Plasma measurement method

US12237157B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12237157-B2
Application numberUS-202217893621-A
CountryUS
Kind codeB2
Filing dateAug 23, 2022
Priority dateSep 1, 2021
Publication dateFeb 25, 2025
Grant dateFeb 25, 2025

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Abstract

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Measuring a plasma state using a probe device in the case of performing plasma processing on a substrate by introducing process gas into a processing container accommodating the substrate and by producing pulsed plasma using an electromagnetic wave pulse obtained by processing an electromagnetic wave generated from an electromagnetic wave oscillator using a pulsing device. An AC voltage to the pulsed plasma is applied via the probe device; transmitting a signal from the pulsed plasma based on the AC voltage via the probe device and measuring data including a current value; and obtaining a state of the pulsed plasma by analyzing the measured data. The frequency of the AC voltage deviates from a frequency of the electromagnetic wave pulse so that the number of data required for the measurement of the pulsed plasma within one cycle of the electromagnetic wave pulse is obtained within allowable time.

First claim

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What is claimed is: 1. A plasma measurement method for measuring a plasma state using a probe device in the case of performing plasma processing on a substrate by introducing process gas into a processing container accommodating the substrate and by producing pulsed plasma using an electromagnetic wave pulse, wherein the electromagnetic wave pulse is obtained by processing an electromagnetic wave generated from an electromagnetic wave oscillator using a pulsing device, the method comprising: Applying an AC voltage to the pulsed plasma using the probe device; transmitting a signal from the pulsed plasma based on the AC voltage using the probe device and measuring data including a current value; and obtaining a state of the pulsed plasma by analyzing the measured data; wherein a frequency of the AC voltage is deviated from a frequency of the electromagnetic wave pulse so that the number of data required for the measurement of the pulsed plasma within one cycle of the electromagnetic wave pulse is obtained within allowable time, wherein when the frequency of the AC voltage is f probe and the frequency of the electromagnetic wave pulse is f pulse , the conditions shown in the following Eqs. (1), (2), and (3) are satisfied: 0 ≤ max ⁡ ( f p ⁢ r ⁢ obe , f pulse ) min ⁡ ( f p ⁢ r ⁢ obe , f pulse ) - n m ≤ 1 max ⁡ ( f p ⁢ r ⁢ obe , f pulse ) ⁢ T max Eq . ( 1 ) max ⁡ ( m , n ) ≥ 10 Eq . ( 2 ) max ⁡ ( m , n ) max ⁡ ( f p ⁢ r ⁢ obe , f pulse ) < T max , Eq . ( 3 ) wherein m and n represent a set of minimum positive integers satisfying the Eq. (1), and T max represents an upper limit of the allowable time for measuring the data. 2. The plasma measurement method of claim 1 , wherein the AC voltage is continuously applied for a period of a plurality of electromagnetic wave pulses, and data of different points of the plurality of electromagnetic wave pulses are superimposed, so that the number of data within one cycle of the electromagnetic wave pulse is obtained. 3. The plasma measurement method of claim 1 , wherein T max is 10 sec or less. 4. The plasma measurement method of claim 1 , wherein the data including the current value is a current value as a two-variable function with voltage and time as variables. 5. The plasma measurement method of claim 1 , wherein the frequency of the AC voltage is within a range of 500

Assignees

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Classifications

  • Software, data control or modelling · CPC title

  • Amplitude modulation, includes pulsing · CPC title

  • by using microwaves · CPC title

  • Monitoring and controlling tubes by information coming from the object and/or discharge · CPC title

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What does patent US12237157B2 cover?
Measuring a plasma state using a probe device in the case of performing plasma processing on a substrate by introducing process gas into a processing container accommodating the substrate and by producing pulsed plasma using an electromagnetic wave pulse obtained by processing an electromagnetic wave generated from an electromagnetic wave oscillator using a pulsing device. An AC voltage to the …
Who is the assignee on this patent?
Tokyo Electron Ltd
What technology area does this patent fall under?
Primary CPC classification H01J37/32146. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 25 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).