Systems and methods for producing ultrapure water for semiconductor fabrication processes

Patent metadata

Field	Value
Publication number	US-12221371-B2
Application number	US-202217699371-A
Country	US
Kind code	B2
Filing date	Mar 21, 2022
Priority date	Mar 21, 2022
Publication date	Feb 11, 2025
Grant date	Feb 11, 2025

Abstract

Systems and methods for producing ultrapure water (UPW) for use in semiconductor fabrication include an ABA module that performs an advanced oxidation process (AOP) pre-treatment step, a bioremediation step, and an advanced oxidation process post-treatment step. Raw water flows through the ABA module, which is part of a water treatment system for producing ultrapure water. The ultrapure water is then used in a semiconductor fabrication process.

First claim

What is claimed is:

1. A method for producing ultrapure water (UPW) for use in semiconductor fabrication, comprising:
treating raw water in a water treatment process to obtain the ultrapure water, wherein the water treatment process includes:
an ABA module that performs:
an advanced oxidation process (AOP) pre-treatment step that feeds a bioremediation step; and
an advanced oxidation process post-treatment step that is fed by the bioremediation step,
wherein the ABA module is directly upstream of a resin adsorption unit;

a membrane degasification (MDG) unit downstream of the resin adsorption unit; and
an ultrafiltration (UF) unit downstream of the MDG unit;
wherein the raw water has a total organic carbon (TOC) content of greater than 0.1 ppm, and the resulting ultrapure water has a total organic carbon (TOC) content of less than 1.0 ppb.

2. The method of claim 1 , wherein the AOP pre-treatment step or the AOP post-treatment step is performed in an oxidation reactor which includes an ozone (O 3 ) feed and ultraviolet light.

3. The method of claim 2 , wherein the oxidation reactor also includes a hydrogen peroxide (H 2 O 2 ) feed.

4. The method of claim 1 , wherein the oxidation reactor is sized for a hydraulic retention time of about 5 minutes to about 1 hour.

5. The method of claim 1 , wherein the bioremediation step is performed in a biological reactor and a settler.

6. The method of claim 5 , wherein the biological reactor is sized for a hydraulic retention time of about 1 hour to about 6 hours.

7. The method of claim 1 , wherein the ABA module is directly downstream from a raw water tank (RWT), or an activated carbon filter (ACF), or an ultraviolet (UV) unit.

8. The method of claim 1 , wherein the resin adsorption unit is a 2-bed 3-tower (2B3T) unit, a stratified bed polisher (SBP) unit, or a cautionary polish (CP) unit.

9. The method of claim 1 , wherein the water treatment process further comprises, located upstream of the ABA module:
a multi-media filter (MMF); and
an activated carbon filter (ACF).

10. A method for reclaiming waste water from a semiconductor manufacturing process, comprising:
treating the waste water to produce an effluent;
treating the effluent in an ABA module that performs:
an advanced oxidation process (AOP) pre-treatment step that feeds a bioremediation step; and
an advanced oxidation process post-treatment step that is fed by the bioremediation step; and

sending the treated effluent to a raw water tank;
wherein the ABA module comprises a biological reactor that receives a feed from a first oxidation reactor, a settler that receives a feed from the biological reactor, and a recycle loop from the settler to the first oxidation reactor, and an output from the biological reactor or the settler to a subsequent water treatment step.

11. The method of claim 10 , wherein the raw water tank provides a feed to an ultrapure water production system.

12. A method for producing ultrapure water (UPW) for use in semiconductor fabrication, comprising:
treating raw water in a water treatment system which includes:
a multi-media filter (MMF);
an activated carbon filter (ACF) downstream of the MMF;
an ABA module downstream of the ACF that comprises:
a first oxidation reactor for performing an advanced oxidation process (AOP) treatment; and
a biological reactor that receives a feed from the first oxidation reactor for performing bioremediation; and

a resin adsorption unit directly downstream of the ABA module;
wherein the raw water has a total organic carbon (TOC) content of greater than 0.1 ppm, and the resulting ultrapure water has a total organic carbon (TOC) content of less than 1.0 ppb.

13. The method of claim 12 , wherein the ABA module further comprises a settler that receives a feed from the biological reactor.

14. The method of claim 13 , further comprising a recycle loop from the settler to the first oxidation reactor, or further comprising a second oxidation reactor for performing an (AOP) treatment which receives a feed from the settler.

15. The method of claim 12 , further comprising a recycle loop from the biological reactor to the first oxidation reactor, or further comprising a second oxidation reactor for performing an (AOP) treatment which receives a feed from the biological reactor.

16. The method of claim 12 , wherein the resin adsorption unit is a 2-bed 3-tower (2B3T) unit, a stratified bed polisher (SBP) unit, or a cautionary polish (CP) unit.

17. The method of claim 12 , wherein the resin adsorption unit is a 2-bed 3-tower (2B3T) unit, and the water treatment system further comprises, in sequence:
a reverse osmosis (RO) unit downstream of the 2B3T unit;
a first ultraviolet (UV) unit;
a stratified bed polisher (SBP) unit;
a first membrane degasification (MDG) unit; and
an ultrafiltration (UF) unit.

18. The method of claim 17 , wherein the water treatment system further comprises, in sequence, a second ultraviolet (UV) unit, a cautionary polish (CP) unit, and a second membrane degasification (MDG) unit;
wherein the second ultraviolet (UV) unit is directly downstream of the first MDG unit and the second MDG unit is directly upstream of the UF unit.

19. The method of claim 12 , wherein the resin adsorption unit is a stratified bed polisher (SBP) unit, and the water treatment system further comprises:
a 2-bed 3-tower (2B3T) unit downstream of the ACF;
a first reverse osmosis (RO) unit downstream of the 2B3T unit;
a first ultraviolet (UV) unit downstream of the first RO unit;
a first membrane degasification (MDG) unit downstream of the SBP unit;
a second ultraviolet (UV) unit;
a cautionary polish (CP) unit;
a second membrane degasification (MDG) unit; and
an ultrafiltration (UF) unit.

20. The method of claim 12 , wherein the resin adsorption unit is a cautionary polish (CP) unit, and the water treatment system further comprises:
a 2-bed 3-tower (2B3T) unit downstream of the ACF;
a first reverse osmosis (RO) unit downstream of the 2B3T unit;
a first ultraviolet (UV) unit downstream of the first RO unit;
a stratified bed polisher (SBP) unit downstream of the first UV unit;
a first membrane degasification (MDG) unit downstream of the SBP unit;
a second ultraviolet (UV) unit downstream of the first MDG unit and upstream of the ABA module;
a second membrane degasification (MDG) unit downstream of the CP unit; and
an ultrafiltration (UF) unit.

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Lin En Tian
• Chiang Shih-Hsiung

Classifications

• H10P76/2041

  Photolithographic processes · CPC title

• G03F7/70341 Primary

  Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply (chemical composition of immersion liquids G03F7/2041) · CPC title

• C02F3/1268

  Membrane bioreactor systems · CPC title

• C02F1/444

  by ultrafiltration or microfiltration · CPC title

• C02F1/20

  by degassing, i.e. liberation of dissolved gases (degasification of liquids in general B01D19/00; arrangement of degassing apparatus in boiler feed supply F22D) · CPC title