Polarizer, electronic device and method of preparing polarizer

Patent metadata

Field	Value
Publication number	US-12321002-B2
Application number	US-202017424337-A
Country	US
Kind code	B2
Filing date	Mar 2, 2020
Priority date	Mar 2, 2020
Publication date	Jun 3, 2025
Grant date	Jun 3, 2025

Abstract

A polarizer, an electronic device and a method of preparing the polarizer are provided. The polarizer includes a base substrate and a metal wire grid structure provided on the base substrate. The metal wire grid structure includes a plurality of metal wire grid layers and one or more dielectric layers stacked between adjacent metal wire grid layers of the metal wire grid layers. Each of the plurality of metal wire grid layers includes a plurality of metal wire strips periodically arranged in a first direction parallel to a surface of the base substrate, and each of the plurality of metal wire grid layers is stacked in a second direction perpendicular to the surface of the base substrate, and a period of the metal wire strips in each of the plurality of metal wire grid layers is less than or equal to 300 nm.

First claim

What is claimed is:

1. A polarizer, comprising:
a base substrate, and
a metal wire grid structure provided on the base substrate, wherein the metal wire grid structure comprises:
a plurality of metal wire grid layers, wherein each of the plurality of metal wire grid layers comprises a plurality of metal wire strips arranged periodically in a first direction parallel to a surface of the base substrate, and each of the plurality of metal wire grid layers is stacked in a second direction perpendicular to the surface of the base substrate, wherein orthographic projections of the plurality of metal wire strips of a first metal wire grid layer on the base substrate and orthographic projections of the plurality of metal wire strips of a second metal wire grid layer on the base substrate are overlapped with each other one by one, or orthographic projections of the plurality of metal wire strips of the first metal wire grid layer on the base substrate and orthographic projections of the plurality of metal wire strips of the second metal wire grid layer on the base substrate are complementary with each other; and
a plurality of dielectric layers stacked between adjacent metal wire grid layers each with the plurality of metal wire strips,
wherein
the plurality of dielectric layers are selected from a group consisting of an inorganic compound dielectric layer, an organic compound dielectric layer, and a combination thereof, and the inorganic compound dielectric layer has an inorganic compound selected from a group consisting of silicon oxide, silicon nitride, silicon oxynitride, and a mixture thereof, and the organic compound dielectric layer has an organic compound which is thermal curing resin glue or light curing resin glue with a heat-resistant temperature greater than 100° C., and
the plurality of dielectric layers sequentially comprises, in a direction away from the base substrate:
a first dielectric layer configured as a protective layer, wherein the first dielectric layer is an inorganic compound dielectric layer formed of silicon oxide or silicon nitride, or an organic compound dielectric layer formed by thermal curing resin glue or light curing resin glue with a heat-resistant temperature greater than 100° C.;
a second dielectric layer configured as a planarization layer, wherein the second dielectric layer is formed by thermal curing resin glue or light curing resin glue with a heat-resistant temperature greater than 100° C.;
a third dielectric layer configured as a bonding promotion layer, wherein the third dielectric layer is formed of silicon nitride; and
a fourth dielectric layer configured as a protective layer, wherein the fourth dielectric layer is formed of silicon oxide.

2. The polarizer according to claim 1 , wherein the metal wire strips are formed of material selected from a group consisting of aluminum, titanium, silver, gold, copper, and an alloy formed by one or more of these metals.

3. The polarizer according to claim 1 , wherein the polarizer further comprises a protective layer on a side of the metal wire grid structure away from the base substrate.

4. The polarizer according to claim 3 , wherein the protective layer is formed of a material selected from a group consisting of silicon oxide, silicon nitride, silicon oxynitride, an organic compound, and a mixture thereof, and the organic compound is thermal curing resin glue or light curing resin glue with a heat-resistant temperature greater than 100° C.

