Apparatus and method for treating substrate

Patent metadata

Field	Value
Publication number	US-12293928-B2
Application number	US-202117563189-A
Country	US
Kind code	B2
Filing date	Dec 28, 2021
Priority date	Dec 28, 2020
Publication date	May 6, 2025
Grant date	May 6, 2025

Abstract

A substrate treating device includes a liquid treating chamber for liquid-treating a substrate therein, a drying chamber for dry-treating the liquid-treated substrate, a transfer device for transferring the substrate between the liquid treating chamber and the drying chamber, and a controller for controlling the liquid treating chamber and the transfer device. The transfer device includes a transfer robot having a hand for placing the substrate thereon, and a heating member for heating the substrate. The controller controls the transfer device such that the heating member of the transfer device heats a liquid on the substrate to a first temperature before the transfer device transfers the substrate taken out from the liquid treating chamber to the drying chamber.

First claim

What is claimed is:

1. A substrate treating apparatus comprising:
a liquid treating chamber configured to perform liquid-treating on a substrate therein;
a drying chamber configured to perform dry-treating on the substrate received from the liquid treating chamber;
a transfer device configured to transfer the substrate between the liquid treating chamber and the drying chamber; and
a controller configured to control the liquid treating chamber and the transfer device,
wherein the transfer device comprises:
a transfer robot having a hand configured to place the substrate thereon; and
a heating member configured to heat the substrate,
wherein the controller controls the transfer device such that the heating member of the transfer device heats a liquid on the substrate to a first temperature before the transfer device transfers the substrate taken out from the liquid treating chamber to the drying chamber,
wherein the liquid is an organic solvent, and a supercritical fluid is supplied to an inside of the drying chamber,
wherein the first temperature is lower than a boiling point of the liquid,
wherein the heating member is provided as a heating plate provided having a heater therein and disposed between the liquid treating chamber and the drying chamber, and
wherein the heating plate is outside the hand of the transfer robot.

2. The apparatus of claim 1 ,
wherein the heating member is provided as a heating chamber between the liquid treating chamber and the drying chamber, and the heating chamber comprises:
a housing with an opening allowing an entry/exit of the hand;
a support unit for placing the substrate thereon; and
a gas supply device for supplying a high temperature gas to an inner space of the housing, wherein a temperature of the high temperature gas is higher than the first temperature.

3. The apparatus of claim 1 ,
wherein the controller controls the liquid treating chamber as to supply the liquid at a second temperature to the substrate within the liquid treating chamber, and controls the transfer device for the heating member to heat the liquid on the substrate to the first temperature, the first temperature being higher temperature than the second temperature.

4. The apparatus of claim 3 ,
wherein the second temperature is higher temperature than a room temperature.

Assignees

• Semes Co Ltd

Inventors

• Lim Eui Sang
• Lee Yong Hee

Classifications

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0408

  for drying · CPC title

• H10P70/80 Primary

  Cleaning only by supercritical fluids · CPC title

• H10P72/0404 Primary

  for general liquid treatment, e.g. etching followed by cleaning · CPC title