Thermal management devices

Patent metadata

Field	Value
Publication number	US-12342504-B2
Application number	US-202018011484-A
Country	US
Kind code	B2
Filing date	Jul 23, 2020
Priority date	Jul 23, 2020
Publication date	Jun 24, 2025
Grant date	Jun 24, 2025

Abstract

The present disclosure describes thermal management devices. In one example, a thermal management device can include a processing unit, a thermal grease layer directly contacting the processing unit, and a heat pipe. The heat pipe can include a heat pipe interior volume having a working fluid disposed therein, a first exterior surface directly contacting the thermal grease layer, a second exterior surface opposite from the first exterior surface, and side exterior surfaces connecting the first exterior surface and the second exterior surface. The thermal management device can also include a device cover spaced from the second exterior surface of the heat pipe by a distance from greater than 1 mm to about 5 mm, and a bracket having a clamping portion that holds the heat pipe by the side exterior surfaces of the heat pipe. The clamping portion does not extend past the first exterior surface of the heat pipe.

First claim

What is claimed is:

1. A thermal management device comprising:
a processing unit;
a thermal grease layer directly contacting the processing unit;
a heat pipe comprising:
a heat pipe interior volume having a working fluid disposed therein,
a first exterior surface directly contacting the thermal grease layer,
a second exterior surface opposite from the first exterior surface, and
side exterior surfaces connecting the first exterior surface and the second exterior surface;

a device cover spaced from the second exterior surface of the heat pipe by a distance from greater than 1 mm to about 5 mm;
a bracket having a clamping portion that holds the heat pipe by the side exterior surfaces of the heat pipe, wherein a portion of the clamping portion is in direct contact with the thermal grease layer, and wherein a portion of the bracket is in direct contact with a circuit board coupled to the processing unit; and
a heat sink thermally connected to the heat pipe, wherein a portion of the heat sink is in contact with the device cover.

2. The thermal management device of claim 1 , wherein the processing unit is a central processing unit, a graphics processing unit, a signal processor, memory, a hard drive, or a combination thereof.

3. The thermal management device of claim 1 , wherein the processing unit is a central processing unit, wherein the thermal management device further comprises a graphics processing unit and a second thermal grease layer directly contacting the graphics processing unit, and wherein the first exterior surface of the heat pipe directly contacts the second thermal grease layer.

4. The thermal management device of claim 1 , wherein the thermal grease layer has a thickness from about 0.03 mm to about 0.2 mm.

5. The thermal management device of claim 1 , wherein the thermal grease layer comprises a resin and from about 5 wt % to about 30 wt % of a thermally conductive powder.

6. The thermal management device of claim 5 , wherein the resin comprises an acrylic-based resin, a natural rubber-based resin, a styrene-butadiene rubber-based resin, a styrenic block copolymer-based resin, a silicone-based resin, an epoxy resin, a polyurethane acrylate resin, or a combination thereof, and wherein the thermally conductive powder comprises copper, aluminum, graphite, graphene, aluminum nitride, boron nitride, beryllium oxide, silicon carbide, or a combination thereof.

7. The thermal management device of claim 1 , wherein the clamping portion of the bracket extends to the first exterior surface of the heat pipe such that the bracket has a surface flush with the first exterior surface of the heat pipe.

8. An electronic device comprising:
a device cover;
a printed circuit board enclosed within the device cover;
a processing unit on the printed circuit board;
a thermal grease layer directly contacting the processing unit;
a heat pipe comprising:
a heat pipe interior volume having a working fluid disposed therein,
a first exterior surface directly contacting the thermal grease layer,
a second exterior surface opposite from the first exterior surface, wherein the device cover is spaced from the second exterior surface of the heat pipe by a distance from greater than 1 mm to about 5 mm, and side exterior surfaces connecting the first exterior surface and the second exterior surface; and

a bracket having a clamping portion that holds the heat pipe by the side exterior surfaces of the heat pipe, wherein a portion of the clamping portion is in direct contact with the thermal grease layer, and wherein a portion of the bracket is in direct contact with a circuit board coupled to the processing unit; and
a heat sink coupled to the heat pipe, wherein a portion of the heat sink is in contact with the device cover.

9. The electronic device of claim 8 , wherein the electronic device is a laptop computer, a tablet computer, a workstation, a smart phone, or a television.

10. The electronic device of claim 8 , wherein the thermal grease layer has a thickness from about 0.03 mm to about 0.2 mm.

11. The electronic device of claim 8 , wherein the clamping portion of the bracket extends to the first exterior surface of the heat pipe such that the bracket has a surface flush with the first exterior surface of the heat pipe.

12. A method of making an electronic device comprising:
attaching a heat pipe to a processing unit using a thermal grease layer in direct contact with the processing unit and the heat pipe, wherein the heat pipe comprises:
a heat pipe interior volume having a working fluid disposed therein,
a first exterior surface directly contacting the thermal grease layer,
a second exterior surface opposite from the first exterior surface, and
side exterior surfaces connecting the first exterior surface and the second exterior surface;

supporting the heat pipe with a bracket having a clamping portion that holds the heat pipe by the side exterior surfaces of the heat pipe, wherein a portion of the clamping portion is in direct contact with the thermal grease layer, wherein a portion of the bracket is in direct contact with a circuit board coupled to the processing unit;
coupling a heat sink to the heat pipe, wherein a portion of the heat sink is in contact with a device cover; and
covering the processing unit and heat pipe with the device cover spaced from the second exterior surface of the heat pipe by a distance from greater than 1 mm to about 5 mm.

13. The method of claim 12 , wherein the thermal grease layer has a thickness from about 0.03 mm to about 0.2 mm.

14. The method of claim 12 , wherein the clamping portion of the bracket extends to the first exterior surface of the heat pipe such that the bracket has a surface flush with the first exterior surface of the heat pipe.

Assignees

• Hewlett Packard Development Co
• Hewlett Packard Deveopment Company L P

Inventors

• Huang Hendry
• Wu Kuan-Ting
• Chang Chi Hao

Classifications

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W40/251

  Organics · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H05K7/20454

  with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste · CPC title