5. The polarizer according to claim 1 , wherein the polarizer meets one or more of the following:
two to four metal wire grid layers are provided;
the metal wire strips in at least two or more of the plurality of metal wire grid layers have identical or different periods, and the periods are 40˜200 nm;
the metal wire strips in at least two or more of the plurality of metal wire grid layers have identical or different widths, and the widths are 20˜150 nm;
the metal wire strips in at least two or more of the plurality of metal wire grid layers have identical or different heights, and the heights are 160˜300 nm; and
the metal wire strips in at least two or more of the plurality of metal wire grid layers have identical or different aspect ratios.

6. The polarizer according to claim 1 , wherein a gap is provided between adjacent two metal wire strips of a same metal wire grid layer, and no dielectric layer is provided between the adjacent two metal wire strips.

7. A method of preparing a polarizer, comprising:
providing a base substrate, and
forming a metal wire grid structure on the base substrate, wherein the metal wire grid structure comprises:
a plurality of metal wire grid layers, wherein each of the plurality of metal wire grid layers comprises a plurality of metal wire strips arranged periodically in a first direction parallel to a surface of the base substrate, and the plurality of metal wire grid layers are stacked in a second direction perpendicular to the surface of the base substrate, wherein orthographic projections of the plurality of metal wire strips of a first metal wire grid layer on the base substrate and orthographic projections of the plurality of metal wire strips of a second metal wire grid layer on the base substrate are overlapped with each other one by one, or orthographic projections of the plurality of metal wire strips of the first metal wire grid layer on the base substrate and orthographic projections of the plurality of metal wire strips of the second metal wire grid layer on the base substrate are complementary with each other; and
a plurality of dielectric layers stacked between adjacent metal wire grid layers each with the plurality of metal wire strips,

wherein
the plurality of dielectric layers are selected from a group consisting of an inorganic compound dielectric layer, an organic compound dielectric layer, and a combination thereof, and the inorganic compound dielectric layer has an inorganic compound selected from a group consisting of silicon oxide, silicon nitride, silicon oxynitride, and a mixture thereof, and the organic compound dielectric layer has an organic compound which is thermal curing resin glue or light curing resin glue with a heat-resistant temperature greater than 100° C., and
the plurality of dielectric layers sequentially comprises, in a direction away from the base substrate:
a first dielectric layer formed as a protective layer, wherein the first dielectric layer is an inorganic compound dielectric layer formed of silicon oxide or silicon nitride, or an organic compound dielectric layer formed by thermal curing resin glue or light curing resin glue with a heat-resistant temperature greater than 100° C.;
a second dielectric layer formed as a planarization layer, wherein the second dielectric layer is formed by thermal curing resin glue or light curing resin glue with a heat-resistant temperature greater than 100° C.;
a third dielectric layer formed as a bonding promotion layer, wherein the third dielectric layer is formed of silicon nitride; and
a fourth dielectric layer formed as a protective layer, wherein the fourth dielectric layer is formed of silicon oxide.

8. The method according to claim 7 , wherein the forming the metal wire grid structure on the base substrate comprises:
alternately forming the plurality of metal wire grid layers and the plurality of dielectric layers of the metal wire grid structure on the base substrate.

9. The method according to claim 7 , wherein the metal wire strips are formed by using a material selected from a group consisting of aluminum, titanium, silver, gold, copper, and an alloy formed by one or more of these metals.

10. The method according to claim 7 , wherein the metal wire st

Assignees

• Boe Technology Group Co Ltd

Inventors

• Gu Xin
• Yuan Guangcai
• Dong Xue
• Han Jiahui
• Huang Hua
• Liang Pengxia
• Guo Kang

Classifications

• C09K2323/03

  Viewing layer characterised by chemical composition · CPC title

• C09K2323/00

  Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition · CPC title

• C09K2323/031

  Polarizer or dye · CPC title

• G02B5/3016

  involving passive liquid crystal elements (optical properties of liquid crystals G02F1/0063; polarising elements associated with active liquid crystal devices G02F1/133528) · CPC title

• G02F1/133548 Primary

  Wire-grid polarisers · CPC title