Magnetic sensor

Patent metadata

Field	Value
Publication number	US-12345782-B2
Application number	US-202217952362-A
Country	US
Kind code	B2
Filing date	Sep 26, 2022
Priority date	Sep 29, 2021
Publication date	Jul 1, 2025
Grant date	Jul 1, 2025

Abstract

A die pad, a signal processing IC, an adhesive layer, and at least one magnetoelectric conversion element included in a magnetic sensor are encapsulated by a molding resin. At least a part of the first end surface of the signal processing IC is positioned on a side closer to the at least one magnetoelectric conversion element than a first end surface of the die pad on a side of the at least one magnetoelectric conversion element in a plan view. An isolation portion into which the molding resin enters is provided between the first surface of the die pad on a side of the first end surface, and the first surface of the signal processing IC on a side of the first end surface, and a thickness of the isolation portion is smaller than a thickness of the die pad.

First claim

What is claimed is:

1. A magnetic sensor, comprising:
a die pad;
a signal processing IC arranged facing a first surface of the die pad;
an adhesive layer comprising a die-attach film arranged between the first surface of the die pad and a first surface of the signal processing IC facing the die pad; and
at least one magnetoelectric conversion element which is arranged facing a first end surface of the signal processing IC, and which is for detecting a magnetic field in a particular direction, wherein
the die pad, the signal processing IC, the adhesive layer, and the at least one magnetoelectric conversion element are encapsulated by a molding resin,
the die pad having a stepped shape or a concave shape that is downward sloping away from the signal processing IC, the stepped shape or the concave shape forming an isolation portion located between the first surface of the die pad and the adhesive layer, the isolation portion being an opening between the die pad and the adhesive layer, the isolation portion filled with the molding resin, wherein a thickness of the isolation portion is smaller than a thickness of the die pad, and
at least a part of the first end surface of the signal processing IC extends outwardly beyond, and is parallel to, a first end surface of the die pad in a plan view and is positioned closer to the at least one magnetoelectric conversion element than the first end surface of the die pad having the isolation portion on a side of the at least one magnetoelectric conversion element in the plan view.

2. The magnetic sensor according to claim 1 , wherein at least one end surface of the signal processing IC other than the first end surface of the signal processing IC is arranged perpendicularly to, and above, the first surface of the die pad.

3. The magnetic sensor according to claim 2 , wherein a part of the first surface of the signal processing IC where it adjoins the at least one end surface of the signal processing IC other than the first end surface of the signal processing IC is directly adhered to the first surface of the die pad with the adhesive layer.

4. The magnetic sensor according to claim 1 , further comprising:
a conductor arranged around the at least one magnetoelectric conversion element and configured to have a current flow therein.

5. The magnetic sensor according to claim 4 , wherein the conductor has an opening, and the at least one magnetoelectric conversion element is arranged in the opening.

6. The magnetic sensor according to claim 1 , further comprising:
a conductor arranged around the at least one magnetoelectric conversion element and configured to have a current flow therein, wherein
an end surface of the signal processing IC other than the first end surface of the signal processing IC is arranged perpendicularly to, and above, the first surface of the die pad.

7. The magnetic sensor according to claim 6 , wherein the conductor has an opening, and the at least one magnetoelectric conversion element is arranged in the opening.

8. The magnetic sensor according to claim 6 , wherein a part of the first surface of the signal processing IC where it adjoins the end surface of the signal processing IC other than the first end surface of the signal processing IC is directly adhered to the first surface of the die pad with the adhesive layer.

9. The magnetic sensor according to claim 8 , wherein the conductor has an opening, and the at least one magnetoelectric conversion element is arranged in the opening.

10. The magnetic sensor according to claim 1 , wherein the at least one magnetoelectric conversion element is a plurality of magnetoelectric conversion elements.

11. The magnetic sensor according to claim 1 , wherein
an end surface of the signal processing IC other than the first end surface of the signal processing IC is arranged perpendicularly to, and above, the first surface of the die pad, and
the at least one magnetoelectric conversion element is a plurality of magnetoelectric conversion elements.

12. The magnetic sensor according to claim 11 , wherein a part of the first surface of the signal processing IC where it adjoins the end surface of the signal processing IC other than the first end surface of the signal processing IC is directly adhered to the first surface of the die pad with the adhesive layer.

13. The magnetic sensor according to claim 11 , further comprising:
a conductor arranged around the at least one magnetoelectric conversion element and configured to have a current flow therein.

14. The magnetic sensor according to claim 13 , wherein the conductor has an opening, and the at least one magnetoelectric conversion element is arranged in the opening.

15. The magnetic sensor according to claim 1 , wherein the at least one magnetoelectric conversion element is a hall element.

16. The magnetic sensor according to claim 1 , wherein
an end surface of the signal processing IC other than the first end surface of the signal processing IC is arranged perpendicularly to, and above, the first surface of the die pad, and
the at least one magnetoelectric conversion element is a hall element.

17. The magnetic sensor according to claim 16 , wherein a part of the first surface of the signal processing IC where it adjoins the end surface of the signal processing IC other than the first end surface of the signal processing IC is directly adhered to the first surface of the die pad with the adhesive layer.

18. The magnetic sensor according to claim 16 , further comprising:
a conductor arranged around the at least one magnetoelectric conversion element and configured to have a current flow therein.

19. The magnetic sensor according to claim 18 , wherein the conductor has an opening, and the at least one magnetoelectric conversion element is arranged in the opening.

Assignees

• Asahi Kasei Microdevices Corp

Inventors

• Tanaka Ken
• Kai Kenji
• Ishida Takuya

Classifications

• H10N52/80

  Constructional details · CPC title

• H10N52/00

  Hall-effect devices (integrated devices or assemblies of multiple devices H10N59/00) · CPC title

• H10N59/00

  Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00 (MRAM devices H10B61/00) · CPC title

• G01R15/205

  using magneto-resistance devices, e.g. field plates · CPC title

• G01R15/202

  using Hall-effect devices (Hall elements in arrangements for measuring electrical power G01R21/08) · CPC title