Method of grinding plate-shaped workpiece

Patent metadata

Field	Value
Publication number	US-12208489-B2
Application number	US-202217651298-A
Country	US
Kind code	B2
Filing date	Feb 16, 2022
Priority date	Feb 22, 2021
Publication date	Jan 28, 2025
Grant date	Jan 28, 2025

Abstract

One array of grindstones is used for in-feed grinding and creep-feed grinding. Therefore, it is not necessary to position a chuck table that is holding a plate-shaped workpiece with respect to two different arrays of grindstones. As a result, a period of time required to grind the plate-shaped workpiece can be shortened. Furthermore, lower surfaces of the grindstones are used for the in-feed grinding, whereas side surfaces of the grindstones are used for the creep-feed grinding. Consequently, the amount by which the grindstones are worn can be smaller than that in a case where the plate-shaped workpiece is ground to a predetermined thickness in only the in-feed grinding or the creep-feed grinding.

First claim

What is claimed is:

1. A method of grinding a plate-shaped workpiece held on a holding surface of a chuck table with an annular array of grindstones, comprising:
an in-feed grinding step of
rotating the chuck table about a table rotational axis extending through a center of the holding surface that is holding the plate-shaped workpiece,
positioning the grindstones above the holding surface such that lower surfaces of the grindstones will move across the center of the holding surface and rotating the grindstones about a grindstone rotational axis extending through the center of the annular array of the grindstones, and
moving the grindstones and the chuck table relatively to each other in directions perpendicular to the holding surface to grind a face side of the plate-shaped workpiece to a first target thickness with the lower surfaces of the grindstones; and

a creep-feed grinding step of
positioning the lower surfaces of the grindstones used in the in-feed grinding step at a position outward of an outer peripheral edge of the plate-shaped workpiece, and lower than the face side of the plate-shaped workpiece by a distance equal to a difference between the first target thickness and a second target thickness, after the in-feed grinding step,
stopping rotating the chuck table, and
moving the plate-shaped workpiece and the grindstones relatively to each other in directions parallel to the holding surface to grind the entire face side of the plate-shaped workpiece to the second target thickness, with side surfaces of the rotating grindstones.

2. The method according to claim 1 , further comprising:
a pre-creep-feed grinding step to be carried out before the in-feed grinding step, wherein
the pre-creep-feed grinding step includes
positioning the lower surfaces of the grindstones to be used in the in-feed grinding step at a position outward of the outer peripheral edge of the plate-shaped workpiece and lower than the face side of the plate-shaped workpiece, and
moving the plate-shaped workpiece and the grindstones relatively to each other in directions parallel to the holding surface to grind the face side of the plate-shaped workpiece with side surfaces of the rotating grindstones.

3. The method according to claim 1 , further comprising:
a tilt changing step, to be carried out after the in-feed grinding step but before a start of the creep-feed grinding step, of tilting the grindstone rotational axis of the grindstones with respect to the holding surface and with respect to the face side of the plate-shaped workpiece held on the holding surface of the chuck table from vertical directions slightly along the direction in which the plate-shaped workpiece is moved with respect to the grindstones in the creep-feed grinding step.

4. The method according to claim 1 , wherein
in the creep-feed grinding step, a controller finishes the creep-feed grinding step after confirming that a measured thickness of the plate-shaped workpiece has reached the second target thickness; and
if the measured thickness of the plate-shaped workpiece has not reached the second target thickness, the controller carries out the creep-feed grinding step again.

5. The method according to claim 3 , wherein
in the pre-creep-feed grinding step, a plurality of creep-feed grinding sessions are performed;
a camera is controlled by a controller to capture an image of the face side of the plate-shaped workpiece to recognize a ratio at which silicon chips and electrodes have appeared on the face side of the plate-shaped workpiece; and
if the ratio recognized has reached a predetermined ratio, then the controller finishes the pre-creep-feed grinding step.

6. The method according to claim 1 , wherein after the creep-feed grinding step, the grindstones leave arcuate creep-feed grinding marks on the upper surface of the workpiece.

7. The method according to claim 6 , wherein the creep-feed grinding marks are continuously spaced apart at essentially equal intervals on the upper surface of the workpiece.

8. The method according to claim 1 , wherein the workpiece has a rectangular shape and having a long dimension and a short dimension, the annular array of grindstones has an inside diameter larger than the short dimension of the workpiece.

9. A method of grinding a plate-shaped workpiece held on a holding surface of a chuck table with an annular array of grindstones, the workpiece having a face side and a reverse side, the workpiece comprising a plurality of chips and electrodes covered on the face side with a resin layer, comprising:
an in-feed grinding step of
rotating the chuck table about a table rotational axis extending through a center of the holding surface that is holding the plate-shaped workpiece,
positioning the grindstones above the holding surface such that lower surfaces of the grindstones will move across the center of the holding surface and rotating the grindstones about a grindstone rotational axis extending through the center of the annular array of the grindstones, and
moving the grindstones and the chuck table relatively to each other in directions perpendicular to the holding surface to grind the face side of the plate-shaped workpiece with the lower surfaces of the grindstones until at least some of the chips and electrodes are exposed on the face side of the workpiece; and

a creep-feed grinding step of
positioning the lower surfaces of the grindstones used in the in-feed grinding step at a position outward of an outer peripheral edge of the plate-shaped workpiece and lower than the face side of the plate-shaped workpiece after the in-feed grinding step,
stopping rotating the chuck table, and
moving the plate-shaped workpiece and the grindstones relatively to each other in directions parallel to the holding surface to grind the face side of the plate-shaped workpiece with side surfaces of the rotating grindstones to thereby grind away portions of the chips and electrodes.

10. The method according to claim 9 , further comprising:
a pre-creep-feed grinding step to be carried out before the in-feed grinding step, wherein
the pre-creep-feed grinding step includes
positioning the lower surfaces of the grindstones to be used in the in-feed grinding step at a position outward of the outer peripheral edge of the plate-shaped workpiece and lower than the face side of the plate-shaped workpiece, and
moving the plate-shaped workpiece and the grindstones relatively to each other in directions parallel to the holding surface to grind the face side of the plate-shaped workpiece with side surfaces of the rotating grindstones.

11. The method according to claim 9 , further comprising:
a tilt changing step, to be carried out after the in-feed grinding step but before a start of the creep-feed grinding step, of tilting the grindstone rotational axis of the grindstones with respect to the holding surface and with respect to the face side of the plate-shaped workpiece held on the holding surface of the chuck table from vertical directions slightly along the direction in which the plate-shaped workpiece is moved with respect to the grindstones in the creep-feed grinding step.

12. The method according to claim 9 , wherein after the creep-feed grinding step, the grindstones leave arcuate creep-feed grinding marks on the face side of the workpiece.

13. The method according to claim 12 , wherein the creep-feed grinding marks are continuously spaced apart at essentially equal intervals on the face side of the workpiece.

Assignees

• Disco Corp

Inventors

• Yamanaka Satoshi
• Miyamoto Hiroki
• Nakano Keisuke
• SHIMAZU Ryo

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B41/06

  Work supports, e.g. adjustable steadies (B24B37/27 takes precedence) · CPC title

• B24B51/00

  Arrangements for automatic control of a series of individual steps in grinding a workpiece (if applicable to other machine tools, G05B takes precedence) · CPC title

• B24B49/02

  according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent (B24B49/12 takes precedence) · CPC title

• B24B41/068

  Table-like supports for panels, sheets or the like · CPC title