Antenna and electronic device including the same

Patent metadata

Field	Value
Publication number	US-12316006-B2
Application number	US-202217687882-A
Country	US
Kind code	B2
Filing date	Mar 7, 2022
Priority date	Mar 9, 2021
Publication date	May 27, 2025
Grant date	May 27, 2025

Abstract

According to various embodiments, an electronic device may include: a housing, an antenna structure disposed in the inner space of the housing, wherein the antenna structure includes: a substrate including a first substrate and a second substrate surface oriented in a direction opposite to the first substrate surface, and a first array antenna including a plurality of first chip antennas disposed at a specified interval in a first region of the first substrate surface, and a first wireless communication circuit disposed in the inner space and configured to transmit and/or receive a wireless signal of a first frequency band via the first array antenna.

First claim

What is claimed is:

1. An electronic device comprising:
a housing;
a substrate disposed in the housing and including a first substrate surface facing a first direction and a second substrate surface oriented in a direction opposite to the first substrate surface;
a first array antenna disposed in at least a first region of the substrate, the first array antenna being disposed on the first substrate surface and/or being disposed at a position close to the first substrate surface in a space between the first substrate surface and the second substrate surface;
a first wireless communication circuit disposed in the space and configured to transmit and/or receive a wireless signal of a first frequency band via the first array antenna;
a second array antenna disposed in at least a second region different from the first region of the substrate, the second array antenna being disposed on the first substrate surface and/or being disposed at a position close to the first substrate surface in the space; and
a second wireless communication circuit disposed in the inner space and configured to transmit and/or receive a wireless signal of a second frequency band different from the first frequency band via the second array antenna,
wherein beam pattern directions of the first array antenna and the second array antenna are configured to be oriented in the first direction, wherein the first array antenna is configured to form a main radiation pattern in a first range, wherein the second array antenna is configured to form a main radiation pattern in a second range, and wherein the first and second ranges at least partially overlap.

2. The electronic device of claim 1 , wherein the first array antenna includes a plurality of first chip antennas disposed on the first substrate surface, and
wherein the substrate includes a plurality of recesses formed lower than the first substrate surface configured to accommodate at least a portion of each of the plurality of first chip antennas.

3. The electronic device of claim 2 , wherein the substrate includes a conductive layer disposed to surround the plurality of first chip antennas on the first substrate surface or in the space within a specified proximity to the first substrate surface.

4. The electronic device of claim 2 , further comprising:
conductive walls disposed in the space of the substrate and disposed to separate each of the plurality of first chip antennas when the substrate surface is viewed from above.

5. The electronic device of claim 4 , wherein the conductive walls are provided through a plurality of conductive vias formed in a direction from the first substrate surface to the second substrate surface in the space of the substrate.

6. The electronic device of claim 2 , wherein each of the plurality of first chip antennas includes:
a first rigid body comprising a high-dielectric constant material; and
a first conductive patch disposed in the first rigid body and electrically connected to at least one first conductive pad that is at least partially exposed to an outer surface of the first rigid body.

7. The electronic device of claim 6 , wherein the first wireless communication circuit is disposed on the second substrate surface, and
the substrate includes at least one second conductive pad electrically connected to the first wireless communication circuit via a first wiring and exposed to the first substrate surface.

8. The electronic device of claim 7 , wherein each of the plurality of first chip antennas is fixed to the first substrate surface, and
wherein the at least one first conductive pad and the at least one second conductive pad are soldered.

9. The electronic device of claim 2 , wherein the second array antenna includes a plurality of second chip antennas disposed on the first substrate surface, and
wherein each of the plurality of second chip antennas includes:
a second rigid body comprising a high-dielectric constant material; and
a second conductive patch disposed in the second rigid body and electrically connected to at least one third conductive pad that is at least partially exposed to an outer surface of the second rigid body.

10. The electronic device of claim 9 , wherein the second wireless communication circuit is disposed on the second substrate surface, and
the substrate includes at least one fourth conductive pad electrically connected to the second wireless communication circuit via a second wiring structure and exposed to the first substrate surface.

11. The electronic device of claim 10 , wherein each of the second chip antennas is fixed to the first substrate surface of the substrate, and
wherein the at least one third conductive pad and the at least one fourth conductive pad are soldered.

12. The electronic device of claim 1 , wherein the housing includes:
a front cover;
a rear cover oriented in a direction opposite to the front cover; and
a side member disposed to surround an inner space between the front cover and the rear cover and at least partially defining a side surface of the electronic device,
wherein the substrate is disposed such that the first substrate surface faces the side surface in the inner space.

13. The electronic device of claim 12 , wherein the side member includes:
a conductive portion at least partially defining an external appearance of the electronic device;
a first non-conductive portion disposed between the conductive portion and the rear cover, the first non-conductive portion corresponding to the first array antenna; and
a second non-conductive portion disposed between the conductive portion and the front cover, the second non-conductive portion corresponding to the second array antenna.

14. The electronic device of claim 13 , wherein the second non-conductive portion supports a display and at least a portion of the front cover.

15. The electronic device of claim 14 , wherein the second non-conductive portion comprises a material having a relatively higher dielectric constant than a dielectric constant of the first non-conductive portion.

16. The electronic device of claim 1 , wherein the first frequency band includes a frequency range of 25 GHz to 45 GHZ, and the second frequency band includes a frequency range of 55 GHz to 70 GHz.

17. An electronic device comprising:
a housing including a front cover, a rear cover oriented in a direction opposite to the front cover, and a side member disposed to surround an inner space between the front cover and the rear cover and at least partially defining a side surface of the electronic device;
an antenna structure disposed in the inner space of the housing, wherein the antenna structure includes:
a substrate including a first substrate surface and a second substrate surface oriented in a direction opposite to the first substrate surface;
a first array antenna disposed in at least a first region of the substrate, the first array antenna being disposed on the first substrate surface and/or being disposed at a position close to the first substrate surface in a space between the first substrate surface and the second substrate surface; and
a second array antenna disposed in at least a second region different from the first region of the substrate surface, the second array antenna being disposed on the first substrate surface and/or being disposed at a position close to the first substrate surface in the space; and

a first wireless communication circuit disposed in the inner space and configured to transmit and/or receive a wireless signal of a first frequency band via the first array antenna,
wherei

Assignees

• Samsung Electronics Co Ltd

Inventors

• Jang Woomin
• Kim Hosaeng
• Park Seongjin
• Yun Sumin
• Jong Jehun
• Jo Jaehoon
• Jung Jinwoo
• Chun Jaebong

Classifications

• H01Q1/38 Primary

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q1/243 Primary

  with built-in antennas · CPC title

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q1/523

  between antennas of an array · CPC title

• H01Q5/378

  Combination of fed elements with parasitic elements · CPC title