Offset pore poromeric polishing pad

US12330261B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12330261-B2
Application numberUS-202016852422-A
CountryUS
Kind codeB2
Filing dateApr 18, 2020
Priority dateApr 18, 2020
Publication dateJun 17, 2025
Grant dateJun 17, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention provides a porous polyurethane polishing pad that includes a porous matrix having large pores that extend upward from a base surface and open to an upper surface. The large pores extend to the top polishing surface and have lower and upper sections with a vertical orientation. The lower and upper sections are offset in a horizontal direction. Middle-sized pores with a columnar shape and a vertical orientation originate adjacent the middle sections and small pores with a columnar shape and a vertical orientation originate between the middle-sized pores. The pores combine for increasing compressibility of the polishing pad and contact area of the top polishing surface during polishing.

First claim

Opening claim text (preview).

We claim: 1. A porous polyurethane polishing pad comprising: a porous matrix having large pores extending upward from a base surface and open to an upper surface, the large pores being interconnected with tertiary pores, a portion of the large pores being open to a top polishing surface, at least a portion of the large pores extending to the top polishing surface having lower and upper sections with a vertical orientation, vertical being an orthogonal direction from the base surface up to the polishing surface and middle sections having a spring-arm shape connecting the lower and upper sections, the lower section having a tear drop shape and a vertical bisect, the upper section having a cylindrical shape and a vertical bisect, wherein the middle section extends from the vertical bisect of the lower section to the vertical bisect of the upper section, middle sections have an angle between 15 and 90 degrees as measured from an upward vertical direction, the middle sections have an average diameter less than an average diameter of the lower section of the large pores and greater than an average diameter of the upper section of the large pores, the lower and upper sections being offset in a horizontal direction, the offset resulting in the middle section extending beyond the lower section, middle-sized pores with a columnar shape and a vertical orientation originating adjacent the middle sections and small pores with a columnar shape and a vertical orientation originating between the middle-sized pores, wherein the large pores having horizontal offset upper and lower sections, middle-sized pores, and small pores combine for increasing compressibility of the polishing pad and contact area of the top polishing surface during polishing, wherein the polishing pad has a compressibility of at least 5% as measured with a 5 mm diameter probe against a flat sample by adding a 60.5 gram sample, waiting sixty seconds, then measuring thickness 1 (T1), then after waiting an additional sixty seconds adding an additional 98 grams for a total of 158.5 grams measuring thickness after waiting an additional sixty seconds (T2) and wherein Compressibility (%)=(T1−T2)/T1. 2. The polishing pad of claim 1 wherein a majority of the middle sections create a horizontal separation gap between the lower and upper sections of the large pores. 3. The polishing pad of claim 1 wherein a majority of the middle sections create a horizontal overlap between the lower and upper sections of the large pores. 4. The polishing pad of claim 1 wherein the large pores with middle sections represent less than fifty percent of a total of large pore plus middle-sized pores and small pores. 5. The polishing pad of claim 1 wherein the polishing pad has an embossed surface forming grooves that extend to a perimeter of the polishing pad. 6. The polishing pad of claim 1 wherein an average diameter of the lower section is greater than an average diameter of the upper section of the large pores.

Assignees

Inventors

Classifications

  • for porous or cellular structure · CPC title

  • Lapping pads for working plane surfaces · CPC title

  • Constructional features of flexible abrasive materials; Special features in the manufacture of such materials · CPC title

  • B24B37/24Primary

    characterised by the composition or properties of the pad materials · CPC title

  • B24B37/26Primary

    characterised by the shape of the lapping pad surface, e.g. grooved · CPC title

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Frequently asked questions

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What does patent US12330261B2 cover?
The invention provides a porous polyurethane polishing pad that includes a porous matrix having large pores that extend upward from a base surface and open to an upper surface. The large pores extend to the top polishing surface and have lower and upper sections with a vertical orientation. The lower and upper sections are offset in a horizontal direction. Middle-sized pores with a columnar sha…
Who is the assignee on this patent?
Rohm & Haas Elect Materials Cmp Holdings Inc
What technology area does this patent fall under?
Primary CPC classification B24B37/24. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 17 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).