Heat dissipation panel, heat dissipation apparatus, and electronic device

Patent metadata

Field	Value
Publication number	US-11272639-B2
Application number	US-201716462826-A
Country	US
Kind code	B2
Filing date	Feb 7, 2017
Priority date	Nov 25, 2016
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region.

First claim

What is claimed is:

1. A heat dissipation apparatus that comprises a heat dissipation panel built in an electronic device, wherein the heat dissipation panel comprises:
a first heat conducting layer comprising a first surface and a second surface, wherein the first surface is exposed to the outside when the first heat conducting layer is bent, the second surface is opposite to the first surface, the first heat conducting layer including a first region configured to absorb heat released by a heat emitting component and to conduct the heat to a second region on the first heat conducting layer to dissipate the heat, an area of the first region being less than an area of the second region;
a first flexible layer comprising a third region, wherein the third region adheres to a bending region on the second surface of the first heat conducting layer; and
wherein the heat dissipation apparatus further comprises a reinforced plate adhered to a position on an upper surface of the heat dissipation panel or a lower surface of the heat dissipation panel and that corresponds to the bending region, the lower surface of the heat dissipation panel facing the heat emitting component and the upper surface of the heat dissipation panel opposite the lower surface.

2. The heat dissipation apparatus according to claim 1 , wherein the first flexible layer further comprises a fourth region adhering to the second surface of the first heat conducting layer outside the bending region, the third region and the fourth region completely covering the second surface of the first heat conducting layer.

3. The heat dissipation apparatus according to claim 1 , wherein the heat dissipation panel further comprises a second flexible layer that adheres to the first surface of the first heat conducting layer, the second flexible layer partially or completely covering the first surface of the first heat conducting layer when the first heat conducting layer is not bent.

4. The heat dissipation apparatus according to claim 1 , wherein the heat dissipation apparatus further comprises a fan located in a high-temperature region of the electronic device to enable air to flow between the high-temperature region and a low-temperature region so that the heat is to be conducted from the first region on the first heat conducting layer to the second region, wherein the high-temperature region is a region closer to the heat emitting component in the electronic device than the low-temperature region.

5. The heat dissipation apparatus according to claim 1 , wherein the heat dissipation apparatus further comprises a shielding cover disposed on the lower surface of the heat dissipation panel and a shielding base disposed in the electronic device, the shielding cover and the shielding base forming a shielding case that is configured to shield a chip, wherein the lower surface of the heat dissipation panel faces the heat emitting component.

6. The heat dissipation apparatus according to claim 5 , wherein the shielding cover is built in a lower layer of material of the heat dissipation panel, the lower layer of material being a material layer of the heat dissipation panel that is closest to the heat emitting component.

7. The heat dissipation apparatus according to claim 5 , wherein the shielding cover is adhered to the lower surface of the heat dissipation panel.

8. The heat dissipation apparatus according to claim 1 , wherein the reinforced plate comprises an attached stainless steel sheet or copper alloy sheet.

9. The heat dissipation apparatus according to claim 1 , wherein the first heat conducting layer comprises a plurality of separated strip-shaped thermal pads arranged in parallel on the bending region, each strip-shaped thermal pad being parallel to or approximately parallel to a heat conducting direction.

10. The heat dissipation apparatus according to claim 1 , wherein the first heat conducting layer is made of a heat conducting material with a coefficient of heat conductivity that is greater than or equal to 50 watt/(meter-kelvin).

11. The heat dissipation apparatus according to claim 10 , wherein the heat conducting material comprises graphite, copper foil, or aluminum foil.

12. The heat dissipation apparatus according to claim 1 , wherein the first flexible layer is made a flexible material that comprises polyimide or polyamide.

13. The heat dissipation apparatus according to claim 1 , wherein the bending region having a width that is less than a width of the second region.

Assignees

• Huawei Tech Co Ltd

Inventors

• Yang Guo
• Li Quanming
• Liu Xiaohu
• Li Wei
• Zhang Zhiguo

Classifications

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• G06F1/1616

  with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position · CPC title

• H05K7/20145

  Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title