Substrate supporting arm for semiconductor manufacturing apparatus
US-D785578-S · May 2, 2017 · US
US10379583B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10379583-B2 |
| Application number | US-201715491522-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 19, 2017 |
| Priority date | Apr 19, 2017 |
| Publication date | Aug 13, 2019 |
| Grant date | Aug 13, 2019 |
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A head-mounted display (HMD) includes a hybrid fan, a printed circuit board (PCB) with one or more electronic components and a heat pipe to dissipate heat. The hybrid fan has a center axis extending from a rear side of the HMD to a front side of the HMD. The hybrid fan pulls air from a rear side of the HMD. The heat pipe has an end coupled to the PCB. The heat pipe partially surrounds a periphery of the hybrid fan and transfers heat away from at least the PCB. The HMD further includes a side cover and a front cover. The side cover encloses the hybrid fan, the PCB and the heat pipe. The front cover is attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the hybrid fan.
Opening claim text (preview).
What is claimed is: 1. A head-mounted display (HMD) comprising: a fan having a center axis extending from a rear side of the HMD to a front side of the HMD, the fan configured to pull air from a rear side of the HMD; a printed circuit board (PCB) with one or more electronic components; a heat pipe having an end coupled to the PCB, the heat pipe at least partially surrounding a periphery of the fan and transferring heat away from the PCB; and an integrated metal frame onto which the PCB is directly mounted, the integrated metal frame in contact with the heat pipe and configured to function as a heat sink that receives the heat from the heat pipe and dissipates the heat, the integrated metal frame formed with a hole to receive the fan. 2. The HMD of claim 1 , further comprising: a side cover enclosing the fan, the PCB and the heat pipe; and a front cover attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the fan. 3. The HMD of claim 2 , wherein the integrated metal frame is enclosed within the side cover. 4. The HMD of claim 2 , wherein the integrated metal frame has edges shaped with contours that match an internal contour of the side cover to support the side cover. 5. The HMD of claim 1 , wherein the air is pulled from a cavity between a face of a user and the HMD to cool down temperature in the cavity. 6. The HMD of claim 1 , wherein the one or more electronic components of the PCB comprise a central processing unit (CPU) and wherein the end of the heat pipe is coupled to the CPU via a thermal interface material. 7. The HMD of claim 1 , wherein the heat pipe is horseshoe shaped with a first member connected to the PCB, a second member extending parallel to the first member and a third member connecting the first member and the second member. 8. The HMD of claim 1 , wherein the heat pipe comprises a first member connected to the PCB and a second member extending parallel to the first member. 9. The HMD of claim 1 , wherein the heat pipe transfers the heat away from the one or more electronic components of the PCB to the integrated metal frame. 10. The HMD of claim 1 , wherein the heat pipe is secured to the PCB by a metal bracket. 11. The HMD of claim 1 , wherein the fan is a hybrid fan that exhausts the air at sides of the fan after pulling the air from the rear side of the HMD. 12. The HMD of claim 1 , wherein the fan pulls air from front slots located on the fan and exhausts the air at sides of the fan. 13. A head-mounted display (HMD) comprising: a fan having a center axis extending from a rear side of the HMD to a front side of the HMD, the fan configured to pull air from a rear side of the HMD; a printed circuit board (PCB) with one or more electronic components; a side cover enclosing the fan and the PCB; a front cover attached to the side cover with a slit between an outer edge of the front cover and an outer edge of the side cover to discharge air from the fan; and an integrated metal frame onto which the PCB is directly mounted, the integrated metal frame configured to function as a heat sink that receives heat originating from the PCB and dissipates the heat, the integrated metal frame formed with a hole to receive the fan. 14. The HMD of claim 13 , wherein the air is pulled from a cavity between a face of a user and the HMD to cool down temperature in the cavity. 15. The HMD of claim 13 , further comprising a heat pipe having an end coupled to a central processing unit (CPU) in the PCB. 16. The HMD of claim 13 , further comprising a heat pipe that includes a first member connected to the PCB and a second member extending parallel to the first member. 17. The HMD of claim 16 , wherein the heat pipe is secured to the PCB by a metal bracket. 18. The HMD of claim 13 , wherein the integrated metal frame is enclosed within the side cover. 19. The HMD of claim 13 , wherein the integrated metal frame has edges shaped with contours that match an internal contour of the side cover to support the side cover. 20. The HMD of claim 13 , wherein the fan is a hybrid fan that exhausts the air at sides of the fan after pulling the air from the rear side of the HMD.
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