Shielded semiconductor package with open terminal and methods of making

Patent metadata

Field	Value
Publication number	US-12341108-B2
Application number	US-202318455419-A
Country	US
Kind code	B2
Filing date	Aug 24, 2023
Priority date	Dec 14, 2018
Publication date	Jun 24, 2025
Grant date	Jun 24, 2025

Abstract

A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.

First claim

What is claimed:

1. A method of making a semiconductor device, comprising:
providing a substrate;
depositing an encapsulant over a surface of the substrate, wherein a portion of the surface of the substrate including a plurality of contact pads is exposed from the encapsulant;
providing a jig;
disposing an insulating layer on a tab of the jig;
disposing the substrate over the jig with the tab of the jig over the portion of the surface of the substrate and the portion of the surface of the substrate on the insulating layer;
forming a shielding layer over the encapsulant; and
removing a portion of the shielding layer to expose the portion of the surface of the substrate.

2. The method of claim 1 , wherein the portion of the surface of the substrate includes a contact pad.

3. The method of claim 2 , further including providing a semiconductor package comprising an interconnect structure of the semiconductor package connected to the contact pad.

4. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a radio frequency (RF) electrical component over a first portion of a surface of the substrate;
depositing an encapsulant over the first portion of the surface of the substrate;
forming a shielding layer over the encapsulant and substrate; and
removing a portion of the shielding layer over a second portion of the surface of the substrate, wherein the second portion of the surface of the substrate includes a plurality of contact pads.

5. The method of claim 4 , further including removing the portion of the shielding layer using laser ablation.

6. The method of claim 4 , further including:
disposing a mask over the second portion of the surface of the substrate; and
removing the portion of the shielding layer by removing the mask.

7. The method of claim 4 , further including disposing the substrate over a jig with a tab of the jig over the second portion of the surface of the substrate.

8. The method of claim 7 , further including disposing an insulating layer on the tab of the jig and disposing the second portion of the surface of the substrate on the insulating layer.

9. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a radio frequency (RF) electrical component over the substrate;
depositing an encapsulant over a first portion of the substrate and the RF electrical component; and
forming a shielding layer over the encapsulant, wherein a second portion of the substrate is exposed from the encapsulant and shielding layer.

10. The method of claim 9 , wherein the substrate includes a contact pad disposed on the second portion of the substrate.

11. The method of claim 10 , further including disposing a semiconductor package adjacent to the substrate outside the encapsulant, wherein the semiconductor package includes an interconnect structure connected to the contact pad.

12. The method of claim 10 , wherein the contact pad is formed on a first surface of the substrate, and the encapsulant is deposited over the first surface of the substrate.

13. The method of claim 9 , further including forming the shielding layer to cover a top surface and every side surface of the encapsulant.

Assignees

• Stats Chippac Pte Ltd

Inventors

• Kim Changoh
• Koo Kyowang
• Cho Sungwon
• Choi Bongwoo
• Lee Jiwon

Classifications

• H10P50/73

  using masks for insulating materials · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W74/016

  using moulds · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title