Substrate handling in a modular polishing system with single substrate cleaning chambers

Patent metadata

Field	Value
Publication number	US-12198944-B2
Application number	US-202117202245-A
Country	US
Kind code	B2
Filing date	Mar 15, 2021
Priority date	Nov 11, 2020
Publication date	Jan 14, 2025
Grant date	Jan 14, 2025

Abstract

Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems, and more particular, to modular polishing systems used in the manufacturing of semiconductor devices. In one embodiment, a polishing system includes a first portion having a plurality of polishing stations disposed therein, and a second portion coupled to the first portion, the second portion comprising a substrate cleaning system. The substrate cleaning system comprises a wet-in/dry-out substrate cleaning module comprising a chamber housing which defines a chamber volume. The polishing system further includes a substrate handler located in the second portion, where the substrate handler is positioned to transfer substrates to or from the wet-in/dry-out substrate cleaning module through one or more openings formed in one or more sidewalls of the chamber housing.

First claim

What is claimed is:

1. A substrate cleaning system, comprising:
a chamber housing defining a chamber volume, a first sidewall of the chamber housing having a first opening formed therethrough for receiving a substrate into the chamber volume;
a substrate support disposed in the chamber volume;
a first door or first valve which is operable to cover or seal the first opening;
a first lift pin assembly comprising a plurality of first pins for receiving a substrate from a substrate handler and positioning the substrate on the substrate support;
a second opening formed through the chamber housing;
a second lift pin assembly comprising a plurality of second pins positioned to lift the substrate from the substrate support to allow access to the substrate by the substrate handler, wherein the plurality of second pins are different from the plurality of first pins; and
the substrate handler positioned to transfer substrates into the chamber volume, wherein the substrate handler comprises:
a first end effector coupled to a first arm; and
a second end effector coupled to a second arm,

wherein the first end effector is used to transfer wet substrates into the chamber volume through the first opening and the second end effector is used to transfer dry substrates out from the chamber volume through the second opening.

2. The substrate cleaning system of claim 1 , further comprising:
a tunnel extending outwardly from the chamber housing, wherein the tunnel is disposed in alignment with the first opening to allow for substrate transfer therethrough; and
a load-lock chamber adjacent to the chamber housing, wherein an opening in the load-lock chamber is aligned with the second opening of the chamber housing.

3. The substrate cleaning system of claim 1 , further comprising one or more first nozzles positioned to direct a drying fluid at the plurality of first lift pins.

4. The substrate cleaning system of claim 1 , further comprising a tunnel disposed in alignment with the first opening to define a substrate transfer path therewith.

5. The substrate cleaning system of claim 1 , wherein a second sidewall of the chamber housing has the second opening formed therethrough, and a door or valve is operable to cover or seal the second opening.

6. The substrate cleaning system of claim 5 , further comprising a load-lock chamber adjacent to the substrate cleaning system, wherein an opening in the load-lock chamber is aligned with the second opening.

7. The substrate cleaning system of claim 6 , wherein the second sidewall is adjacent to the first sidewall.

8. The substrate cleaning system of claim 4 , wherein the second opening is disposed through the first sidewall above the first opening.

9. The substrate cleaning system of claim 4 , wherein the tunnel extends into the chamber volume.

10. The substrate cleaning system of claim 8 , further comprising a second tunnel extending outwardly from the chamber housing, wherein the second tunnel is disposed in alignment with the second opening to allow for substrate transfer therethrough.

11. The substrate cleaning system of claim 3 , further comprising one or more second nozzles disposed proximate to the substrate support and positioned to direct a fluid towards a peripheral edge of a substrate disposed thereon.

12. The substrate cleaning system of claim 2 , wherein the first sidewall of the chamber housing is adjacent to a second sidewall of the chamber housing, wherein the first sidewall or the second sidewall of the chamber housing has the second opening formed therethrough, and a second door or second valve is operable to cover or seal the second opening.

13. The substrate cleaning system of claim 12 , wherein the second opening is disposed through the second sidewall.

14. The substrate cleaning system of claim 12 , wherein the second opening is disposed through the first sidewall above the first opening.

15. The substrate cleaning system of claim 14 , further comprising a second tunnel extending outwardly from the chamber housing, wherein the second tunnel is disposed in alignment with the first opening or the second opening to allow for substrate transfer therethrough.

Assignees

• Applied Materials Inc

Inventors

• Brown Brian J
• Mikhaylichenko Ekaterina
• Ji Jin
• Rangarajan Jagan
• Zuniga Steven M

Classifications

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/3202

  Mechanical details, e.g. rollers or belts · CPC title

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title

• H10P72/0458

  vertical arrangement · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title