Composite array electrode, preparation method thereof and use thereof

Patent metadata

Field	Value
Publication number	US-12180609-B2
Application number	US-202217841189-A
Country	US
Kind code	B2
Filing date	Jun 15, 2022
Priority date	Dec 15, 2018
Publication date	Dec 31, 2024
Grant date	Dec 31, 2024

Abstract

Provided are composite array electrode, preparation method thereof and use thereof. The composite array electrode comprises a microelectrode array substrate, and a modification layer formed on a surface of a microelectrode of the microelectrode array substrate, wherein the modification layer comprises a plurality of electrically conductive layers arranged at intervals on the surface of the microelectrode, an insulating layer arranged on the surface of the microelectrode except the electrically conductive layers, and wherein material for the electrically conductive layers comprises one or more of nano platinum, nano iridium, conductive polymer and carbon nanotubes. The composite array electrode effectively eliminates the influence of edge effect such that the electric field distributes uniformly on the microelectrode surface of the composite array electrode, significantly improving electrochemical performance and detection capability of the electrode.

First claim

What is claimed is:

1. A method for preparing a composite array electrode, comprising:
providing a microelectrode array substrate, the microelectrode of the microelectrode array substrate being provided with an insulating layer on the surface thereof; etching the insulating layer to form a plurality of holes spaced apart and penetrating the insulating layer; and
depositing an electrically conductive material in the holes to form an electrically conductive layer on the surface of the microelectrode by electrodeposition process, the electrically conductive material comprising (i) one or more of nano platinum and nano iridium, and (ii) carbon nanotubes;
wherein the carbon nanotubes are single-walled or multi-walled carbon nanotubes; and the carbon nanotubes have a pore size of 30 to 45 μm.

2. The method of claim 1 , after the step of etching the insulating layer and before performing the electrodeposition process, the method further comprising performing surface pretreatment on the etched microelectrode array substrate, and the step of performing surface pretreatment comprising:
cleaning ultrasonically the etched microelectrode array substrate in an acetone or ethanol solution for 20 to 60 minutes, followed by washing with deionized water and placing in a sulfuric acid solution for electrochemical cyclic voltammetry scanning under a voltage of −0.25V˜1.2V, at a scanning rate of 50˜200 mV/s, for a scanning time of 25˜60 min, until a coincident CV curve is obtained.

3. The method of claim 1 , wherein material for the insulating layer comprises one or more of polyimide, polydimethylsiloxane, polychloro-p-xylene, silica gel, polyurethane, silicone rubber and epoxy resin.

4. The method of claim 1 , when the electrically conductive material comprises nano platinum, the electrodeposition process comprises:
preparing a platinum salt solution; and
placing the surface-pretreated microelectrode array substrate in the platinum salt solution and performing electrodepositing such that an electrically conductive material is deposited in the holes to form the electrically conductive layer on the surface of the microelectrode,
wherein the platinum salt in the platinum salt solution comprises one or more of platinum chloride, ammonium hexachloroplatinate, potassium hexachloroplatinate, sodium hexachloroplatinate, chloroplatinic acid, platinum nitrate, platinum sulfate, potassium tetrachloroplatinate and ammonium tetrachloroplatinate, and the platinum salt solution has a pH of 6.5 to 7.5.

5. The method of claim 1 , when the electrically conductive material comprises nano iridium, the electrodeposition process comprises:
preparing an iridium salt solution; and
placing the surface-pretreated microelectrode array substrate in the iridium salt solution and performing electrodepositing such that an electrically conductive material is deposited in the holes to form the electrically conductive layer on the surface of the microelectrode,
wherein the iridium salt in the iridium salt solution comprises one or more of iridium chloride, chloroiridic acid, sodium hexachloroiridate and potassium hexachloroiridate, and the iridium salt solution has a pH of 6.5 to 7.5.

6. The method of claim 1 , wherein the holes have a cross-sectional shape of one or more of circle, triangle, quadrangle and polygon.

7. The method of claim 1 , wherein the holes have a lateral dimension of 6 to 60 μm.

Assignees

• Shenzhen Inst Adv Tech

Inventors

• Zeng Qi
• Wu Tianzhun

Classifications

• H10W20/40

  Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes · CPC title

• G01N27/3278

  involving nanosized elements, e.g. nanogaps or nanoparticles (nanopores G01N33/48721; magnetic beads G01N27/745) · CPC title

• A61N1/0551

  Spinal or peripheral nerve electrodes · CPC title

• A61B2562/046

  in a matrix array · CPC title

• C25D5/34

  Pretreatment of metallic surfaces to be electroplated · CPC title