Cooling and compression clamp for short lead power devices

Patent metadata

Field	Value
Publication number	US-11533805-B2
Application number	US-202117322549-A
Country	US
Kind code	B2
Filing date	May 17, 2021
Priority date	Oct 3, 2017
Publication date	Dec 20, 2022
Grant date	Dec 20, 2022

Abstract

A clamp configured to be coupled to a printed circuit board to cool and compress one or more electrical connections subject to repeated power and thermal cycling. A first conductive column of the clamp is configured to compress a first electrical connection between a first power device lead and a first printed circuit board trace of the printed circuit board, and draw thermal energy away from the first power device lead. The first conductive column extends from a load spreading plate. The load spreading plate is an insulator that electrically isolates a fastener extending therefrom from the first conductive column. The fastener is configured to cooperate with the circuit board to connect the clamp to the circuit board, compress the load spreading plate against the first conductive column to compress the first electrical connection, and connect the clamp to ground.

First claim

What is claimed is:

1. A clamp configured to be coupled to a printed circuit board subject to repeated power and thermal cycling, the clamp comprising:
a conductive column configured to compress an electrical connection between a drain lead from a transistor of a transistor package and a printed circuit board trace that supplies energy to an RF plasma output network, and configured to draw thermal energy away from the drain lead to cool the drain lead;
a load spreading plate from which the conductive column extends; and
a fastener extending from the load spreading plate, the load spreading plate is an insulator that electrically isolates the fastener from the conductive column, the fastener is configured to: cooperate with the printed circuit board to connect the clamp to the circuit board; and compress the load spreading plate against the conductive column to compress the electrical connection.

2. The clamp of claim 1 , wherein the transistor package is a Gemini-style package configured in a push-pull configuration for wideband, low distortion operation.

3. The clamp of claim 1 , further comprising grooved thermal energy dispersion surfaces on the conductive column.

4. The clamp of claim 1 , wherein the fastener connects the clamp to ground.

5. A circuit board for an RF plasma generator that provides solid state power for thin films processing equipment, the circuit board comprising:
a first transistor mounted to the circuit board with a retention member;
a first drain lead from the first transistor;
a first printed circuit board trace for supplying energy to an RF plasma output network, the first printed circuit board trace connected to the first drain lead to provide a first electrical connection therebetween;
a first conductive column compressing the first electrical connection between the first printed circuit board trace and the first drain lead, and configured to draw thermal energy away from the first drain lead to cool the first drain lead;
a load spreading plate from which the first conductive column extends; and
a fastener extending from the load spreading plate, the load spreading plate is an insulator that electrically isolates the fastener from the first conductive column, the fastener is configured to: cooperate with the circuit board to connect the retention member to the circuit board; and compress the load spreading plate against the first conductive column to compress the first electrical connection.

6. The circuit board of claim 5 , further comprising:
a second transistor mounted to the circuit board, the first transistor and the second transistor are included with a transistor package;
a second drain lead from the second transistor;
a second printed circuit board trace for supplying energy to the RF plasma output network, the second printed circuit board trace connected to the second drain lead to provide a second electrical connection therebetween;
a second conductive column compressing the second electrical connection between the second printed circuit board trace and the second drain lead, and configured to draw thermal energy away from the first drain lead to cool the first drain lead;
wherein the load spreading plate electrically isolates the second conductive column from both the fastener and the first conductive column; and
wherein the fastener compresses the load spreading plate against the second conductive column to compress the second electrical connection.

Assignees

• Mks Instr Inc

Inventors

• Luu Ky
• Radomski Aaron T
• Coffta Dave

Classifications

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H01J37/32174 Primary

  Circuits specially adapted for controlling the RF discharge · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K1/0263

  High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K1/0293 takes precedence) · CPC title

• H05K1/0209 Primary

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title