Printed wiring board

Patent metadata

Field	Value
Publication number	US-12177973-B2
Application number	US-202017922872-A
Country	US
Kind code	B2
Filing date	May 20, 2020
Priority date	May 20, 2020
Publication date	Dec 24, 2024
Grant date	Dec 24, 2024

Abstract

A printed wiring board includes a base layer having insulating properties, a first conductive layer directly or indirectly stacked on the base layer front surface, and including a copper foil, a second conductive layer directly or indirectly stacked on the base layer back surface, and including a copper foil, a stacked body for a via hole, the stacked body being stacked on an inner periphery and a bottom of a connection hole that extends through the first conductive layer and the base layer in a thickness direction, and being configured to electrically connect the first conductive layer and the second conductive layer to each other, and having an electroless copper plating layer. Each copper foil contains a copper crystal grain oriented in a plane orientation, and an average crystal grain size of copper of each copper foil is 10 μm or greater, the electroless copper plating layer includes palladium.

First claim

The invention claimed is:

1. A printed wiring board comprising:
a base layer having insulating properties;
a first conductive layer directly or indirectly stacked on a front surface of the base layer, and including a copper foil;
a second conductive layer directly or indirectly stacked on a back surface of the base layer, and including a copper foil;
a stacked body for a via hole, the stacked body being stacked on an inner periphery and a bottom of a connection hole that extends through the first conductive layer and the base layer in a thickness direction, and being configured to electrically connect the first conductive layer and the second conductive layer to each other,
wherein the stacked body for the via hole has an electroless copper plating layer that is stacked on the inner periphery and the bottom of the connection hole, and an electrolytic copper plating layer that is stacked on a surface of the electroless copper plating layer,
wherein each copper foil contains a copper crystal grain oriented in a (100) plane orientation, and an average crystal grain size of copper of each copper foil is 10 μm or greater,
wherein the electroless copper plating layer includes palladium, and
wherein a stacking amount of the palladium per unit area of a surface of each copper foil is 0.03 μg/cm 2 to 0.15 μg/cm 2 , the surface of each copper foil facing the electroless copper plating layer.

2. The printed wiring board according to claim 1 , wherein a proportion of an area of the copper crystal grain oriented in the (100) plane orientation existing in the surface of each copper foil with respect to an area of the surface of each copper foil is 50% or greater.

3. The printed wiring board according to claim 1 , wherein the stacking amount of the palladium per unit area of the surface of each copper foil is 0.05 μg/cm 2 to 0.10 μg/cm 2 .

4. The printed wiring board according to claim 3 , wherein a proportion of an area of the copper crystal grain oriented in the (100) plane orientation existing in the surface of each copper foil with respect to an area of the surface of each copper foil is 50% or greater.

5. The printed wiring board according to claim 1 , wherein an average thickness of the electroless copper plating layer is 0.05 μm to 1.0 μm.

Assignees

• Sumitomo Electric Industries
• Sumitomo Electric Printed Circuits Inc

Inventors

• Sakai Shoichiro
• Motomura Junichi
• Nitta Koji
• Iwamoto Masashi
• Tsubokura Mitsutaka
• Sogabe Mari
• Tsuchiko Akira

Classifications

• H05K2201/09509

  Blind vias, i.e. vias having one side closed · CPC title

• H05K2201/0355

  Metal foils · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• C23C18/2086

  with use of organic or inorganic compounds other than metals, first · CPC title

• C23C18/1653

  Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating · CPC title