Integrated machine for automatic cutting, polishing, stacking and unloading of substrates

US12275083B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12275083-B2
Application numberUS-202418767908-A
CountryUS
Kind codeB2
Filing dateJul 9, 2024
Priority dateAug 30, 2023
Publication dateApr 15, 2025
Grant dateApr 15, 2025

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An integrated machine for automatic cutting, polishing, stacking, and unloading of substrates, including a laser cutting machine, a mechanical laser arm, a polishing machine, a polishing device, a first finished product placement rack, a second finished product placement rack, and an automatic stacking device. The mechanical laser arm is fixed on the frame of the laser cutting machine, the polishing device is fixed on the polishing machine, and the first finished product placement rack and the second finished product placement rack are arranged on both sides of the automatic stacking device. The present disclosure can achieve cutting the substrates of any size, and can automatically polish the edges of the cut substrates. The present disclosure has the characteristics of automation, integration, and multi-functionality, effectively reducing the number of supporting equipment and occupying space.

First claim

Opening claim text (preview).

What is claimed is: 1. An integrated machine for automatic cutting, polishing, stacking, and unloading of substrates, comprising a laser cutting machine ( 1 ), a mechanical laser arm ( 59 ), an operating system ( 2 ), a polishing machine ( 3 ), a polishing device ( 30 ), a first finished product placement rack ( 6 ), a second finished product placement rack ( 7 ), and an automatic stacking device ( 8 ), wherein the mechanical laser arm ( 59 ) is fixed on the laser cutting machine bench ( 19 ), the operating system ( 2 ) is fixed on a laser cutting machine protective cover ( 9 ), the polishing device ( 30 ) is fixed on a polishing machine bench ( 26 ), the first finished product placement rack ( 6 ) is placed on a side of a second bracket ( 50 ), and the second finished product placement rack ( 7 ) is placed on a side of a first bracket ( 39 ); the laser cutting machine ( 1 ), the polishing machine ( 3 ), the automatic stacking device ( 8 ), the first finished product placement rack ( 6 ), and the second finished product placement rack ( 7 ) are all placed on the same horizontal plane; the laser cutting machine ( 1 ) comprises a laser cutting machine bench ( 19 ) and a laser cutting machine head ( 20 ), wherein the laser cutting machine bench ( 19 ) comprises a cutting table ( 17 ), the mechanical laser arm ( 59 ), and a first motor ( 18 ), wherein the first motor ( 18 ), the cutting table ( 17 ), and the mechanical laser arm ( 59 ) are all fixed on the laser cutting machine bench ( 19 ), and an operating range of the mechanical laser arm ( 59 ) is an area of the cutting table ( 17 ); the laser cutting machine head ( 20 ) comprises the laser cutting machine protective cover ( 9 ), the operating system ( 2 ), and a first camera ( 24 ) and a second camera ( 25 ), wherein the operating system ( 2 ) is fixed on an outside of a side of the laser cutting machine protective cover ( 9 ), and the first camera ( 24 ) and the second camera ( 25 ) are fixed on an inside of a top of the laser cutting machine protective cover ( 9 ); the mechanical laser arm ( 59 ) comprises a laser equipment ( 11 ), a first rotary joint ( 12 ), a second rotary joint ( 13 ), a third rotary joint ( 14 ), a fourth rotary joint ( 15 ), and a laser source ( 16 ), wherein the laser equipment ( 11 ) is fixed on an outer wall of the mechanical laser arm ( 59 ), the mechanical laser arm ( 59 ) is combined by the first rotary joint ( 12 ), the second rotary joint ( 13 ), the third rotary joint ( 14 ), the fourth rotary joint ( 15 ), the laser source ( 16 ) is fixed at an end of the mechanical laser arm ( 59 ) through the fourth rotary joint ( 15 ), and the mechanical laser arm ( 59 ) is rotated freely with 7 degrees of freedom; the polishing machine ( 3 ) comprises the polishing machine bench ( 26 ) and a polishing machine head ( 33 ), wherein the polishing machine bench ( 26 ) comprises a polishing table ( 27 ), a first sliding rail ( 28 ), a second sliding rail ( 29 ), a polishing device ( 30 ), a first telescopic rod ( 31 ), and a second telescopic rod ( 32 ); the polishing table ( 27 ), the first telescopic rod ( 31 ), and the second telescopic rod ( 32 ) are fixed on the polishing machine bench ( 26 ); the second sliding rail ( 29 ) is fixed on the first telescopic rod ( 31 ) and the second telescopic rod ( 32 ); the first sliding rail ( 28 ) sliders within a track of the second sliding rail ( 29 ); the polishing device ( 30 ) slides within a track of the first sliding rail ( 28 ), and a polishing range is an area of the polishing table ( 27 ); the polishing machine head ( 33 ) comprises a polishing machine protective cover ( 10 ), a third sliding rail ( 34 ), a fourth sliding rail ( 35 ), a third telescopic rod ( 60 ), a vacuum suction device ( 36 ), a first vacuum machine ( 4 ), and a tri-color light ( 5 ), wherein the third sliding