Heat dissipation device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9700930-B2
Application number	US-201414268266-A
Country	US
Kind code	B2
Filing date	May 2, 2014
Priority date	Oct 25, 2011
Publication date	Jul 11, 2017
Grant date	Jul 11, 2017

Abstract

A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a main body and at least one fixing hole. The main body has a first board body and a second board body corresponding to the first board body. The first and second board bodies are mated with each other to define a chamber. A working fluid and multiple support pillars are disposed in the chamber. At least one capillary structure is disposed on a surface of the chamber. The fixing hole is formed on the main body in a position where any support pillar is positioned. The fixing hole passes through the first and second board bodies and the support pillar. According to the above arrangement, the airtightness of the chamber of the main body can be ensured. Also, the heat spreader can be tightly connected with other components.

First claim

What is claimed is:

1. A manufacturing method of a heat dissipation device, comprising steps of:
preparing a first board body and a second board body, wherein a planar raised section is selectively disposed on an outer surface of the first board body or the second board body for directly contacting a flat surface of a heat source;
disposing at least one capillary structure on and multiple support pillars extending between inner faces of the first and second board bodies;
mating the first and second board bodies with each other to form a heat dissipation device with a closed chamber, the support pillars being disposed in the closed chamber, vacuuming the closed chamber, filling a working fluid into the closed chamber and sealing the heat dissipation device, wherein two ends of each of the support pillar are respectively connected with the capillary structure on the inner faces of the first and second board bodies; and
mechanically processing the first and second board bodies to form a fixing hole through the closed chamber in the first and second board bodies and a corresponding support pillar in a position where a selected support pillar is positioned.

2. The manufacturing method of the heat dissipation device as claimed in claim 1 , wherein the capillary structure is selected from a group consisting of sintered powder body, and channeled structure.

3. The manufacturing method of the heat dissipation device as claimed in claim 1 , wherein the heat dissipation device further has a fixing member, one end of the fixing member being correspondingly fitted through the fixing hole, the fixing member having a hole formed with an inner thread.

4. The manufacturing method of the heat dissipation device as claimed in claim 1 , wherein the mechanical processing is selected from a group consisting of punching, drilling and milling.

5. The manufacturing method of the heat dissipation device as claimed in claim 1 , wherein the capillary structure and the support pillars are connected with the first and second board bodies by means of a process selected from a group consisting of diffusion bonding, sintering and brazing.

Assignees

• Asia Vital Components Co Ltd

Inventors

• Yang Hsiu-Wei

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/611

  Bolts or screws · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• B21D53/02 Primary

  heat exchangers {or parts thereof}, e.g. radiators, condensers {fins, headers}(making finned or ribbed tubes by fixing strip material or the like to tubes B21C37/22) · CPC title

• F28D15/04 Primary

  with tubes having a capillary structure · CPC title