Electrostatic edge ring mounting system for substrate processing

US12340989B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12340989-B2
Application numberUS-202117796740-A
CountryUS
Kind codeB2
Filing dateFeb 3, 2021
Priority dateFeb 4, 2020
Publication dateJun 24, 2025
Grant dateJun 24, 2025

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

An edge ring system comprising a substrate support configured to support a substrate during plasma processing and including a baseplate and an upper layer arranged on the baseplate. An edge ring support includes a first body and an electrostatic clamping electrode arranged in the first body. The edge ring support is arranged above the baseplate and radially outside of the substrate during processing. An edge ring includes a second body arranged on and electrostatically clamped to the edge ring support during plasma processing.

First claim

Opening claim text (preview).

What is claimed is: 1. An edge ring system comprising: a substrate support configured to support a substrate during plasma processing and including a baseplate and an upper layer arranged on the baseplate; an electrostatic ring support including a body and an electrostatic clamping electrode arranged in the body, wherein the electrostatic ring support is arranged above the baseplate and radially outside of the substrate during processing; an upper edge ring including an annular body configured to be arranged on and electrostatically clamped to the electrostatic ring support during plasma processing; and an annular ring arranged below the upper edge ring and radially outside of the electrostatic ring support, wherein the annular ring includes an annular ring body and an electrode arranged in the annular ring body, and wherein the upper edge ring is at least partially arranged on top of the electrostatic ring support. 2. The edge ring system of claim 1 , further comprising: a supply conductor configured to supply power to the electrostatic clamping electrode; and a gas supply line configured to supply gas between the upper edge ring and the electrostatic ring support. 3. The edge ring system of claim 2 , wherein the supply conductor and the gas supply line pass through the baseplate. 4. The edge ring system of claim 2 , further comprising: a first outer edge ring arranged radially outside of the upper edge ring and the electrostatic ring support; a supply conductor configured to supply power to the electrostatic clamping electrode; and a gas supply line configured to supply gas between the upper edge ring and the electrostatic ring support, wherein at least one of the supply conductor and the gas supply line passes through the first outer edge ring. 5. The edge ring system of claim 4 , wherein the supply conductor and the gas supply line pass through the first outer edge ring and not through the baseplate. 6. The edge ring system of claim 1 , further comprising a gas supply line to supply a gas to a cavity defined by at least one of the electrostatic ring support and the upper edge ring between the electrostatic ring support and the upper edge ring. 7. The edge ring system of claim 6 , wherein the annular body of the electrostatic ring support further includes the cavity on an upper surface of the electrostatic ring support facing the upper edge ring. 8. The edge ring system of claim 6 , wherein the annular body of the upper edge ring further includes the cavity on a lower surface of the upper edge ring facing the electrostatic ring support. 9. The edge ring system of claim 6 , wherein the gas supply line passes through a portion of the baseplate. 10. The edge ring system of claim 1 , further comprising a first outer edge ring arranged radially outside of the upper edge ring and the electrostatic ring support. 11. The edge ring system of claim 10 , further comprising a first seal arranged between an inner surface of the first outer edge ring and an outer surface of the baseplate. 12. The edge ring system of claim 10 , further comprising a second outer edge ring arranged radially outside of the first outer edge ring. 13. The edge ring system of claim 12 , further comprising a second seal arranged between an inner surface of the second outer edge ring and an outer surface of the first outer edge ring. 14. The edge ring system of claim 1 , wherein the electrostatic ring support is bonded to an upper surface of the baseplate. 15. The edge ring system of claim 1 , further comprising thermal interface material arranged between the electrostatic ring support and an upper surface of the baseplate. 16. The edge ring system of claim 1 , wherein the upper edge ring is not bonded to the electrostatic ring support. 17. The edge ring system of claim 1 , wherein the annular body of the upper edge ring includes a projection on a lower and radially inner surface thereof, and wherein the projection extends radially inside of a radially outer surface of the substrate. 18. The edge ring system of claim 1 , further comprising: a first outer edge ring arranged radially outside of the upper edge ring and the electrostatic ring support; and a first seal arranged between an inner surface of the first outer edge ring and the baseplate radially inside of the annular ring. 19. The edge ring system of claim 18 , wherein the annular ring is arranged radially inside of the first outer edge ring. 20. The edge ring system of claim 19 , further comprising a seal arranged between annular ring and the first outer edge ring. 21. The edge ring system of claim 1 , further comprising: a first outer edge ring arranged radially outside of the upper edge ring and the electrostatic ring support; a threaded cavity located in the electrostatic ring support; and a rod received in the threaded cavity configured to mechanically clamp the electrostatic ring support to the first outer edge ring. 22. The edge ring system of claim 1 , further comprising an electrode arranged in the electrostatic ring support. 23. The edge ring system of claim 22 , further comprising: a first supply conductor configured to supply power to the electrostatic clamping electrode; a gas supply line configured to supply gas between the upper edge ring and the electrostatic ring support; and a second supply conductor configured to supply power to the electrode. 24. The edge ring system of claim 23 , further comprising: a first outer edge ring arranged radially outside of the upper edge ring and the electrostatic ring support, wherein the first supply conductor and the gas supply line pass through the baseplate and the second supply conductor passes through the first outer edge ring. 25. The edge ring system of claim 22 , further comprising: a first outer edge ring arranged radially outside of the upper edge ring and the electrostatic ring support; a threaded cavity located in the edge electrostatic ring support; and a rod received in the threaded cavity configured to mechanically clamp the electrostatic ring support to the first outer edge ring.

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What does patent US12340989B2 cover?
An edge ring system comprising a substrate support configured to support a substrate during plasma processing and including a baseplate and an upper layer arranged on the baseplate. An edge ring support includes a first body and an electrostatic clamping electrode arranged in the first body. The edge ring support is arranged above the baseplate and radially outside of the substrate during proce…
Who is the assignee on this patent?
Lam Res Corp
What technology area does this patent fall under?
Primary CPC classification H01J37/32715. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 24 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).