Method and apparatus for processing substrate

Patent metadata

Field	Value
Publication number	US-9355835-B2
Application number	US-201313928781-A
Country	US
Kind code	B2
Filing date	Jun 27, 2013
Priority date	Jun 29, 2012
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

Provided are a substrate processing apparatus and method. The substrate processing apparatus includes a substrate support member on which a substrate is placed and a movable spray member supplying a fluid onto the substrate placed on the substrate support member. The movable spray member includes a first nozzle arm rotating to spray at least one fluid and a second nozzle arm disposed on the first nozzle arm to spray at least one fluid.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a substrate support member on which a substrate is placed; and
a movable spray member configured to supply a fluid onto the substrate placed on the substrate support member, the movable spray member including
a first nozzle arm configured to rotate to spray at least one fluid, and
a second nozzle arm on the first nozzle arm to spray at least one fluid,

wherein when the first nozzle arm rotates by an angle in a first direction from a starting point outside the substrate support member toward the substrate support member, the second nozzle arm is configured to rotate in a second direction opposite to the first direction, and
wherein the first nozzle arm is configured to rotate about a first axis of rotation and the second nozzle arm is configured to rotate about a second axis of rotation, and the first axis of rotation and the second axis of rotation are parallel to each other, and
wherein the first nozzle arm includes,
a first support shaft at one end thereof, the one end being opposite to an another end at which a first nozzle is disposed, and
a second support shaft arranged between the two ends, wherein the second nozzle arm is coupled to the first nozzle arm by the second support shaft.

2. The substrate processing apparatus of claim 1 , wherein the second nozzle arm is configured to rotate on the first nozzle arm by the second rotation shaft and a separate driving source.

3. The substrate processing apparatus of claim 1 , wherein the second nozzle arm is configured to rotate together with the first nozzle arm while the first nozzle arm rotates.

4. The substrate processing apparatus of claim 1 , wherein the first and second nozzle arms comprise nozzles that are configured to spray processing fluids different from each other.

5. The substrate processing apparatus of claim 1 , wherein the movable spray member comprises:
a first driving unit configured to rotate the first nozzle arm; and
a second driving unit configured to rotate the second nozzle arm.

6. The substrate processing apparatus of claim 5 , wherein the second driving unit is disposed midway on the first nozzle arm.

7. The substrate processing apparatus of claim 5 , wherein the movable spray member further comprises a control unit configured to control the first and second driving units.

8. The substrate processing apparatus of claim 1 , wherein the second nozzle arm is arranged in parallel with the first nozzle arm.

9. The substrate processing apparatus of claim 1 , wherein the first nozzle arm and the second nozzle arm are arranged on substantially a same plane in parallel with a plane defined by the substrate support member.

10. The substrate processing apparatus of claim 1 , wherein the first nozzle arm is configured to rotate with respect to the first support shaft and the second nozzle arm is configured to rotate with respect to the second support shaft.

11. The substrate processing apparatus of claim 1 , wherein the first nozzle arm and the second nozzle arm are configured to rotate at a same rotating rate.

12. The substrate processing apparatus of claim 1 , wherein the first direction is one of a clockwise direction and a counterclockwise direction, and the second direction is the other one of the clockwise direction and the counterclockwise direction.

13. The substrate processing apparatus of claim 1 , further comprising:
a controller programmed to rotate the second nozzle arm in the second direction when the first nozzle arm rotates in the first direction.

Assignees

• Semes Co Ltd

Inventors

• Lee Taekyoub

Classifications

• H10P72/0422

  for wet etching · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P70/15 Primary

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title