Power control method for power over data line system
US-2017272260-A1 · Sep 21, 2017 · US
US10447959B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10447959-B2 |
| Application number | US-201715817976-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 20, 2017 |
| Priority date | Nov 20, 2017 |
| Publication date | Oct 15, 2019 |
| Grant date | Oct 15, 2019 |
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Aspects of the disclosure provide for a system for a power over data line (PoDL) system. The system includes a ground plane that has a cutout. In addition, an alternating current (AC) capacitor pad configured to establish a bidirectional data channel. The AC capacitor pad is positioned in the cutout of the ground plane. Similarly, a PoDL pad connected to one or more inductors and a direct current (DC) power source is positioned in the cutout of the ground plane and is in series with the AC capacitor pad.
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The invention claimed is: 1. A system comprising: a ground plane including a cutout; an alternating current (AC) capacitor pad configured to establish a bi-directional data channel, the AC capacitor pad being positioned in the cutout of the ground plane; and a power over data line (PoDL) pad connected to a plurality of inductors and a DC power source, the PoDL pad being positioned in the cutout of the ground plane and being in series with the AC capacitor pad. 2. The system of claim 1 , further comprising the DC power source. 3. The system of claim 1 , further comprising a cable connecting the AC capacitor pad and the PoDL pad in series, the cutout of the ground plane being located between a first end of the cable and a second end of the cable. 4. The system of claim 3 , further comprising one or more computing devices at the first end of the cable, the one or more computing devices being configured to transmit data at a rate of 4 Gbps or greater along the bi-directional data channel. 5. The system of claim 4 , wherein the one or more computing devices are a serializer. 6. The system of claim 3 , further comprising one or more computing devices at the second end of the cable, the one or more computing devices being configured to process data received via the bi-directional data channel. 7. The system of claim 6 , wherein the one or more computing devices are a deserializer. 8. The system of claim 3 , wherein the cutout has a size wherein an impedance at the AC capacitor pad and the PoDL pad within the cutout match or closely match an impedance at a point of the cable that is between the first end of the cable and the cutout. 9. The system of claim 1 , wherein the cutout has a size wherein an impedance at the AC capacitor pad and the PoDL pad within the cutout match or closely match an impedance at a point of the cable that is between the cut out and the second end of the cable. 10. The system of claim 1 , further comprising a camera system configured to collect an image and transmit the image via the AC capacitor pad. 11. The system of claim 10 , further comprising a vehicle, and wherein the camera system is mounted on the vehicle. 12. The system of claim 1 , further comprising a lidar system configured to collect location information and transmit the location information via the AC capacitor pad. 13. The system of claim 12 , further comprising a vehicle, and where the lidar system is mounted on the vehicle. 14. The system of claim 1 , further comprising a layer beneath the ground plane, wherein the AC capacitor pad and the PoDL pad are positioned on the layer within the cutout of the ground plane. 15. A method of manufacturing comprising: forming a cutout in a ground plane; positioning in the cutout an alternating current (AC) capacitor pad configured to establish a bi-directional data channel; and positioning, in the cutout, a power over data line (PoDL) pad in series with the AC capacitor pad on a cable and in connection with a plurality of inductors and a DC power source. 16. The method of claim 15 , further comprising connecting a first end of the cable to a first computing device and a second end of the cable to a second computing device, wherein the cutout is positioned between the first end and the second end of the cable. 17. The method of claim 16 , wherein the first computing device are a serializer. 18. The method of claim 16 , wherein the second computing device are a deserializer. 19. The method of claim 15 , wherein the cutout has a size wherein an impedance at the AC capacitor pad and the PoDL pad within the cutout match or closely match an impedance at a point of the cable that is between the first end of the cable and the cutout. 20. The method of claim 15 , wherein the cutout has a size wherein an impedance at the AC capacitor pad and the PoDL pad within the cutout match or closely match an impedance at a point of the cable that is between the cutout and the second end of the cable.
Combinations of lidar systems with systems other than lidar, radar or sonar, e.g. with direction finders · CPC title
of land vehicles · CPC title
Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title
Pads for surface mounting, e.g. lay-out · CPC title
Two-way operation using the same type of signal, i.e. duplex · CPC title
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