System for providing dynamic feedback for selective adhesion PCB production

Patent metadata

Field	Value
Publication number	US-12150248-B2
Application number	US-202217901417-A
Country	US
Kind code	B2
Filing date	Sep 1, 2022
Priority date	Mar 12, 2020
Publication date	Nov 19, 2024
Grant date	Nov 19, 2024

Abstract

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

First claim

Having thus described various embodiments of the technology, what is claimed as new and desired to be protected by Letters Patent includes the following:

1. A system for providing dynamic feedback for selective adhesion printed circuit board (PCB) production, the system comprising:
a conveyor mechanism configured to convey a series of selective adhesion blanks, each selective adhesion blank being prepopulated with parts and utilized to produce a PCB, each selective adhesion blank including:
a flexible film forming a top layer of the selective adhesion blank,
a substrate forming a bottom layer of the selective adhesion blank,
a conductive layer formed from electrically conductive material and adhered to the substrate, and
a curable adhesive positioned between the flexible film and the conductive layer, the curable adhesive configured to selectively bond with the conductive layer when the curable adhesive is cured;

an optical inspection unit configured to generate current image data of each selective adhesion blank;
a curing system configured to cure the curable adhesive for each selective adhesion blank; and
a computer including a processing element in electronic communication with a memory element, the processing element configured or programmed to:
receive a PCB design including placement of the parts and a pattern of traces and pads,
receive the current image data,
compare the current image data with standard image data corresponding to the PCB design,
determine a modification to the PCB design if a difference between the current image data and the standard image data is detected, and
direct the curing system to cure the curable adhesive of each selective adhesion blank for which the difference is detected according to the modification of the PCB design.

2. The system of claim 1 , wherein the processing element is further configured or programmed to direct the curing system to cure the curable adhesive of each selective adhesion blank according to the PCB design if a difference between the current image data and the standard image data is not detected.

3. The system of claim 1 , wherein the modification to the PCB design includes a relocation of one or more traces.

4. The system of claim 1 , wherein the modification to the PCB design includes a relocation of one or more pads.

5. The system of claim 1 , further comprising a peel roller configured to remove the flexible film, the curable adhesive, and the bonded conductive layer.

6. The system of claim 1 , wherein the curing system includes a laser source configured to generate a laser beam to strike the curable adhesive in areas that create a negative of each PCB design.

7. The system of claim 1 , wherein the curing system includes a printing mechanism configured to print a mask onto an upper surface of the flexible film.

8. The system of claim 1 , wherein the curing system includes a placement mechanism configured to place a mask onto an upper surface of the flexible film.

Assignees

• Honeywell Federal Mfg & Tech Llc

Inventors

• Hatch Jonathan Douglas
• Hatch Stephen Mcgarry

Classifications

• H05K3/00

  Apparatus or processes for manufacturing printed circuits · CPC title

• H05K3/108

  by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241) · CPC title

• H05K3/0005

  for designing circuits by computer · CPC title

• H05K3/4691

  Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers · CPC title

• H05K3/386

  by the use of an organic polymeric bonding layer, e.g. adhesive · CPC title