US12203007B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12203007-B2 |
| Application number | US-202117384061-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 23, 2021 |
| Priority date | Nov 23, 2016 |
| Publication date | Jan 21, 2025 |
| Grant date | Jan 21, 2025 |
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A polishing liquid for polishing a glass substrate includes cerium oxide as polishing abrasive particles, and a substance that reduces cerium oxide in response to irradiation of light.
Opening claim text (preview).
The invention claimed is: 1. A polishing liquid for polishing a glass substrate, the polishing liquid comprising: as polishing abrasive particles, a particle including a cerium oxide particle and a substance for reducing cerium oxide in response to irradiation of light which are integrally formed in a state in which the substance for reducing cerium oxide in response to the irradiation of the light is in contact with a surface of the cerium oxide particle, the substance for reducing cerium oxide in response to the irradiation of the light being gallium oxide. 2. The polishing liquid according to claim 1 , wherein a band gap of the substance for reducing cerium oxide in response to the irradiation of the light is larger than a band gap of the cerium oxide particle. 3. The polishing liquid according to claim 1 , wherein an energy level at a lower end of a conduction band of the substance for reducing cerium oxide in response to the irradiation of the light is higher than an energy level at a lower end of a conduction band of the cerium oxide particle. 4. The polishing liquid according to claim 1 , wherein a coverage indicating to what extent the substance for reducing cerium oxide in response to the irradiation of the light covers the surface of the cerium oxide particle is in a range of 0.01% to 50%. 5. The polishing liquid according to claim 1 , wherein the polishing liquid is alkaline. 6. A polishing liquid for polishing a glass substrate, the polishing liquid comprising: cerium oxide as polishing abrasive particles; and a substance for reducing cerium oxide in response to irradiation of light, an average particle diameter of the substance for reducing cerium oxide in response to the irradiation of the light being ⅕ or less of an average particle diameter of the cerium oxide, a content of the substance for reducing cerium oxide in response to the irradiation of the light being half or less of a content of the cerium oxide in the polishing liquid, and the substance for reducing cerium oxide in response to the irradiation of the light being gallium oxide. 7. The polishing liquid according to claim 6 , wherein a band gap of the substance for reducing cerium oxide in response to the irradiation of the light is larger than a band gap of the cerium oxide. 8. The polishing liquid according to claim 6 , wherein an energy level at a lower end of a conduction band of the substance for reducing cerium oxide in response to the irradiation of the light is higher than an energy level at a lower end of a conduction band of the cerium oxide. 9. The polishing liquid according to claim 6 , wherein the polishing liquid is alkaline.
manufacturing base layers · CPC title
Sputtering · CPC title
Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing · CPC title
Abrasive powders, suspensions and pastes for polishing · CPC title
characterised by the composition of the lapping agent · CPC title
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