Tapered poromeric polishing pad

Patent metadata

Field	Value
Publication number	US-9925637-B2
Application number	US-201615228988-A
Country	US
Kind code	B2
Filing date	Aug 4, 2016
Priority date	Aug 4, 2016
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

The porous polyurethane polishing pad includes a porous polyurethane matrix having large pores extending upward from a base surface and open to a polishing surface. A series of pillow structures is formed from the porous matrix that include the large pores and the small pores. The pillow structures have a downward surface extending from the top polishing surface for forming downwardly sloped side walls at an angle from 30 to 60 degrees from the polishing surface. The large pores open to the downwardly sloped sidewalls and are less vertical than the large pores. The large pores are offset 10 to 60 degrees from the vertical direction in a direction more orthogonal to the sloped sidewalls.

First claim

We claim:

1. A porous polyurethane polishing pad comprising:
a porous polyurethane matrix having large pores extending upward from a base surface and open to an polishing surface, the large pores being interconnected with small pores; a portion of the large pores being open to a top polishing surface; the large pores extending to the polishing surface having a vertical orientation; and
a series of pillow structures formed from the porous matrix including the large pores and the small pores; the pillow structures having a downward surface from the top polishing surface for forming downwardly sloped side walls at an angle from 30 to 60 degrees from the polishing surface, the downwardly sloped side walls extending from all sides of the pillow structures, a portion of the large pores being open to the downwardly sloped side walls, the large pores open to the downwardly sloped sidewalls being less vertical than the large pores open to the top polishing surface and offset 10 to 60 degrees from the vertical direction in a direction more orthogonal to the sloped sidewalls.

2. The porous polyurethane polishing pad of claim 1 wherein the downwardly sloped side walls have an initial taper region of 5 to 30 degrees as measured from the polishing surface leading into the downwardly sloped side walls.

3. The porous polyurethane polishing pad of claim 1 wherein the downwardly sloped sides terminate in a horizontal groove bottom of polyurethane matrix, the groove bottom having a porosity less than the pillow structures.

4. The porous polyurethane polishing pad of claim 1 wherein the interconnected side pores have an average diameter sufficient to allow flow of deionized water between vertical pores.

5. The porous polyurethane matrix of claim 1 wherein the pillows form a grid pattern.

6. A porous polyurethane polishing pad comprising:
a porous polyurethane matrix having large pores extending upward from a base surface and open to an polishing surface, the large pores being interconnected with small pores; a portion of the large pores being open to a top polishing surface; the large pores extending to the polishing surface having a vertical orientation and the porous polyurethane matrix being a thermoplastic; and
a series of pillow structures formed from the porous matrix including the large pores and the small pores; the pillow structures having a downward surface from the top polishing surface for forming downwardly sloped side walls at an angle from 30 to 60 degrees from the polishing surface, the downwardly sloped side walls extending from all sides of the pillow structures, a portion of the large pores being open to the downwardly sloped side walls, the large pores open to the downwardly sloped sidewalls being less vertical than the large pores open to the top polishing surface and offset 10 to 60 degrees from the vertical direction in a direction more orthogonal to the sloped sidewalls.

7. The porous polyurethane polishing pad of claim 6 wherein the downwardly sloped side walls have an initial taper region of 5 to 30 degrees as measured from the polishing surface leading into the downwardly sloped side walls.

8. The porous polyurethane polishing pad of claim 6 wherein the downwardly sloped sides terminate in a horizontal groove bottom of compressed polyurethane matrix, the groove bottom being smooth and lacking open vertical or small pores.

9. The porous polyurethane polishing pad of claim 6 wherein the interconnected side pores have an average diameter sufficient to allow flow of deionized water between vertical pores.

10. The porous polyurethane matrix of claim 6 wherein the pillows form an X-Y grid pattern.

Assignees

• Rohm & Haas Elect Materials Cmp Holdings Inc

Inventors

• Yoshida Koichi
• Miyamoto Kazutaka
• Kawabata Katsumasa
• Sanford-Crane Henry
• Huang Hui Bin
• Jacob George C
• Luo Shuiyuan

Classifications

• B24B37/24

  characterised by the composition or properties of the pad materials · CPC title

• B24B37/26 Primary

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title

• B24D11/00 Primary

  Constructional features of flexible abrasive materials; Special features in the manufacture of such materials · CPC title

• B24D3/32 Primary

  for porous or cellular structure · CPC title