Combined machining apparatus and combined machining method

US10220469B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10220469-B2
Application numberUS-201414914795-A
CountryUS
Kind codeB2
Filing dateMay 23, 2014
Priority dateSep 2, 2013
Publication dateMar 5, 2019
Grant dateMar 5, 2019

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided are a combined machining apparatus and a combined machining method capable of performing machining with higher accuracy and at a high speed. The apparatus has a stage unit; a mechanical machining unit including a mechanical machining head having a tool configured to machine a workpiece; a laser machining unit including a laser machining head configured to emit laser for machining the workpiece; a moving unit; and a control unit that controls the operation of each unit, in which the laser machining head has a laser turning unit that turns laser relative to the workpiece, and a condensing optical system that focuses the laser turned by the laser turning unit, and a position at which the workpiece is irradiated with the laser is rotated by the laser turning unit.

First claim

Opening claim text (preview).

The invention claimed is: 1. A combined machining apparatus comprising: a stage unit that includes a stage configured to support a workpiece; a mechanical machining unit that includes a mechanical machining head having a tool configured to machine the workpiece; a laser machining unit that includes a laser machining head configured to emit laser for machining the workpiece; a moving unit that includes a Y-axis moving mechanism, a first X-axis moving mechanism, a second X-axis moving mechanism, a first Z-axis moving mechanism and a second Z-axis moving mechanism, the Y-axis moving mechanism relatively moving, with respect to the workpiece, the laser machining head, the mechanical machining head and the stage in a Y-axis direction, the first X-axis moving mechanism being fixed to the Y-axis moving mechanism to relatively move, with respect to the workpiece, the mechanical machining head in an X-axis direction orthogonal to the Y-axis direction, the second X-axis moving mechanism being fixed to the Y-axis moving mechanism to relatively move, with respect to the workpiece, the laser machining head in the X-axis direction, the first Z-axis moving mechanism being fixed to the first X-axis moving mechanism to relatively move, with respect to the workpiece, the mechanical machining head in a Z-axis direction orthogonal to the Y-axis direction and the X-axis direction, and the second Z-axis moving mechanism being fixed to the second X-axis moving mechanism to relatively move the laser machining head in the Z-axis direction; and a control unit that controls the operation of each unit, wherein the laser machining head has a laser turning unit that turns the laser relative to the workpiece, and a condensing optical system that condenses the laser turned by the laser turning unit, and a position at which the workpiece is irradiated with the laser is rotated by the laser turning unit, and the laser machining unit includes, a fiber laser beam source that outputs a fiber laser, a pulse laser beam source that outputs a pulse laser, and a switching mechanism that switches a state of making the fiber laser incident on the laser turning unit, and a state of making the pulse laser incident on the laser turning unit. 2. The combined machining apparatus according to claim 1 , wherein the first X-axis moving mechanism moves along the same guide member as the second X-axis moving mechanism. 3. The combined machining apparatus according to claim 1 , wherein the mechanical machining unit has a tool exchange unit that holds at least one tool in a movement area of the mechanical machining head, and the control unit moves the mechanical machining head to a position facing the tool exchange unit using the first X-axis moving mechanism and the first Z-axis moving mechanism, and exchanges the tool mounted on the mechanical machining head using the tool exchange unit. 4. The combined machining apparatus according to claim 1 , wherein the mechanical machining unit includes at least one tool that polishes the workpiece, and the mechanical machining head polishes the workpiece by rotating the tool that polishes the workpiece. 5. The combined machining apparatus according to claim 1 , wherein the Y-axis moving mechanism has a first rail extending in the Y-axis direction, the first and second X-axis moving mechanisms have a second rail extending in the X-axis direction, and a horizontal plane is an X-Y plane including the X-axis direction and the Y-axis direction orthogonal to the X-axis direction, and a direction orthogonal to the horizontal plane is the Z-axis direction. 6. The combined machining apparatus according to claim 1 , wherein the stage unit further has a stage moving mechanism that moves the stage, and the control unit changes a posture of the workpiece by the stage moving mechanism. 7. The combined machining apparatus according to claim 6 , wherein the stage moving mechanism includes at least one mechanism that rotates the stage around orthogonal two axes. 8. A combined machining method for machining a workpiece, using a mechanical machining head having a tool configured to machine the workpiece, and a laser machining head included in a laser machining unit configured to emit laser for machining the workpiece, the method comprising: laser machining the workpiece by irradiating the workpiece with laser, after adjusting a posture of the workpiece; moving the laser machining head and the mechanical machining head and moving the mechanical machining head to a position of machining the workpiece; and mechanically machining the workpiece, after adjusting the posture of the workpiece, wherein the laser machining head has a laser turning unit that turns the laser relative to the workpiece, and a condensing optical system that condenses the laser turned by the laser tuning unit, and a position at which the workpiece is irradiated with the laser is rotated by the laser turning unit, and the laser machining unit includes, a fiber laser beam source that outputs a fiber laser, a pulse laser beam source that outputs a pulse laser, and a switching mechanism that switches a state of making the fiber laser incident on the laser turning unit, and a state of making the pulse laser incident on the laser turning unit. 9. The combined machining method according to claim 8 , wherein the workpiece is a nozzle body of an injector, an injection hole of the nozzle body is formed in the laser machining, and an internal surface of the nozzle body is polished in the mechanical machining.

Assignees

Inventors

Classifications

  • Devices involving movement of the laser head in at least one axial direction · CPC title

  • B23P23/04Primary

    for both machining and other metal-working operations · CPC title

  • Assembling; Disassembling; Manufacturing; Adjusting · CPC title

  • combined with mechanical machining or metal-working covered by other subclasses than B23K · CPC title

  • the guide member forming part of a portal · CPC title

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What does patent US10220469B2 cover?
Provided are a combined machining apparatus and a combined machining method capable of performing machining with higher accuracy and at a high speed. The apparatus has a stage unit; a mechanical machining unit including a mechanical machining head having a tool configured to machine a workpiece; a laser machining unit including a laser machining head configured to emit laser for machining the w…
Who is the assignee on this patent?
Mitsubishi Heavy Ind Ltd
What technology area does this patent fall under?
Primary CPC classification B23P23/04. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 05 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).