Cleaning unit and substrate processing apparatus including same

Patent metadata

Field	Value
Publication number	US-12165885-B2
Application number	US-202117531800-A
Country	US
Kind code	B2
Filing date	Nov 21, 2021
Priority date	Dec 2, 2020
Publication date	Dec 10, 2024
Grant date	Dec 10, 2024

Abstract

A cleaning unit includes a gas spray part arranged above a substrate to be cleaned, and sprays a gas toward the substrate in order to separate a contaminant on the substrate from the substrate, and a suction part provided on a side of the gas spray part, and including an inlet suctioning and removing the contaminant that is separated from the substrate.

First claim

What is claimed is:

1. A cleaning unit comprising:
a gas spray part arranged on an upper surface of a substrate to be cleaned, and configured to spray a gas toward the substrate in order to separate a contaminant on the substrate from the substrate;
a suction part provided on a side of the gas spray part, and comprising an inlet configured to suction and remove the contaminant that is separated from the substrate;
a discharge pump connected to the inlet of the suction part,
wherein the substrate is supported by a substrate support member moving along a pair of transfer rail extending in a first horizontal direction; and
a horizontal drive part configured to move the gas spray part in a second horizontal direction perpendicular to the first horizontal direction.

2. The cleaning unit of claim 1 ,
wherein the gas spray part is inclined at a predetermined angle with respect to the upper surface of the substrate to spray the gas in an oblique direction toward the upper surface of the substrate.

3. The cleaning unit of claim 2 ,
wherein the predetermined angle is an acute angle that is equal to or less than 80°.

4. The cleaning unit of claim 1 ,
wherein the gas spray part comprises a slit type nozzle.

5. The cleaning unit of claim 4 ,
wherein a slit spacing of the slit type nozzle is equal to or less than 0.3 mm.

6. The cleaning unit of claim 1 ,
wherein the suction part is arranged to face the upper surface of the substrate to suck the contaminant in a perpendicularly upward direction from the substrate, and
wherein the inlet is provided on a surface of the suction part facing the substrate.

7. The cleaning unit of claim 6 ,
wherein the suction part comprises a housing with an open lower surface, and
wherein the inlet is provided on an upper surface of the housing.

8. The cleaning unit of claim 3 ,
wherein the suction part has one lateral wall formed in parallel to the gas spray part, and
wherein the suction part is attached to the gas spray part and is provided integrally with the suction part.

9. The cleaning unit of claim 8 ,
wherein a middle member is provided between the suction part and the gas spray part.

10. The cleaning unit of claim 1 , further comprising:
a vertical drive part configured to vertically move the gas spray part and the suction part.

11. The cleaning unit of claim 8 ,
wherein the gas spray part and the suction part are physically separated from each other.

12. The cleaning unit of claim 11 , wherein the horizontal drive part is configured to further move the suction part in the second horizontal direction.

13. A bonding module comprising:
a substrate support member configured to support a substrate;
a bonding unit comprising at least one bonding head for bonding a die to the substrate; and
a cleaning unit provided on an upper surface of the substrate support member and configured to clean the substrate support member,
wherein the cleaning unit comprises:
a gas spray part configured to spray gas toward the substrate support member in order to separate a contaminant on the substrate support member from the substrate support member; and
a suction part comprising:
an inlet provided on a side of the gas spray part and configured to suction and remove the contaminant separated from the substrate; and
a discharge duct communicating with the inlet to discharge the contaminant.

14. The bonding module of claim 13 ,
wherein the gas spray part is inclined downward at an acute angle that is equal to or less than 80° with respect to a moving direction of the substrate support member, and
wherein the gas spray part is configured to obliquely spray the gas toward the substrate support member.

15. The bonding module of claim 13 ,
wherein the gas spray part comprises a slit type nozzle, and
wherein a slit spacing of the slit type nozzle is equal to or less than 0.3 mm.

16. The bonding module of claim 13 ,
wherein the suction part is arranged to face a transfer rail to suck the contaminant in a perpendicular upward direction of the substrate support member, the suction part including a housing with an open lower surface, and
wherein the inlet is provided at an upper surface of the housing.

17. The bonding module of claim 14 ,
wherein the suction part has one lateral wall formed in parallel to the gas spray part, and
wherein the one lateral wall is attached to the gas spray part.

18. The bonding module of claim 13 , further comprising:
a drive part configured to horizontally and vertically move the cleaning unit.

19. A cleaning unit comprising:
a pair of transfer rails extending in a first horizontal direction, wherein the pair of transfer rails are spaced apart from each other in a second horizontal direction;
a substrate support member supporting a substrate to be cleaned and configured to move along the pair of transfer rails in the first horizontal direction;
a gas spray part disposed above the pair of transfer rails and arranged on an upper surface of the substrate to be cleaned, and configured to spray a gas toward the substrate in order to separate a contaminant on the substrate from the substrate, wherein a first width, in the second horizontal direction, of the gas spray part is greater than a second width, in the second horizontal direction, of the substrate support member;
a suction part provided on a side of the gas spray part, and comprising an inlet configured to suction and remove the contaminant that is separated from the substrate; and
a discharge pump connected to the inlet of the suction part.

20. The cleaning unit of claim 19 ,
wherein the suction part comprises a housing with an upper surface, a first sidewall extending downwardly from the upper surface, a second sidewall extending downwardly from the upper surface at an acute angle relative to the upper surface of the housing, an open lower surface defined by a lower end of the first sidewall and a lower end of the second sidewall,
wherein the inlet is provided at an upper surface of the housing and connected to the discharge pump, and
wherein the gas spray part is attached to the second sidewall.

Assignees

• Semes Co Ltd

Inventors

• Lim Sok Taek

Classifications

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10P72/0408 Primary

  for drying · CPC title

• H10P72/0406 Primary

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• B08B5/04

  Cleaning by suction, with or without auxiliary action · CPC title

• B08B5/02

  Cleaning by the force of jets, e.g. blowing-out cavities {(airguns or nozzles per se B05B1/005)} · CPC title