Frequency-modulating sensor array

Patent metadata

Field	Value
Publication number	US-12216016-B2
Application number	US-202418649771-A
Country	US
Kind code	B2
Filing date	Apr 29, 2024
Priority date	Sep 12, 2016
Publication date	Feb 4, 2025
Grant date	Feb 4, 2025

Abstract

Spatially-distributed resonant MEMS sensors are coordinated to generate frequency-modulated signals indicative of regional contact forces, ambient conditions and/or environmental composition.

First claim

What is claimed is:

1. A device comprising:
a surface having a region that is to receive a contact force;
a microelectromechanical systems (MEMS) resonator mounted relative to the region, the MEMS resonator having a body that is to vibrate under application of a drive signal and an electrode to generate an output that varies in dependence on a sensed resonant frequency of vibration of the MEMS resonator, wherein the sensed resonant frequency of vibration is to vary dependent on the contact force received by the region; and
circuitry to sample the output at discrete times and, dependent on the samples, to generate a digital value dependent on a change, in the sensed resonant frequency of vibration, caused by variation in the contact force, where the change corresponds to a threshold condition.

2. The device of claim 1 wherein the threshold condition corresponds to a threshold amount of contact force.

3. The device of claim 1 wherein the threshold condition corresponds to a threshold resonant frequency difference between respective ones of the samples.

4. The device of claim 1 wherein the circuitry and the MEMS resonator are configured to operate as a switch, and wherein the digital value represents a switch output value which is dependent on application of a threshold contact force.

5. The device of claim 1 wherein the device further comprises an electrical contact that is to output the digital value.

6. The device of claim 1 , embodied as an integrated circuit die, further comprising an electrical contact on an exterior surface of the integrated circuit die that is to output the digital value.

7. The device of claim 1 wherein:
the region is a first region, the MEMS resonator is a first MEMS resonator, the output is a first output and the digital value is a first digital value;
the surface has a second region that is to receive a contact force;
the device further comprises a second MEMS resonator mounted relative to the second region, the second MEMS resonator also having a body that is to vibrate under application of a drive signal and an electrode to generate a second output that varies in dependence on a sensed resonant frequency of vibration of the second MEMS resonator, wherein the sensed resonant frequency of vibration of the second MEMS resonator is to vary dependent on the contact force received by the second region; and
the device also comprises circuitry to sample the second output at discrete times and, dependent on the samples, to generate a second digital value dependent on a change, in the sensed resonant frequency of vibration of the second MEMS resonator, caused by variation in the contact force received by the second region, which corresponds to a threshold condition.

8. The device of claim 7 wherein the device further comprises an electrical contact that is to output the first digital value and an electrical contact that is to output the second digital value.

9. The device of claim 8 wherein the electrical contact that is to output the first digital value and the electrical contact that is to output the second digital value are the same contact.

10. The device of claim 1 wherein:
the device further comprises a substrate and a lid, the MEMS resonator being anchored to the substrate and being encapsulated within a cavity by the substrate and the lid; and
at least one of the substrate or the lid comprises a form factor that is to be deformed as a function of the contact force.

11. The device of claim 10 wherein the at least one of the substrate or the lid is conformally adhered to the surface.

12. An integrated circuit device comprising:
a surface having a plurality of regions that are each to receive a contact force;
for each corresponding one of the regions, a respective microelectromechanical systems (MEMS) resonator mounted relative to the corresponding one of the regions, each MEMS resonator having a body that is to vibrate under application of a drive signal and an electrode to generate a respective output that varies in dependence on a sensed resonant frequency of vibration of the respective MEMS resonator, wherein the sensed resonant frequency of vibration is to vary dependent on the contact force received by the corresponding one of the regions; and
circuitry to sample, at discrete times, each of the outputs and, dependent on the samples, to generate, for each of the regions, a digital value dependent on a change, in the corresponding sensed resonant frequency of vibration, caused by variation in the contact force received by the corresponding one of the regions, which corresponds to a threshold condition.

13. The integrated circuit device of claim 12 wherein the threshold condition for each one of the regions corresponds to a threshold amount of contact force to be received by the corresponding one of the regions.

14. The integrated circuit device of claim 12 wherein the threshold condition for each corresponding one of the regions corresponds to a threshold resonant frequency difference represented by respective ones of the samples for the respective MEMS resonator.

15. The integrated circuit device of claim 12 wherein the integrated circuit device is configured to operate each respective MEMS resonator as a switch, and wherein the digital value for the respective MEMS resonator represents a value output by the corresponding switch in response to application of a threshold contact force.

16. The integrated circuit device of claim 12 wherein the integrated circuit device further comprises an external electrical contact that is to output the digital values for two or more of the plurality of regions, on a time-multiplexed basis.

17. The integrated circuit device of claim 12 wherein:
the integrated circuit die further comprises a substrate and a lid, each MEMS resonator being anchored to the substrate and being encapsulated within a cavity by the substrate and the lid; and
at least one of the substrate or the lid comprises a form factor that is to be deformed as a function of applied contact force.

18. The integrated circuit device of claim 17 wherein the at least one of the substrate or the lid is conformally adhered to the surface.

19. The integrated circuit device of claim 12 wherein the circuitry is to take each of the samples in dependence on a sampling clock signal.

20. The integrated circuit device of claim 19 wherein each respective MEMS resonator is a respective first MEMS resonator, wherein the integrated circuit device comprises a second MEMS resonator, and wherein the integrated circuit device further comprises circuitry to generate the sampling clock signal dependent on a sensed resonant frequency of the second MEMS resonator.

Assignees

• Sitime Corp

Inventors

• Hagelin Paul M
• Grosjean Charles I
• Goncharov Lev

Classifications

• G01L9/001

  of an element not provided for in the following subgroups of G01L9/0008 · CPC title

• G01L1/205

  using distributed sensing elements · CPC title

• G01L1/146

  for measuring force distributions, e.g. using force arrays (G01L1/148 takes precedence) · CPC title

• G01L5/16 Primary

  for measuring several components of force · CPC title