Active thermal interposer device

Patent metadata

Field	Value
Publication number	US-12216154-B2
Application number	US-202318204309-A
Country	US
Kind code	B2
Filing date	May 31, 2023
Priority date	Dec 4, 2020
Publication date	Feb 4, 2025
Grant date	Feb 4, 2025

Abstract

A stand-alone active thermal interposer device for use in testing an unpackaged integrated circuit device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

First claim

We claim:

1. A discrete active thermal interposer device for use in testing an unpackaged integrated circuit device under test (“DUT”), said discrete active thermal interposer device comprising:
a body layer comprising a first surface and a second surface, wherein said first surface is operable to be disposed adjacent to a cold plate; and
a plurality of heating zones defined across the second surface of said body layer, said plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, said plurality of heating zones operable to heat a plurality of areas of the DUT when a surface of said DUT is disposed on said second surface of said body layer during testing of said DUT.

2. The active thermal interposer device as described in claim 1 wherein each heating zone of said plurality of heating zones comprises resistive traces for providing heat responsive to a voltage/current signal applied thereto as controlled by said thermal controller.

3. The active thermal interposer device as described in claim 2 wherein said body layer further comprises a plurality of pogo pin mechanical/electrical interfaces for mating with corresponding pogo pins of a thermal array, said plurality of pogo pin mechanical/electrical interfaces operable to input voltage/current signals from said thermal array for supply to said plurality of heating zones and also operable to output temperature sensor data corresponding to said plurality of heating zones.

4. The active thermal interposer device as described in claim 2 further comprising a grounded shield layer disposed on top of said second surface of said body layer and on top of said plurality of heating zones, said grounded shield layer operable to isolate said DUT from electro magnetic interference radiation resultant from energizing heating zones of said plurality of heating zones.

5. The active thermal interposer device as described in claim 1 wherein said body layer further comprises a two dimensional identification code viewable thereon and wherein said two dimensional identification code is operable to be machine read and provides one of:
calibration values for a resistance temperature detector of the active thermal interposer device;
identification information for identifying the active thermal interposer device; and
security information for authenticating the active thermal interposer device.

6. The active thermal interposer device as described in claim 1 wherein said body layer further comprises alignment features disposed on said first surface, said alignment features for providing alignment between power pins of said active thermal interposer device and pads of a thermal head of a tester system, and wherein said thermal head comprises said cold plate.

7. The active thermal interposer device as described in claim 1 wherein said DUT comprises a single die.

8. The active thermal interposer device as described in claim 1 wherein said DUT comprises a plurality of die.

9. The active thermal interposer device as described in claim 1 further comprising a securing mechanism disposed with respect to said second surface of said body layer, said securing mechanism operable to secure said surface of said DUT to said second surface of said body layer during said testing.

10. The active thermal interposer device as described in claim 1 wherein said DUT comprises a die and wherein further said plurality of heating zones are operable to be selectively energized for selectively heating and maintaining temperatures of said die during said testing.

11. The active thermal interposer device as described in claim 1 further comprising a Peltier/TEC cooling layer disposed on said first surface of said body layer.

12. The active thermal interposer device as described in claim 11 wherein said body layer further comprises a plurality of pogo pin mechanical interfaces, said plurality of pogo pin mechanical interfaces operable to input voltage/current signals for supply to said plurality of heating zones and also operable to output temperature sensor data corresponding to said plurality of heating zones and also operable to input signals to control said Peltier/TEC cooling layer.

13. A method of testing an unpackaged integrated circuit device under test (“DUT”) using an automated handler system and a tester system, said method comprising:
using a handler, automatically picking up an active thermal interposer device and automatically positioning said active thermal interposer with respect to a thermal head and adjacent to a cold plate thereof;
using said handler, automatically picking up said DUT from a tray and automatically placing said DUT adjacent to said active thermal interposer;
using an optical sensor to determine if said DUT is aligned with respect to said active thermal interposer; and
testing said DUT and concurrently during said testing maintaining a temperature thereof using said cold plate in combination with said active thermal interposer.

14. A method as described in claim 13 wherein said using a handler, automatically picking up an active thermal interposer device, is performed by a first pick-and-place head of said handler and wherein further said using said handler, automatically picking up said DUT from a tray and automatically placing said DUT adjacent to said active thermal interposer, is performed by a second pick-and-place head of said handler.

15. A method as described in claim 13 wherein said using a handler, automatically picking up an active thermal interposer device, further comprises using an optical reader to read a two dimensional identification code disposed on said active thermal interposer device and wherein further said two dimensional identification code provides information including one of: an identification of said active thermal interposer device; thermal calibration data regarding said active thermal interposer device; and authentication information regarding said active thermal interposer device and further comprising relaying said information to said tester system.

16. A method as described in claim 13 wherein said DUT comprises a single die.

17. A method as described in claim 13 wherein said DUT comprises a plurality of die.

18. A method of testing an unpackaged integrated circuit device under test (DUT) using an automated handler system and a tester system, said method comprising:
using a first pick-and-place head of said handler, automatically picking up an active thermal interposer device and automatically placing said active thermal interposer device adjacent to a cold plate of a thermal head;
using a second pick-and-place head of said handler, automatically picking up said DUT from a tray and automatically placing said DUT onto a surface of said active thermal interposer device;
wherein said DUT is aligned with said active thermal interposer device using alignment features of said active thermal interposer device; and
testing said DUT.

19. A method as described in claim 18 further comprising maintaining prescribed temperatures of said DUT during said testing using said cold plate in combination with said active thermal interposer device.

20. A method as described in claim 19 wherein said DUT comprises a single die.

Assignees

• Advantest Test Solutions Inc

Inventors

• Kabbani Samer
• Ferrari Paul
• Hiroki Ikeda
• Toshiyuki Kiyokawa
• Cruzan Gregory
• Ranganathan Karthik
• Berk Todd
• Williams Ian
• Ghazvini Mohammad
• Jones Thomas

Classifications

• G01R31/2874

  related to temperature · CPC title

• G01R1/0458

  related to environmental aspects, e.g. temperature · CPC title

• G01R31/2863

  Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04) · CPC title

• G01R31/2867

  Handlers or transport devices, e.g. loaders, carriers, trays · CPC title

• H10N10/10

  operating with only the Peltier or Seebeck effects · CPC title