System for discharging heat out of head-mounted display based on hybrid fan and heat pipe

US10379583B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10379583-B2
Application numberUS-201715491522-A
CountryUS
Kind codeB2
Filing dateApr 19, 2017
Priority dateApr 19, 2017
Publication dateAug 13, 2019
Grant dateAug 13, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A head-mounted display (HMD) includes a hybrid fan, a printed circuit board (PCB) with one or more electronic components and a heat pipe to dissipate heat. The hybrid fan has a center axis extending from a rear side of the HMD to a front side of the HMD. The hybrid fan pulls air from a rear side of the HMD. The heat pipe has an end coupled to the PCB. The heat pipe partially surrounds a periphery of the hybrid fan and transfers heat away from at least the PCB. The HMD further includes a side cover and a front cover. The side cover encloses the hybrid fan, the PCB and the heat pipe. The front cover is attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the hybrid fan.

First claim

Opening claim text (preview).

What is claimed is: 1. A head-mounted display (HMD) comprising: a fan having a center axis extending from a rear side of the HMD to a front side of the HMD, the fan configured to pull air from a rear side of the HMD; a printed circuit board (PCB) with one or more electronic components; a heat pipe having an end coupled to the PCB, the heat pipe at least partially surrounding a periphery of the fan and transferring heat away from the PCB; and an integrated metal frame onto which the PCB is directly mounted, the integrated metal frame in contact with the heat pipe and configured to function as a heat sink that receives the heat from the heat pipe and dissipates the heat, the integrated metal frame formed with a hole to receive the fan. 2. The HMD of claim 1 , further comprising: a side cover enclosing the fan, the PCB and the heat pipe; and a front cover attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the fan. 3. The HMD of claim 2 , wherein the integrated metal frame is enclosed within the side cover. 4. The HMD of claim 2 , wherein the integrated metal frame has edges shaped with contours that match an internal contour of the side cover to support the side cover. 5. The HMD of claim 1 , wherein the air is pulled from a cavity between a face of a user and the HMD to cool down temperature in the cavity. 6. The HMD of claim 1 , wherein the one or more electronic components of the PCB comprise a central processing unit (CPU) and wherein the end of the heat pipe is coupled to the CPU via a thermal interface material. 7. The HMD of claim 1 , wherein the heat pipe is horseshoe shaped with a first member connected to the PCB, a second member extending parallel to the first member and a third member connecting the first member and the second member. 8. The HMD of claim 1 , wherein the heat pipe comprises a first member connected to the PCB and a second member extending parallel to the first member. 9. The HMD of claim 1 , wherein the heat pipe transfers the heat away from the one or more electronic components of the PCB to the integrated metal frame. 10. The HMD of claim 1 , wherein the heat pipe is secured to the PCB by a metal bracket. 11. The HMD of claim 1 , wherein the fan is a hybrid fan that exhausts the air at sides of the fan after pulling the air from the rear side of the HMD. 12. The HMD of claim 1 , wherein the fan pulls air from front slots located on the fan and exhausts the air at sides of the fan. 13. A head-mounted display (HMD) comprising: a fan having a center axis extending from a rear side of the HMD to a front side of the HMD, the fan configured to pull air from a rear side of the HMD; a printed circuit board (PCB) with one or more electronic components; a side cover enclosing the fan and the PCB; a front cover attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the fan; and an integrated metal frame onto which the PCB is directly mounted, the integrated metal frame configured to function as a heat sink that receives heat originating from the PCB and dissipates the heat, the integrated metal frame formed with a hole to receive the fan. 14. The HMD of claim 13 , wherein the air is pulled from a cavity between a face of a user and the HMD to cool down temperature in the cavity. 15. The HMD of claim 13 , further comprising a heat pipe having an end coupled to a central processing unit (CPU) in the PCB. 16. The HMD of claim 13 , further comprising a heat pipe that includes a first member connected to the PCB and a second member extending parallel to the first member. 17. The HMD of claim 16 , wherein the heat pipe is secured to the PCB by a metal bracket. 18. The HMD of claim 13 , wherein the integrated metal frame is enclosed within the side cover. 19. The HMD of claim 13 , wherein the integrated metal frame has edges shaped with contours that match an internal contour of the side cover to support the side cover. 20. The HMD of claim 13 , wherein the fan is a hybrid fan that exhausts the air at sides of the fan after pulling the air from the rear side of the HMD.

Assignees

Inventors

Classifications

  • G06F1/163Primary

    Wearable computers, e.g. on a belt · CPC title

  • Arrangements for interaction with the human body, e.g. for user immersion in virtual reality (blind teaching G09B21/00) · CPC title

  • Cooling means · CPC title

  • G06F1/203Primary

    for portable computers, e.g. for laptops · CPC title

  • H05K7/2099Primary

    Liquid coolant with phase change · CPC title

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What does patent US10379583B2 cover?
A head-mounted display (HMD) includes a hybrid fan, a printed circuit board (PCB) with one or more electronic components and a heat pipe to dissipate heat. The hybrid fan has a center axis extending from a rear side of the HMD to a front side of the HMD. The hybrid fan pulls air from a rear side of the HMD. The heat pipe has an end coupled to the PCB. The heat pipe partially surrounds a periphe…
Who is the assignee on this patent?
Facebook Tech Llc
What technology area does this patent fall under?
Primary CPC classification G06F1/163. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 13 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).