rail ( 34 ) is fixed on an inner wall of a top of the polishing machine protective cover ( 10 ), the fourth sliding rail ( 35 ) slides within a track of the third sliding rail ( 34 ), the vacuum suction device ( 36 ) is fixed on the third telescopic rod ( 60 ), the third telescopic rod ( 60 ) slides within a track of the fourth sliding rail ( 35 ), and the first vacuum machine ( 4 ) and the tri-color light ( 5 ) are fixed on a top of an outer wall of the polishing machine protective cover ( 10 ); the automatic stacking device ( 8 ) comprises a second motor ( 37 ), a conveying device ( 38 ), a first bracket ( 39 ), a second bracket ( 50 ), a third motor ( 40 ), a fourth motor ( 51 ), a second vacuum machine ( 41 ), a third vacuum machine ( 52 ), a first suction cup manipulator ( 45 ), and a second suction cup manipulator ( 49 ), wherein the second motor ( 37 ) is fixed on the conveying device ( 38 ), the third motor ( 40 ) and the second vacuum machine ( 41 ) are fixed on the first bracket ( 39 ), the fourth motor ( 51 ) and the third vacuum machine ( 52 ) are fixed on the second bracket ( 50 ), the first suction cup manipulator ( 45 ) and the second suction cup manipulator ( 49 ) are respectively fixed on the first bracket ( 39 ) and the second bracket ( 50 ), and the first bracket ( 39 ) and the second bracket ( 50 ) are arranged on both sides of the conveying device ( 38 ). 2. The integrated machine for automatic cutting, polishing, stacking, and unloading of substrates as claimed in claim 1 , wherein the first suction cup manipulator ( 45 ) comprises a first chassis ( 42 ), a first rotation device ( 43 ), a second rotation device ( 44 ), a third rotation device ( 46 ), a fourth rotation device ( 47 ), a first fixture ( 61 ), and a first vacuum suction cup ( 48 ); the first suction cup manipulator ( 45 ) slides on the first bracket ( 39 ) through the first fixture ( 61 ) arranged on the first chassis ( 42 ), and is combined with the first rotation device ( 43 ), the second rotation device ( 44 ), the third rotation device ( 46 ), the fourth rotation device ( 47 ), allowing for any rotation with 6 degrees of freedom; and the first vacuum suction cup ( 48 ) is fixed at an end of the first suction cup manipulator ( 45 ) through the fourth rotation device ( 47 ). 3. The integrated machine for automatic cutting, polishing, stacking, and unloading of substrates as claimed in claim 1 , wherein the second suction cup manipulator ( 49 ) comprises a second chassis ( 53 ), a fifth rotation device ( 54 ), a sixth rotation device ( 55 ), a seventh rotation device ( 56 ), an eighth rotation device ( 57 ), a second fixture ( 62 ), and a second vacuum suction cup ( 58 ); the second suction cup manipulator ( 49 ) slides on the second bracket ( 50 ) through the second fixture ( 62 ) arranged on the second chassis ( 53 ), and is combined with the fifth rotation device ( 54 ), the sixth rotation device ( 55 ), the seventh rotation device ( 56 ), the eighth rotation device ( 57 ), allowing for any rotation with 6 degrees of freedom; and the second vacuum suction cup ( 58 ) is fixed at an end of the second suction cup manipulator ( 49 ) through the eighth rotation device ( 57 ). 4. The integrated machine for automatic cutting, polishing, stacking, and unloading of substrates as claimed in claim 1 , wherein the operating system ( 2 ) comprises an operating panel ( 77 ), a power supply ( 78 ), an indicator light ( 79 ), a circuit breaker ( 80 ), a stepper motor ( 81 ), a displacement sensor ( 82 ), a machine vision sensor ( 83 ), a protection device ( 84 ), a pneumatic actuator ( 85 ), and a signal converter ( 86 ). 5. The integrated machine for automatic cutting, polishing, stacking, and unloading of substrates as claimed in claim 1 , wherein the first finished product placement rack comprises a first frame ( 63 ), a first cabinet door ( 64 ), a first placement plate ( 65 ), a first roller ( 66 ), a second roller ( 67 ), a third roller ( 68 ), and a fourth rolle

Assignees

Inventors

Classifications

  • by suction or magnetic devices · CPC title

  • B24B55/04Primary

    Protective covers for the grinding wheel · CPC title

  • Feeding, loading or unloading work specially adapted to lapping · CPC title

  • designed for working plane surfaces · CPC title

  • using optical means · CPC title

Patent family

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Frequently asked questions

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What does patent US12275083B2 cover?
An integrated machine for automatic cutting, polishing, stacking, and unloading of substrates, including a laser cutting machine, a mechanical laser arm, a polishing machine, a polishing device, a first finished product placement rack, a second finished product placement rack, and an automatic stacking device. The mechanical laser arm is fixed on the frame of the laser cutting machine, the poli…
Who is the assignee on this patent?
Univ Southwest Petroleum
What technology area does this patent fall under?
Primary CPC classification B24B55/04. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 15 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).