Supply tank, supply device and supply system

Patent metadata

Field	Value
Publication number	US-12347699-B2
Application number	US-202217942520-A
Country	US
Kind code	B2
Filing date	Sep 12, 2022
Priority date	Sep 13, 2021
Publication date	Jul 1, 2025
Grant date	Jul 1, 2025

Abstract

According to one embodiment, provided is a supply tank a supply device, and a supply system that stabilizes the liquid temperature of a process liquid to be supplied to a substrate processing device. A supply tank that supplies a process liquid to a substrate processing device includes a container that stores the process liquid, a first dividing plate that divides the container into a first region where the process liquid is introduced, and a second region that supplies the process liquid to the substrate processing device, first piping that feeds, to the second region, the process liquid introduced in the first region, and a first heater which is provided on a path through the first piping, and which heats the process liquid.

First claim

What is claimed is:

1. A supply tank that supplies a process liquid to a substrate processing device comprising:
a container that stores the process liquid;
a first dividing plate that divides the container into a first region and a second region, collect piping being connected to the first region, the collect piping collecting the process liquid from the substrate processing device after processing of a substrate, the process liquid being introduced into the first region from the substrate processing device via the collect piping, the second region supplying the process liquid to the substrate processing device;
first piping that feeds, to the second region, the process liquid introduced in the first region;
a first heater which is provided on a path through the first piping, and which heats the process liquid; and
a second dividing plate that divides the second region into a third region where the process liquid is fed from the first piping, and a fourth region that supplies the process liquid to the substrate processing device,
wherein:
the first dividing plate is provided on one side of the container to which the end of the first dividing plate is connected, and is provided with an opening which causes the first region and the second region to be in communication with each other; and
the second dividing plate is provided at an other side-surface side that is an opposite side to the one side surface of the container, and is provided with an opening which causes the third region and the fourth region to be in communication with each other.

2. The supply tank according to claim 1 , wherein the first piping is provided near the opening of the first dividing plate in the second region.

3. The supply tank according to claim 1 , further comprising:
a third dividing plate that divides the fourth region into a fifth region which is in communication with the third region through the opening of the second dividing plate, and a sixth region that supplies the process liquid to the substrate processing device; and
second piping that feeds the process liquid in the fifth region to the sixth region,
wherein:
the third dividing plate is provided with an opening through which the process liquid flows in the fifth region; and
an upper end of the third dividing plate is located at a position higher than a liquid level off the process liquid in the fifth region and at a position lower than an upper end of the side surface of the container.

4. A supply device comprising:
the supply tank according to claim 1 ;
supply piping that supplies, to the substrate processing device, the process liquid in the second region; and
a second heater which is provided on a path through the supply piping and which heats the process liquid.

5. The supply device according to claim 4 , further comprising return piping which is branched from the supply piping and which introduces the process liquid in the container.

6. A supply system comprising:
the supply device according to claim 4 ;
a substrate processing device that processes a substrate by the process liquid; and
the collect piping which collects, from the substrate processing device, the process liquid after the substrate is processed, and which introduces the collected liquid in the first region of the container.

7. The supply system according to claim 6 , wherein the collect piping is provided, in the container, at the other side-surface side which is an opposite side to the one side surface of the container where the opening of the first dividing plate is located.

Assignees

• Shibaura Mechatronics Corp

Inventors

• Furuya Masaaki
• Kobayashi Hiroaki
• Mori Hideki

Classifications

• H10P72/0424 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0434

  mainly by convection · CPC title