System for using active and passive cooling for high power thermal management

Patent metadata

Field	Value
Publication number	US-10006720-B2
Application number	US-201113195515-A
Country	US
Kind code	B2
Filing date	Aug 1, 2011
Priority date	Aug 1, 2011
Publication date	Jun 26, 2018
Grant date	Jun 26, 2018

Abstract

A cooling system that includes a substrate having a metallic face, at least one microporous wick formation in thermal communication with the metallic face, and a liquid delivery head positioned in complementary opposition to the metallic face, the liquid delivery head having at least one nozzle for directing a liquid towards the metallic face.

First claim

What is claimed is:

1. A thermal management apparatus, comprising:
a substrate having a metallic face;
at least one microporous wick formation in thermal communication with said metallic face, wherein said microporous wick formation comprises: a plurality of microporous wicks and a plurality of macroporous channels; and
a liquid delivery head positioned in complementary opposition to said metallic face, said liquid delivery head having at least one nozzle for directing a liquid towards said metallic face.

2. The apparatus of claim 1 , wherein said plurality of microporous wicks include a plurality of sub-millimeter notches on an outer perimeter of at least one of said plurality of microporous wicks.

3. A thermal management apparatus, comprising:
a substrate having a metallic face;
at least one microporous wick formation in thermal communication with said metallic face; and
a liquid delivery head positioned in complementary opposition to said metallic face, said liquid delivery head having at least one nozzle for directing a liquid towards said metallic face;
wherein said microporous wick formation comprises:
a plurality of microporous wicks;
a plurality of radially-extending macroporous channels between respective pairs of said plurality of microporous wicks; and
a liquid impingement area at a central hub of said plurality of radially-extending macroporous channels.

4. The apparatus of claim 3 , wherein said at least one nozzle is positioned to target the liquid directly onto said liquid impingement area.

5. The apparatus of claim 3 , further comprising:
a second plurality of microporous wicks;
a second plurality of radially-extending macroporous channels between respective pairs of said second plurality of microporous wicks; and
a second liquid impingement area at a central hub of said second plurality of radially-extending macroporous channels.

6. A thermal management apparatus, comprising:
a substrate having a metallic face;
a microporous wick formation in thermal communication with said metallic face, said microporous wick formation having a plurality of macroporous channels extending radially from a central fluid impingement area; and
a plurality of meso-scale notches configured in a portion of said plurality of macroporous channels to minimize viscous drag of liquid flow, when a liquid is present.

7. The apparatus of claim 6 , further comprising:
a liquid delivery head in complementary opposition to said metallic face.

8. The apparatus of claim 7 , wherein said liquid delivery head comprises a plurality of micro-jet regions that each have at least one nozzle aligned to provide a respective stream of liquid towards the substrate.

9. The apparatus of claim 8 , wherein one of said plurality of micro-jet regions directs a stream of liquid to impinge onto said a central fluid impingement area.

Assignees

• Bhunia Avijit
• Cai Qingjun
• Chen Chung Lung
• Teledyne Scient & Imaging Llc

Inventors

• Bhunia Avijit
• Cai Qingjun
• Chen Chung-Lung

Classifications

• H10W40/475

  using jet impingement (H10W40/776 takes precedence) · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• F28D2021/0028

  for cooling heat generating elements, e.g. for cooling electronic components or electric devices · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title