Priority dateNov 21, 2018
Publication dateJul 22, 2025
Grant dateJul 22, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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There is set forth herein a method including building a first photonics structure using, wherein the building the first photonics structure includes fabricating one or more photonics device.

First claim

Opening claim text (preview).

What is claimed is: 1. An optoelectrical system, comprising: a first photonics structure having a first photonics dielectric stack; a second photonics structure having a second photonics dielectric stack; one or more metallization layers integrally formed in the first photonics dielectric stack; one or more first photonics devices integrally formed in the first photonics dielectric stack; at least one metallization layer integrally formed in the second photonics dielectric stack; at least one second photonics device integrally formed in the second photonics dielectric stack; one or more laser stack structures formed in the second photonics dielectric stack, each laser stack structure including a buffer structure, and each laser stack structure having a bottom contact structure thereof; and an extended dielectric stack region of the second photonics dielectric stack including a contact extending therethrough to contact at least one bottom contact structure of a laser stack structure, and the extended dielectric stack region further including a termination in electrical communication with the contact. 2. The system of claim 1 , comprising: a first waveguide integrally formed in the second photonics dielectric stack, the waveguide being edge coupled to an active region of a laser stack structure of the one or more laser stack structures integrally formed in the second photonics dielectric stack; a monocrystalline waveguide integrally fabricated within the first photonics dielectric stack; and a plurality of intermediary waveguides configured to evanescently couple light from the first waveguide to the monocrystalline waveguide. 3. The system of claim 1 , wherein the one or more first photonics devices includes at least one waveguide, and wherein the at least one second photonics device includes at least one waveguide. 4. The system of claim 1 , wherein the buffer structure is includes a layer of Ge. 5. The system of claim 4 , wherein the buffer structure includes a layer of GaAs. 6. The system of claim 5 , wherein the buffer structure is epitaxially grown. 7. The system of claim 1 , wherein each of the one or more laser stack structures includes plurality of buffer structures. 8. The system of claim 1 , wherein the buffer structure is comprised of one or more III-V material. 9. An optoelectrical system, comprising: a first photonics structure having a first photonics dielectric stack; a second photonics structure having a second photonics dielectric stack; a bond layer that fusion bonds the first photonics structure to the second photonics structure; one or more first metallization layers integrally formed in the first photonics dielectric stack; at least one second metallization layer integrally formed in the second photonics dielectric stack; one or more first photonics device integrally formed in the first photonics dielectric stack; at least one second photonics device integrally formed in the second photonics dielectric stack; one or more laser stack structures formed in the second photonics dielectric stack, each laser stack structure including a buffer structure, and each laser stack structure having a bottom contact structure thereof; an extended dielectric stack region of the second photonics dielectric stack including a contact extending therethrough to contact at least one bottom contact structure of a laser stack structure, and the extended dielectric stack region further including a termination in electrical communication with the contact; and a waveguide integrally formed in the second photonics dielectric stack, the waveguide being edge-coupled to one of the one or more laser stack structures. 10. The system of claim 9 , wherein the buffer structure is includes a layer of Ge. 11. The system of claim 9 , comprising: a first waveguide integrally formed in the second photonics dielectric stack, the waveguide being edge coupled to an active region of a laser stack structure of the one or more laser stack structures integrally formed in the second photonics dielectric stack; a monocrystalline waveguide integrally fabricated within the first photonics dielectric stack; and a plurality of intermediary waveguides configured to evanescently couple light from the first waveguide, through the bond layer, to the monocrystalline waveguide. 12. An optoelectrical system, comprising: a first photonics structure having a first photonics dielectric stack; a second photonics structure having a second photonics dielectric stack; one or more metallization layers integrally formed in the first photonics dielectric stack; one or more first photonics devices integrally formed in the first photonics dielectric stack; at least one metallization layer integrally formed in the second photonics dielectric stack; at least one second photonics device integrally formed in the second photonics dielectric stack; one or more laser stack structures formed in the second photonics dielectric stack, each laser stack structure having a bottom contact structure thereof; and an extended dielectric stack region of the second photonics dielectric stack including a contact extending therethrough to contact at least one bottom contact structure of a laser stack structure, and the extended dielectric stack region further including a termination in electrical communication with the contact. 13. The system of claim 12 , each laser stack structure including at least one light-confining structure. 14. The system of claim 13 , wherein the light-confining structure is epitaxially grown. 15. The system of claim 13 , wherein the one or more laser stack structures further include a buffer structure, a contact structure on the buffer structure, and wherein the light-confining structure is on the contact structure. 16. The system of claim 15 , where the one or more laser stack structures further includes an active region on a first light-confining structure, a mode selection structure on the active region, and a second light-confining on the mode selection structure. 17. The system of claim 13 , wherein the light-confining structure is at least one cladding structure. 18. The system of claim 13 , wherein the light-confining structure is n-doped and comprised of AlGaAs, GaInP or a combination thereof. 19. The system of claim 12 , comprising: a first waveguide integrally formed in the second photonics dielectric stack, the waveguide being edge coupled to an active region of a laser stack structure of the one or more laser stack structures integrally formed in the second photonics dielectric stack; a monocrystalline waveguide integrally fabricated within the first photonics dielectric stack; and a plurality of intermediary waveguides configured to evanescently couple light from the first waveguide to the monocrystalline waveguide. 20. The system of claim 12 , wherein the one or more laser stack structures further include a buffer structure.

Assignees

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Classifications

  • Subject matter not provided for in other groups of this subclass · CPC title

  • Bond pads specially adapted therefor · CPC title

  • relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title

  • Bond pads having multiple stacked layers · CPC title

  • characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers · CPC title

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What does patent US12366705B2 cover?
There is set forth herein a method including building a first photonics structure using, wherein the building the first photonics structure includes fabricating one or more photonics device.
Who is the assignee on this patent?
Univ New York State Res Found, The Res Foundation For The State Univeristy Of Newyork
What technology area does this patent fall under?
Primary CPC classification G02B6/12004. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 22 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).