Substrate polishing method, substrate polishing apparatus, and computer-readable storage medium storing program

Patent metadata

Field	Value
Publication number	US-2025025984-A1
Application number	US-202218716460-A
Country	US
Kind code	A1
Filing date	Nov 8, 2022
Priority date	Dec 14, 2021
Publication date	Jan 23, 2025
Grant date	—

Abstract

The present invention relates to a substrate polishing method of polishing a substrate, such as a wafer, by pressing a polishing tape against the substrate. The substrate polishing method includes: storing an actual polishing condition for a substrate that has been polished in the past and an actual amount of use of a polishing tape under the actual polishing condition in a database (21a), with the actual polishing condition and the actual amount of use associated with each other, searching the database (21a) for an actual polishing condition that matches a preset polishing condition for a polishing-target substrate before polishing of the polishing-target substrate, determining a predicted amount of use of the polishing tape necessary for polishing the polishing-target substrate which is an actual amount of use of the polishing tape associated with the actual polishing condition that matches the preset polishing condition; comparing a remaining amount of the polishing tape to be used for polishing of the polishing-target substrate with the determined predicted amount of use; and when the remaining amount of the polishing tape is equal to or larger than the predicted amount of use, polishing the polishing-target substrate by a polishing module (4A, 4B).

First claim

1 . A substrate polishing method comprising:
storing, in a database, an actual polishing condition for at least one substrate that has been polished in the past and an actual amount of use of a polishing tape under the actual polishing condition, with the actual polishing condition and the actual amount of use associated with each other; searching the database for an actual polishing condition that matches a preset polishing condition for a polishing-target substrate before polishing of the polishing-target substrate; determining a predicted amount of use of a polishing tape necessary for polishing the polishing-target substrate which is an actual amount of use of the polishing tape associated with the actual polishing condition that matches the preset polishing condition; comparing a remaining amount of the polishing tape to be used for polishing of the polishing-target substrate with the determined predicted amount of use; and when the remaining amount of the polishing tape is equal to or larger than the predicted amount of use, polishing the polishing-target substrate by a polishing module.

2 . The substrate polishing method according to claim 1 ,
wherein determining the predicted amount of use comprises, when an actual polishing condition that matches the preset polishing condition does not exist in the database, determining the predicted amount of use by calculating the predicted amount of use of the polishing tape to be used for polishing of the polishing-target substrate based on the preset polishing condition.

3 . The substrate polishing method according to claim 1 , wherein the actual polishing condition includes a polishing-head identifier for identifying a polishing head of a plurality of polishing heads that has been used in polishing of at least one substrate in the past, and
the preset polishing condition includes a polishing-head identifier for identifying a polishing head to be used for polishing of the polishing-target substrate.

4 . The substrate polishing method according to claim 1 , wherein the actual polishing condition includes a polishing-tape identifier for identifying a type of polishing tape of a plurality of types of polishing tapes that has been used in polishing of at least one substrate in the past, and
the preset polishing condition includes a polishing-tape identifier for identifying a type of polishing tape to be used for polishing of the polishing-target substrate.

5 . The substrate polishing method according to claim 1 , wherein the actual polishing condition comprises polishing conditions for a plurality of polishing processes performed in polishing of at least one substrate that has been polished in the past,
the actual amount of use comprises an actual amount of use of a polishing tape that has been used from start to end of polishing including the plurality of polishing processes, and the preset polishing condition comprises polishing conditions for a plurality of polishing processes applied to polishing of the polishing-target substrate.

6 . The substrate polishing method according to claim 1 , further comprising:
generating a hash value corresponding to the actual polishing condition and storing the actual amount of use and the hash value in the database, with the actual amount of use and the hash value associated with each other; and generating a searching hash value corresponding to the preset polishing condition for the polishing-target substrate and searching the database for a hash value that matches the searching hash value, wherein determining the predicted amount of use comprises determining the predicted amount of use of the polishing tape necessary for polishing the polishing-target substrate which is an actual amount of use of the polishing tape associated with the hash value that matches the searching hash value.

7 . A substrate polishing apparatus comprising:
a polishing module configured to polish a substrate with a polishing tape; and a control system including a database and an arithmetic device, wherein the control system is configured to:
store, in the database, an actual polishing condition for at least one substrate that has been polished in the past and an actual amount of use of a polishing tape under the actual polishing condition, with the actual polishing condition and the actual amount of use associated with each other;
search the database for an actual polishing condition that matches a preset polishing condition for a polishing-target substrate before polishing of the polishing-target substrate;
determine a predicted amount of use of the polishing tape necessary for polishing the polishing-target substrate which is an actual amount of use of the polishing tape associated with the actual polishing condition that matches the preset polishing condition;
compare a remaining amount of the polishing tape to be used for polishing of the polishing-target substrate with the determined predicted amount of use; and
when the remaining amount of the polishing tape is equal to or larger than the predicted amount of use, instruct the polishing module to polish the polishing-target substrate.

8 . The substrate polishing apparatus according to claim 7 , wherein the control system is configured to calculate the predicted amount of use of the polishing tape to be used for polishing of the polishing-target substrate based on the preset polishing condition when an actual polishing condition that matches the preset polishing condition does not exist in the database.

9 . The substrate polishing apparatus according to claim 7 , wherein the actual polishing condition includes a polishing-head identifier for identifying a polishing head of a plurality of polishing heads that has been used in polishing of at least one substrate in the past, and
the preset polishing condition includes a polishing-head identifier for identifying a polishing head to be used for polishing of the polishing-target substrate.

10 . The substrate polishing apparatus according to claim 7 , wherein the actual polishing condition includes a polishing-tape identifier for identifying a type of polishing tape of a plurality of types of polishing tapes that has been used in polishing of at least one substrate in the past, and
the preset polishing condition includes a polishing-tape identifier for identifying a type of polishing tape to be used for polishing of the polishing-target substrate.

11 . The substrate polishing apparatus according to claim 7 , wherein the actual polishing condition comprises polishing conditions for a plurality of polishing processes performed in polishing of at least one substrate that has been polished in the past,
the actual amount of use comprises an actual amount of use of a polishing tape that has been used from start to end of polishing including the plurality of polishing processes, and the preset polishing condition comprises polishing conditions for a plurality of polishing processes applied to polishing of the polishing-target substrate.

12 . The substrate polishing apparatus according to claim 7 , wherein the control system is configured to:
generate a hash value corresponding to the actual polishing condition and store the actual amount of use and the hash value in the database, with the actual amount of use and the hash value associated with each other; generate a searching hash value corresponding to the preset polishing condition for the polishing-target substrate and search the database for a hash value that matches the searching hash value; and determine the predicted amount of use of the polishing tape necessary for polishing the polishing-target substrate which is an actual amount

Assignees

• Ebara Corp

Inventors

• Fujiki Masayuki
• Kiyosawa Nobuhito

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B49/05 Primary

  including the measurement of a first workpiece already machined and of another workpiece being machined and to be matched with the first one · CPC title

• B24B7/02 Primary

  involving a reciprocatingly-moved work-table (involving a reciprocatingly-moved grinding wheel in combination with a stationary work-table B24B7/07) · CPC title

• B23Q15/00

  Automatic control or regulation of feed movement, cutting velocity or position of tool or work · CPC title

• B24B49/00

  Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (B24B33/06, B24B37/005 take precedence; if applicable to other machine tools, B23Q15/00 - B23Q17/00 take precedence) · CPC title