Differential transmission substrate and power-over-differential data communication device

Patent metadata

Field	Value
Publication number	US-12323274-B2
Application number	US-202218561655-A
Country	US
Kind code	B2
Filing date	Feb 2, 2022
Priority date	May 21, 2021
Publication date	Jun 3, 2025
Grant date	Jun 3, 2025

Abstract

Provided is a technique of power superposition differential data transmission with low radiation noise at low cost and capable of operating at a radio frequency. A differential transmission board superimposes DC power on a differential data signal from a transmission/reception IC and then transmits the signal to a cable, and includes: a first differential transmission line including two wiring patterns; a second differential transmission line including two wiring patterns; two DC transmission lines that transmit the DC power; two capacitor elements that cut off the DC power and pass only the differential data signal; and two inductor elements that cut off a radio-frequency component that is the differential data signal and pass only a DC component, in which the first differential transmission line and the second differential transmission line are connected in series, in which the two capacitor elements are connected in series to the second differential transmission line, in which the second differential transmission line and the DC transmission line are connected via the two inductor elements, and in which a characteristic impedance in a differential mode of the first differential transmission line and a characteristic impedance in the differential mode of the second differential transmission line are substantially equivalent, and a characteristic impedance in an in-phase mode of the second differential transmission line is higher than a characteristic impedance in the in-phase mode of the first differential transmission line.

First claim

The invention claimed is:

1. A differential transmission board that superimposes DC power on a differential data signal from a transmission/reception IC and then transmits the signal to a cable, the differential transmission board comprising:
a first differential transmission line including two wiring patterns;
a second differential transmission line including two wiring patterns;
two DC transmission lines that transmit the DC power;
two capacitor elements that cut off the DC power and pass only the differential data signal; and
two inductor elements that cut off a radio-frequency component that is the differential data signal and pass only a DC component,
wherein the first differential transmission line and the second differential transmission line are connected in series,
the two capacitor elements are connected in series to the second differential transmission line,
the second differential transmission line and the DC transmission line are connected via the two inductor elements, and
a characteristic impedance in a differential mode of the first differential transmission line and a characteristic impedance in the differential mode of the second differential transmission line are substantially equivalent, and a characteristic impedance in an in-phase mode of the second differential transmission line is higher than a characteristic impedance in the in-phase mode of the first differential transmission line.

2. The differential transmission board according to claim 1 , wherein a GND plane or a pattern equivalent thereto immediately below the second differential transmission line is removed.

3. The differential transmission board according to claim 1 , wherein a line length of the second differential transmission line is generally a ¼ wavelength at a focused frequency.

4. The differential transmission board according to claim 1 , wherein the second differential transmission line has a meander line structure.

5. A power superposition differential data communication device comprising:
a transmission/reception IC that transmits and receives differential data;
the differential transmission board according to claim 1 ;
a DC power transmission and reception device that transmits or receives DC power; and
a connector for connecting the differential data signal on which DC power is superimposed to an external cable,
wherein differential transmission and reception data signal wirings from the transmission/reception IC are connected to the first differential transmission line of the differential transmission board,
a power wiring from the DC power transmission and reception device and the two DC transmission lines of the differential transmission board are connected, and
in the differential transmission board, after the DC power is superimposed on the differential data signal, the differential data signal on which the DC power is superimposed is connected to the connector.

6. A differential transmission board that superimposes DC power on a differential data signal from a transmission/reception IC and then transmits the signal to a cable, the differential transmission board comprising:
a first differential transmission line including two wiring patterns;
a second differential transmission line including two wiring patterns;
a third differential transmission line including two wiring patterns;
two DC transmission lines that transmit the DC power;
two capacitor elements that cut off the DC power and pass only the differential data signal; and
two inductor elements that cut off a radio-frequency component that is the differential data signal and pass only a DC component,
wherein the first differential transmission line and the third differential transmission line are connected in series,
the third differential transmission line and the second differential transmission line are connected in series,
the two capacitor elements are connected in series to the second differential transmission line,
the second differential transmission line and the DC transmission line are connected via the two inductor elements,
a characteristic impedance in a differential mode of the first differential transmission line, a characteristic impedance in the differential mode of the second differential transmission line, and a characteristic impedance in the differential mode of the third differential transmission line are substantially equivalent, and characteristic impedances in an in-phase mode of the second differential transmission line and the third differential transmission line is higher than a characteristic impedance in the in-phase mode of the first differential transmission line,
the third differential transmission line has a microstrip line or strip line structure having a GND layer on an upper side, a lower side, or upper and lower sides of a wiring layer of a signal line of the third differential transmission line, and
a GND plane or a pattern equivalent thereto immediately below the second differential transmission line is removed.

7. The differential transmission board according to claim 6 , wherein the second differential transmission line has a meander line structure.

8. A power superposition differential data communication device comprising:
a transmission/reception IC that transmits and receives differential data;
the differential transmission board according to claim 6 ;
a DC power transmission and reception device that transmits or receives DC power; and
a connector for connecting the differential data signal on which DC power is superimposed to an external cable,
wherein differential transmission and reception data signal wirings from the transmission/reception IC are connected to the first differential transmission line of the differential transmission board,
a power wiring from the DC power transmission and reception device and the two DC transmission lines of the differential transmission board are connected, and
in the differential transmission board, after the DC power is superimposed on the differential data signal, the differential data signal on which the DC power is superimposed is connected to the connector.

9. A differential transmission board that superimposes DC power on a differential data signal from a transmission/reception IC and then transmits the signal to a cable, the differential transmission board comprising:
a first differential transmission line including two wiring patterns;
a second differential transmission line including two wiring patterns;
two DC transmission lines that transmit the DC power;
a common-mode choke coil having a low impedance in a differential mode and a high impedance in an in-phase mode;
two capacitor elements that cut off the DC power and pass only the differential data signal; and
two inductor elements that cut off a radio-frequency component that is the differential data signal and pass only a DC component,
wherein the first differential transmission line and the second differential transmission line are connected in series,
the common-mode choke coil and the two capacitor elements are connected in series to the second differential transmission line,
the second differential transmission line and the DC transmission line are connected via the two inductor elements, and
a characteristic impedance in a differential mode of the first differential transmission line and a characteristic impedance in the differential mode of the second differential transmission line are substantially equivalent, and a characteristic impedance in an in-phase mode of the second differential transmission line is higher than a characteristic impedance in the in-phase mode of the first differential transmission line.

10. A power superposition differentia

Assignees

• Hitachi Astemo Ltd

Inventors

• Wachi Yusuke
• Norimatsu Takayasu

Classifications

• H04B3/146

  using phase-frequency equalisers · CPC title

• H05K1/025

  Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H10W44/20) · CPC title

• H05K1/0245

  Lay-out of balanced signal pairs, e.g. differential lines or twisted lines · CPC title

• H04L25/0272 Primary

  Arrangements for coupling to multiple lines, e.g. for differential transmission · CPC title