Passive carrier-based device delivery for slot-based high-volume semiconductor test system

Patent metadata

Field	Value
Publication number	US-12320852-B2
Application number	US-202318330222-A
Country	US
Kind code	B2
Filing date	Jun 6, 2023
Priority date	Nov 2, 2020
Publication date	Jun 3, 2025
Grant date	Jun 3, 2025

Abstract

A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack, and wherein each DUT in the array of DUTs aligns with a respective socket of the plurality of sockets on the interface board. The testing apparatus further comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

First claim

What is claimed is:

1. A testing apparatus comprising:
a plurality of test slots vertically arranged, wherein each test slot comprises circuitry to test a device under test (DUT) and at least one socket; and
a carrier comprising at least one membrane pocket operable to hold the DUT; where the carrier is operable to be inserted in a test slot of the test slots vertically arranged to facilitate a testing arrangement, wherein the testing arrangement comprises the DUT pushed through the at least one membrane pocket to make electrical and physical contact with the least one socket of the test slot.

2. The testing apparatus of claim 1 , wherein each test slot further comprises at least one actuator aligned at a vertical spacing relative to the at least one socket.

3. The testing apparatus of claim 2 , wherein each test slot further comprises at least one socket cover positioned below the at least one actuator.

4. The testing apparatus of claim 3 , wherein the least one actuator is operable to press the at least one socket cover on a top of the DUT to push through the at least one membrane pocket to make electrical and physical contact with the least one socket.

5. The testing apparatus of claim 4 , wherein the least one socket, the carrier, and the at least one socket cover together form an RF shield around the DUT.

6. The testing apparatus of claim 2 , wherein each test slot further comprises at least one package-on-package (POP) structure positioned below the at least one actuator.

7. The testing apparatus of claim 6 , wherein the least one actuator is operable to press the at least one POP structure to electrically connect with a top of the DUT to push through the at least one membrane pocket to make electrical and physical contact with the least one socket.

8. A testing apparatus comprising:
a plurality of test slots vertically arranged, wherein each test slot comprises:
circuitry to test a device under test (DUT),
at least one socket, and
a moveable carrier operable to facilitate a testing arrangement and comprising at least one membrane pocket operable to hold the DUT;

wherein the testing arrangement comprises the DUT pushed through the at least one membrane pocket to make electrical and physical contact with the least one socket of each test slot.

9. The testing apparatus of claim 8 , wherein each test slot further comprises at least one actuator aligned at a vertical spacing relative to the at least one socket.

10. The testing apparatus of claim 9 , wherein each test slot further comprises at least one socket cover positioned below the at least one actuator.

11. The testing apparatus of claim 10 , wherein the least one actuator is operable to press the at least one socket cover on a top of the DUT to push through the at least one membrane pocket to make electrical and physical contact with the least one socket.

12. The testing apparatus of claim 11 , wherein the least one socket, the moveable carrier, and the at least one socket cover together form an RF shield around the DUT.

13. The testing apparatus of claim 9 , wherein each test slot further comprises at least one package-on-package (POP) structure positioned below the at least one actuator.

14. The testing apparatus of claim 13 , wherein the least one actuator is operable to press the at least one POP structure to electrically connect with a top of the DUT to push through the at least one membrane pocket to make electrical and physical contact with the least one socket.

15. A method comprising:
inserting a carrier into a test slot of a plurality of test slots vertically arranged, wherein the carrier comprises at least one membrane pocket operable to hold a device under test (DUT); and
creating a testing arrangement comprising the DUT pushed through the at least one membrane pocket to make electrical and physical contact with a socket of the test slot of the test slots vertically arranged.

16. The method of claim 15 , wherein the creating comprises:
actuating a socket cover positioned above the socket to press a top of the DUT to push through the at least one membrane pocket to make electrical and physical contact with the socket.

17. The method of claim 16 , wherein the socket, the carrier, and the socket cover together form an RF shield around the DUT.

18. The method of claim 15 , wherein the creating comprises:
actuating a package-on-package (POP) structure positioned above the socket to press and to electrically connect with a top of the DUT to push through the at least one membrane pocket to make electrical and physical contact with the socket.

19. The method of claim 18 , further comprising:
testing the DUT and the POP structure together.

20. The method of claim 15 , further comprising:
removing the carrier from the test slot of the test slots vertically arranged if the DUT is completed with testing; and
re-inserting the carrier into the test slot of the test slots vertically arranged with an untested DUT.

Assignees

• Advantest Test Solutions Inc

Inventors

• Ranganathan Karthik
• Cruzan Gregory
• Kabbani Samer
• Oseguera Gilberto
• Leventhal Ira
• Ikeda Hiroki
• Kiyokawa Toshiyuki

Classifications

• G01R31/31907

  Modular tester, e.g. controlling and coordinating instruments in a bus based architecture · CPC title

• G01R31/01

  Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station (testing of cables continuously passing the testing apparatus G01R31/59; testing dielectric strength or breakdown voltage G01R31/12) · CPC title

• G01R31/2893

  Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00) · CPC title

• G01R31/2863

  Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04) · CPC title

• G01R31/2891

  related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05) · CPC title