Thermosetting thermally conductive dielectric composite

Patent metadata

Field	Value
Publication number	US-12362080-B2
Application number	US-202117788807-A
Country	US
Kind code	B2
Filing date	Jan 13, 2021
Priority date	Jan 15, 2020
Publication date	Jul 15, 2025
Grant date	Jul 15, 2025

Abstract

In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.

First claim

What is claimed is:

1. A dielectric composite comprising:
a thermoset epoxy resin;
a reinforcing layer;
greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer;
3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer;
an epoxy silane;
an accelerator; and
a de-aerator;
wherein the hexagonal boron nitride comprising a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates; wherein a volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets is 1:1.5 to 4:1;
wherein the plurality of hexagonal boron nitride platelets has a D 10 particle size by volume of less than or equal to 6 micrometers, a D 50 particle size by volume of 7 to 18 micrometers, and a D 90 particle size by volume of greater than or equal to 20 micrometers;
wherein the plurality of hexagonal boron nitride agglomerates has a D 10 particle size by volume of 20 to 50 micrometers, a D 50 particle size by volume of 50 to 80 micrometers, and a D 90 particle size by volume of 90 to 140 micrometers.

2. The dielectric composite of claim 1 , wherein the dielectric composite has at least one of
a peel strength to copper of greater than or equal to 0.7 kilograms per centimeter measured in accordance with IPC test method 650, 2.4.8 for copper-clad laminate as-received (AR) or after applying a thermal stress (AS) by heating laminate test specimens to a temperature of 288° C. for 10 seconds;
a thermal conductivity in the z-axis of greater than or equal to 1.8 watts per meter Kelvin as measured in accordance with ASTM E1461-13 or ASTM D5470-12; or
a resin flow of 12.5 to 25.5 millimeters as determined by measuring the overflow of partially cured resin which has been b-staged for 3 minutes at 145° C. and pressed at a pressure of 1.4 megapascals and a temperature of 171° C.

3. The dielectric composite of claim 1 , wherein the thermoset epoxy resin comprises a residue of at least one of
an epoxy functional phenol-formaldehyde novolac; or
a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) functional bisphenol A Phenol-Formaldehyde novolac.

4. The dielectric composite of claim 1 , wherein the thermoset epoxy resin comprises a residue of a modified with a butadiene-acrylonitrile, for example, that is modified with a carboxyl-terminated butadiene acrylonitrile (CTBN).

5. The dielectric composite of claim 1 , wherein the dielectric composite comprises 40 to 50 volume percent percent of the thermoset epoxy resin based on the total volume of the dielectric composite minus the reinforcing fabric.

6. The dielectric composite of claim 1 , wherein the fused silica is spherical, having an average particle diameter of 5 to 10 micrometers.

7. The dielectric composite of claim 1 , wherein the dielectric composite comprises 0.5 to 2 weight percent of the epoxy silane based on the total weight of the dielectric composite minus the reinforcing fabric.

8. The dielectric composite of claim 1 , wherein the dielectric composite comprises 0.001 to 1 weight percent of the accelerator based on the total weight of the dielectric composite minus the reinforcing fabric.

9. The dielectric composite of claim 1 , wherein the accelerator comprises at least one of an alkyl-imidazole or an aryl-imidazole.

10. The dielectric composite of claim 1 , wherein the dielectric composite comprises 0.1 to 1 weight percent of the de-aerator based on the total weight of the dielectric composite minus the reinforcing fabric.

11. The dielectric composite of claim 1 , wherein the dielectric composite comprises the reinforcing fabric in an amount of 5 to 20 weight percent based on the total weight of the dielectric composite.

12. The dielectric composite of claim 1 , wherein the reinforcing layer comprises a plain-weave fabric that comprises at least one of E glass fibers or L glass fibers or quartz fibers.

13. The dielectric composite of claim 1 , wherein the reinforcing layer comprises a spread-weave fabric that comprises at least one of E glass fibers or L glass fibers or quartz fibers.

14. The dielectric composite of claim 1 , further comprising at least one of a curing agent, an additional dielectric filler, or a halogen free flame retardant.

15. The dielectric composite of claim 1 , wherein the dielectric composite is a prepreg having a thickness of 1 to 1,000 micrometers; and wherein the thermoset is only partially cured.

16. A multilayer article comprising: a dielectric layer comprising the dielectric composite of claim 1 ; and at least one electrically conductive layer disposed on a surface of the dielectric layer.

17. A dielectric composite comprising:
5 to 20 weight percent of a glass reinforcing layer based on the total weight of the dielectric composite;
40 to 50 volume percent of a thermoset epoxy resin based on the total volume of the dielectric composite minus the glass reinforcing fabric; wherein the thermoset epoxy resin comprises an epoxy functional phenol-formaldehyde novolac and a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) functional bisphenol A Phenol-Formaldehyde novolac;
greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer;
3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the glass reinforcing layer; wherein the fused silica has an average particle size of 5 to 10 micrometers;
0.5 to 2 weight percent of an epoxy silane based on the total weight of the dielectric composite minus the glass reinforcing fabric;
0.001 to 1 weight percent of an aryl-imidazole accelerator based on the total weight of the dielectric composite minus the glass reinforcing fabric; and
0.1 to 1 weight percent of a de-aerator based on the total weight of the dielectric composite minus the glass reinforcing fabric;
wherein the hexagonal boron nitride comprising a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates; wherein a volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets is 1:1.5 to 4:1;
wherein the plurality of hexagonal boron nitride platelets has a D 10 particle size by volume of less than or equal to 6 micrometers, a D 50 particle size by volume of 7 to 18 micrometers, and a D 90 particle size by volume of greater than or equal to 20 micrometers;
wherein the plurality of hexagonal boron nitride agglomerates has a D 10 particle size by volume of 20 to 50 micrometers, a D 50 particle size by volume of 50 to 80 micrometers, and a D 90 particle size by volume of 90 to 140 micrometers.

18. A method of making the dielectric composite of claim 1 , comprising:
forming a thermosetting composition comprising an epoxy monomer, a curing agent, the hexagonal boron nitride, the fused silica, the epoxy silane, the accelerator, and the de-aerator;
coating the reinforcing fabric with the thermosetting composition; and
at least partially curing the thermosetting composition to form the dielectric composite.

19. The method of claim 18 , further comprising laminating the dielectric composite with at least one electrically conductive layer.

20. The method of claim 19 , wherein the laminating occurs at a temperature of 100 to 180 degrees Celsius or a pressure of 1 to 3 megapascal for 60

Assignees

• Rogers Corp

Inventors

• Koes Thomas A

Classifications

• C08K7/14

  Glass · CPC title

• C08K3/38 Primary

  Boron-containing compounds · CPC title

• C08K3/36 Primary

  Silica · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• B32B15/092

  comprising epoxy resins · CPC title