Method for polishing glass substrate, method for manufacturing glass substrate, method for manufacturing magnetic-disk glass substrate, method for manufacturing magnetic disk, polishing liquid, and method for reducing cerium oxide

US11098224B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11098224-B2
Application numberUS-201716337310-A
CountryUS
Kind codeB2
Filing dateNov 24, 2017
Priority dateNov 23, 2016
Publication dateAug 24, 2021
Grant dateAug 24, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for polishing a glass substrate, by which a polishing speed that is higher than a conventional polishing speed can be maintained for a long period of time in processing for polishing a glass substrate using cerium oxide as polishing abrasive particles is provided. A polishing liquid containing cerium oxide as polishing abrasive particles is supplied to a polishing surface of a glass substrate, and the glass substrate is subjected to polishing processing. This polishing liquid contains the cerium oxide as polishing abrasive particles and a substance that reduces cerium oxide in response to light irradiation. Also, processing for irradiating the polishing liquid with light is performed when polishing processing is performed.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for manufacturing a glass substrate, the method comprising: performing a polishing processing on a glass substrate using a polishing liquid containing cerium oxide as polishing abrasive particles, the polishing liquid being irradiated with light when the polishing processing is performed, the polishing liquid containing a substance that reduces cerium oxide in response to irradiation of the light. 2. The method for manufacturing a glass substrate-according to claim 1 , wherein a band gap of the substance that reduces cerium oxide in response to the irradiation of the light is larger than a band gap of the cerium oxide. 3. The method for manufacturing a glass substrate according to claim 1 , wherein an energy level at a lower end of a conduction band of the substance that reduces cerium oxide in response to the irradiation of the light is higher than an energy level at a lower end of a conduction band of the cerium oxide. 4. The method for manufacturing a glass substrate according to claim 1 , wherein the substance that reduces cerium oxide in response to the irradiation of the light includes at least one of gallium oxide, tantalum oxide, tantalates, niobium oxide, and niobates. 5. The method for manufacturing a glass substrate according to claim 1 , wherein the polishing liquid is alkaline. 6. The method for manufacturing a glass substrate according to claim 1 , wherein the polishing liquid is used while the polishing liquid is circulated during the polishing processing. 7. A method for manufacturing a magnetic-disk glass substrate, by which a magnetic-disk glass substrate is manufactured using the method for manufacturing a glass substrate according to claim 1 . 8. A method for manufacturing a magnetic disk, comprising: manufacturing the glass substrate according to claim 1 ; and processing in which at least a magnetic film is formed. 9. The method for manufacturing a glass substrate according to claim 4 , wherein the polishing liquid is alkaline. 10. The method for manufacturing a glass substrate according to claim 4 , wherein the polishing liquid is used while the polishing liquid is circulated during the polishing processing. 11. The method for manufacturing a glass substrate according to claim 9 , wherein the polishing liquid is used while the polishing liquid is circulated during the polishing processing. 12. A method for manufacturing a glass substrate, the method comprising: performing a polishing processing on a glass substrate using a polishing liquid containing polishing abrasive particles, the polishing liquid being irradiated with light when the polishing processing is performed, the polishing abrasive particles including cerium oxide whose surface has a substance that reduces cerium oxide in response to irradiation of the light. 13. The method for manufacturing a glass substrate according to claim 12 , wherein a band gap of the substance that reduces cerium oxide in response to the irradiation of the light is larger than a band gap of the cerium oxide. 14. The method for manufacturing a glass substrate according to claim 12 , wherein an energy level at a lower end of a conduction band of the substance that reduces cerium oxide in response to the irradiation of the light is higher than an energy level at a lower end of a conduction band of the cerium oxide. 15. The method for manufacturing a glass substrate according to claim 12 , wherein the substance that reduces cerium oxide in response to the irradiation of the light includes at least one of gallium oxide, tantalum oxide, tantalates, niobium oxide, and niobates. 16. The method for manufacturing a glass substrate according to claim 12 , wherein a coverage of the substance that reduces cerium oxide in response to the irradiation of the light on the surface of the cerium oxide is in a range of 0.01% to 50%. 17. The method for manufacturing a glass substrate according to claim 12 , wherein the polishing liquid is alkaline. 18. The method for manufacturing a glass substrate according to claim 12 , wherein the polishing liquid is used while the polishing liquid is circulated during the polishing processing. 19. A method for manufacturing a magnetic-disk glass substrate, by which a magnetic-disk glass substrate is manufactured using the method for manufacturing a glass substrate according to claim 12 . 20. A method for manufacturing a magnetic disk, comprising: manufacturing the glass substrate according to claim 12 ; and processing in which at least a magnetic film is formed.

Assignees

Inventors

Classifications

  • C09G1/02Primary

    containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title

  • characterised by the composition of the lapping agent · CPC title

  • manufacturing base layers · CPC title

  • Composite particles, e.g. coated particles · CPC title

  • Abrasive powders, suspensions and pastes for polishing · CPC title

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What does patent US11098224B2 cover?
A method for polishing a glass substrate, by which a polishing speed that is higher than a conventional polishing speed can be maintained for a long period of time in processing for polishing a glass substrate using cerium oxide as polishing abrasive particles is provided. A polishing liquid containing cerium oxide as polishing abrasive particles is supplied to a polishing surface of a glass su…
Who is the assignee on this patent?
Hoya Corp
What technology area does this patent fall under?
Primary CPC classification C09G1/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 24 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).