Two-phase immersion-cooling heat-dissipation composite structure having high-porosity solid structure and high-thermal-conductivity fins

Patent metadata

Field	Value
Publication number	US-12289865-B2
Application number	US-202217981182-A
Country	US
Kind code	B2
Filing date	Nov 4, 2022
Priority date	Nov 4, 2022
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

A two-phase immersion-cooling heat-dissipation composite structure. The heat-dissipation composite structure includes a heat dissipation base, a plurality of high-thermal-conductivity fins, and at least one high-porosity solid structure. The heat dissipation base has a first surface and a second surface that face away from each other. The second surface of the heat dissipation base is in contact with a heating element immersed in a two-phase coolant. The first surface of the heat dissipation base is connected to the high-thermal-conductivity fins. The at least one high-porosity solid structure is located at the first surface of the heat dissipation base, and is connected and alternately arranged between side walls of two adjacent ones of the high-thermal-conductivity fins. Each of the high-porosity solid structure includes a plurality of closed holes and a plurality of open holes.

First claim

What is claimed is:

1. A two-phase immersion-cooling heat-dissipation composite structure, comprising: a heat dissipation base, a plurality of high-thermal-conductivity fins, and at least one high-porosity solid structure; wherein the heat dissipation base has a first surface and a second surface that face away from each other, the second surface of the heat dissipation base is in contact with a heating element immersed in a two-phase coolant; wherein the first surface of the heat dissipation base is connected to the plurality of high-thermal-conductivity fins; wherein the at least one high-porosity solid structure is located at the first surface of the heat dissipation base, and the at least one high-porosity solid structure is alternately arranged and connected between side walls of any two adjacent ones of the plurality of high-thermal-conductivity fins; wherein the at least one high-porosity solid structure includes a plurality of closed holes and a plurality of open holes; wherein a predetermined volume ratio of the at least one high-porosity solid structure to the high-thermal-conductivity fins is higher than 0.25.

2. The two-phase immersion-cooling heat-dissipation composite structure according to claim 1 , wherein the high-thermal-conductivity fins are made of copper, copper alloy, aluminum, or aluminum alloy.

3. The two-phase immersion-cooling heat-dissipation composite structure according to claim 1 , wherein the high-thermal-conductivity fins are formed by bending, forging, extrusion, or powder sintering.

4. The two-phase immersion-cooling heat-dissipation composite structure according to claim 1 , wherein the high-thermal-conductivity fins are pin-fins or plate fins, and the thermal conductivity of the high-thermal-conductivity fins is greater than 300 W/m·K.

5. The two-phase immersion-cooling heat-dissipation composite structure according to claim 1 , wherein the predetermined volume ratio of the at least one high-porosity solid structure to the high-thermal-conductivity fins is between 0.25 and 2.25.

6. The two-phase immersion-cooling heat-dissipation composite structure according to claim 1 , wherein the porosity of the at least one high-porosity solid structure is higher than the porosity of the high-thermal-conductivity fins, and the porosity of the at least one high-porosity solid structure is higher than 20% and less than 70%.

7. The two-phase immersion-cooling heat-dissipation composite structure according to claim 1 , wherein the height of the at least one high-porosity solid structure is higher than 1 mm, and the height of the at least one high-porosity solid structure is between 10% and 150% of the height of the high-thermal-conductivity fins.

8. The two-phase immersion-cooling heat-dissipation composite structure according to claim 1 , wherein the at least one high-porosity solid structure is formed by metal powder sintering, and a metal powder for forming the at least one high-porosity solid structure has a median diameter between 30 μm and 800 μm.

9. The two-phase immersion-cooling heat-dissipation composite structure according to claim 1 , wherein the at least one high-porosity solid structure is formed by chemically etching a substrate with a chemical agent of phosphoric acid microetching solution, sulfate microetching solution, or ferric chloride etching solution.

10. The two-phase immersion-cooling heat-dissipation composite structure according to claim 1 , wherein the at least one high-porosity solid structure is made of a substrate of copper, copper alloy, aluminum alloy, graphite, or silver.

Assignees

• Amulaire Thermal Tech Inc

Inventors

• Wu Chun-Te
• Yang Ching-Ming
• Chiu Yu-Wei
• Yeh Tze-Yang

Classifications

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/257

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/30

  wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid · CPC title

• F28F13/003

  by using permeable mass, perforated or porous materials (F28F13/18 takes precedence) · CPC title