Wireless communications package with integrated antenna array

Patent metadata

Field	Value
Publication number	US-10594019-B2
Application number	US-201615368600-A
Country	US
Kind code	B2
Filing date	Dec 3, 2016
Priority date	Dec 3, 2016
Publication date	Mar 17, 2020
Grant date	Mar 17, 2020

Abstract

Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.

First claim

We claim:

1. An antenna package, comprising:
a multilayer package substrate comprising a plurality of antenna ground planes, a plurality of antenna feed lines, and a plurality of resistive transmission lines; and
a package cover comprising a planar lid, wherein the planar lid comprises a planar antenna array patterned on a first surface of the planar lid, wherein the planar antenna array comprises an array of active antenna elements and a plurality of dummy antenna elements disposed on the first surface of the planar lid, wherein the plurality of dummy antenna elements are disposed in a perimeter region surrounding the array of active antenna elements;
wherein the package cover is bonded to a first surface of the multilayer package substrate with the first surface of the planar lid facing the first surface of the multilayer package substrate, wherein each active antenna element on the first surface of the planar lid is aligned to a corresponding one of the antenna ground planes and a corresponding one of the antenna feed lines, and wherein each dummy antenna element on the first surface of the planar lid is aligned to a corresponding one of the antenna ground planes and a corresponding one of the resistive transmission lines;
wherein the resistive transmission lines extend through the multilayer package substrate and comprise first end portions which are configured for electromagnetic coupling to corresponding ones of the dummy antenna elements, and second end portions which are grounded in a same metallization layer of the multilayer package substrate to thereby terminate radiation incident on the dummy antenna elements; and
wherein the package cover is bonded to the multilayer package substrate with the first surface of the planar lid fixedly disposed at a distance from the first surface of the multilayer package substrate to provide an air space between the planar antenna array and the first surface of the multilayer package substrate.

2. The antenna package of claim 1 , wherein each antenna feed line comprises a first antenna feed line and a second antenna feed line, wherein the first and second antenna feed lines enable a dual polarization mode of operation of the active antenna elements.

3. The antenna package of claim 1 , wherein each resistive transmission line comprises a first resistive transmission line and a second resistive transmission line, wherein the first and second resistive transmission lines enable a termination of dual polarized radiation incident on the dummy antenna elements.

4. The antenna package of claim 1 , wherein the active antenna elements and the dummy antenna elements comprise patch antenna elements.

5. The antenna package of claim 1 , wherein the antenna feed lines have equalized lengths.

6. The antenna package of claim 5 , wherein a lateral routing of the antenna feed lines within the multilayer package substrate is implemented with transmission lines formed in a same metallization layer of the multilayer package substrate.

7. The antenna package of claim 6 , wherein the transmission lines for the lateral routing of the antenna feed lines comprise coplanar waveguide transmission lines.

8. The antenna package of claim 1 , wherein the multilayer package substrate comprises a plurality of isolation structures, wherein each isolation structure comprises a series of metallization traces and conductive vias formed within multiple layers of the multilayer package substrate, wherein each isolation structure is configured to surround one of the antenna ground planes and an end portion of one of the antenna feed lines, which are associated with one of the planar antenna elements.

9. The antenna package of claim 1 , further comprising a ground plane formed on a second surface of the multilayer package substrate, wherein the ground plane is configured to provide electromagnetic shielding between the multilayer package substrate and a RFIC (radio frequency integrated circuit) chip that is flip-chip bonded to the second surface of the multilayer package substrate.

10. The antenna package of claim 9 , further comprising a plurality of RFIC chips flip-chip bonded to the second surface of the multilayer package substrate, wherein the ground plane formed on the second surface of the multiplayer package substrate comprises a plurality of via openings to provide contact ports for connections between the RFIC chips and package feed lines, signal lines and power lines formed within the multilayer package substrate.

11. The antenna package of claim 1 , wherein the multilayer package substrate comprises:
a planar core layer comprising a core substrate, and first and second ground planes formed on first and second surfaces of the core substrate;
an antenna layer bonded to the first ground plane of the core substrate, wherein the antenna layer comprises a plurality of laminated layers, each laminated layer comprising a patterned metallization layer formed on an insulating layer, wherein the antenna layer comprises the antenna ground planes, end portions of the antenna feed lines which are aligned to, and electromagnetically coupled to, the active antenna elements, and end portions of the resistive transmission lines which are aligned to, and electromagnetically coupled to, the dummy antenna elements; and
an interface layer bonded to the second ground plane of the core substrate, wherein the interface layer comprises a plurality of laminated layers, each laminated layer comprising a patterned metallization layer formed on an insulating layer, wherein the interface layer comprises a power plane, a ground plane, and signal lines formed on one or more patterned metallization layers of the interface layer.

Assignees

• IBM
• Ericsson Ab

Inventors

• Baks Christian W
• Friedman Daniel J
• Gu Xiaoxiong
• Liu Duixian
• Valdes Garcia Alberto
• Hallin Joakim
• Tageman Ola Ragnar

Classifications

• H01Q9/045

  with particular feeding means (for circular polarisation H01Q9/0428) · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q21/065

  Patch antenna array · CPC title

• H01Q9/0407

  Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40) · CPC title

• H01Q1/526

  Electromagnetic shields · CPC title