μLED chip architecture based on nanostructured perovskite converter materials
US-12466996-B2 · Nov 11, 2025 · US
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Boehm Marcus patents
Boehm Marcus is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Boehm Marcus |
| Total patents | 10 |
| First publication | Jun 20, 2019 |
| Latest publication | Nov 11, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Molded semiconductor package having an embedded inlay
US-12283538-B2 · Apr 22, 2025 · US
Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method
US-12165959-B2 · Dec 10, 2024 · US
Molded semiconductor package having an embedded inlay
US-2023369177-A1 · Nov 16, 2023 · US
Minimization of stokes' losses due to photon multiplication processes for ir applications
US-2023160557-A1 · May 25, 2023 · US
µLED Chip Architecture Based on Nanostructured Perovskite Converter Materials
US-2021261860-A1 · Aug 26, 2021 · US
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Flanks, and Corresponding Manufacturing Method
US-2021225744-A1 · Jul 22, 2021 · US
Rolling-element bearing assembly
US-10781859-B2 · Sep 22, 2020 · US
Photon multiplier film
US-2020194701-A1 · Jun 18, 2020 · US
Rolling-element bearing assembly
US-2019186545-A1 · Jun 20, 2019 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 4 |
| Osram Oled Gmbh | 2 |
| Skf Ab | 2 |
| Osram Opto Semiconductors Gmbh | 1 |
| Cambridge Entpr Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/111 | 4 |
| H10W74/016 | 4 |
| H10W70/481 | 4 |
| H10W70/466 | 4 |
| H10W70/041 | 4 |