Printed circuit board
US-2022061147-A1 · Feb 24, 2022 · US
Flexible printed wiring board and method of manufacturing the same
US12267952B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12267952-B2 |
| Application number | US-202117791931-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 23, 2021 |
| Priority date | Jul 8, 2020 |
| Publication date | Apr 1, 2025 |
| Grant date | Apr 1, 2025 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side surfaces have an arithmetical mean roughness Ra of 0.05 μm to 2.0 μm. The wiring lines have an average height of 40 μm to 120 μm. The wiring lines have an average spacing of 1 μm to 30 μm.
First claim
Opening claim text (preview).
The invention claimed is: 1. A flexible printed wiring board comprising a base film and a plurality of wiring lines disposed on a front surface of the base film, wherein each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side surfaces have an arithmetical mean roughness Ra of 0.05 μm to 2.0 μm, the wiring lines have an average height of 40 μm to 120 μm, the wiring lines have an average spacing of 1 μm to 30 μm, and wherein a width of each of the wiring lines increases from the front surface of the base film toward the front end surface in a section perpendicular to the longitudinal direction. 2. The flexible printed wiring board according to claim 1 , wherein the front end surface has an arithmetical mean roughness Ra of 0.05 μm to 2.0 μm. 3. The flexible printed wiring board according to claim 1 , wherein the wiring lines have an average line width of 5 μm to 30 μm. 4. The flexible printed wiring board according to claim 1 , wherein the wiring lines have an average height of 40 μm to 60 μm. 5. The flexible printed wiring board according to claim 1 , wherein each of the wiring lines includes a first conductive underlying layer stacked on the front surface of the base film, a first plating layer stacked on a surface of the first conductive underlying layer opposite to the base film, and a second plating layer stacked so as to cover both side surfaces of the first conductive underlying layer, a surface of the first plating layer opposite to the first conductive underlying layer, and both side surfaces of the first plating layer, and a front end surface and side surfaces of the second plating layer respectively correspond to the front end surface and the side surfaces of the wiring line. 6. The flexible printed wiring board according to claim 5 , wherein a thickness of the second plating layer in a direction perpendicular to the side surfaces of the first plating layer increases from a contact surface between the front surface of the base film and the second plating layer towards the front end surface. 7. The flexible printed wiring board according to claim 1 , wherein each of the wiring lines includes a second conductive underlying layer stacked on the front surface of the base film, and a third plating layer stacked on a surface of the second conductive underlying layer opposite to the base film, and a front end surface of the third plating layer corresponds to the front end surface of the wiring line, and side surfaces of the second conductive underlying layer and the third plating layer correspond to the side surfaces of the wiring line.
Assignees
Inventors
Classifications
Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title
Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title
Electroplating, e.g. finish plating · CPC title
Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites · CPC title
Process control or regulation (controlling or regulating in general G05) · CPC title
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Frequently asked questions
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- What does patent US12267952B2 cover?
- A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side…
- Who is the assignee on this patent?
- Sumitomo Electric Industries, Sumitomo Electric Printed Circuits Inc
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0296. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 01 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).