Polyamideimide adhesives for printed circuit boards

Patent metadata

Field	Value
Publication number	US-9668360-B2
Application number	US-201013504792-A
Country	US
Kind code	B2
Filing date	Oct 28, 2010
Priority date	Oct 29, 2009
Publication date	May 30, 2017
Grant date	May 30, 2017

Abstract

The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.

First claim

The invention claimed is:

1. A liquid, thermal-curing, adhesive composition, comprising a polyamideimide having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group, an aprotic solvent, and an additional thermally curable component
wherein the polyamideimide is prepared from a reaction mixture with a molar ratio of diisocyanate to isocyanate-blocking agent of approximately 10:0.1 to 10:2 and
wherein the isocyanate-blocking group is an aliphatic amide.

2. The composition of claim 1 , wherein the polyamideimide having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group is the reaction product of (i) a polyamideimide having a terminal isocyanate group and (ii) an aliphatic amide.

3. The composition of claim 2 , wherein the aliphatic amide is a 5 to 8-membered lactam optionally substituted with one or more C 1 -C 4 alkyl groups.

4. The composition of claim 3 , wherein the 5 to 8-membered lactam is ∈-caprolactam.

5. The composition of claim 1 , wherein the polyamideimide having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group has the formula (I):
[B]—C(O)-[A] n -OH  (I)

wherein: [A] n is a polyamideimide unit in which n is at least 4; and [B] is a thermally-dissociatable isocyanate-blocking group.

6. The composition of claim 5 , wherein [B] is —N(R 1 )—C(O)R 2 , wherein either (a) R 1 and R 2 are each independently selected from C 1 -C 6 alkyl; or (b) R 1 , R 2 and the amide group to which they are attached together form a 5 to 8-membered lactam ring, optionally substituted with one or more C 1 -C 4 alkyl groups.

7. The composition of claim 6 , wherein R 1 , R 2 and the nitrogen atom and carbonyl group to which they are attached together forms a 5 to 8-membered lactam ring, optionally substituted with one or more methyl groups.

8. The composition of claim 1 , wherein the thermally-dissociatable isocyanate-blocking group dissociates at a temperature in the range of from 100° C. to 250° C.

9. The composition of claim 8 , wherein the thermally-dissociatable isocyanate-blocking group dissociates at a temperature in the range of from 140° C. to 200° C.

10. The composition of claim 1 , wherein the composition is a liquid at 25° C. and wherein the composition has a viscosity of less than 35 Pa·s at 25° C. after storage for three months at 15° C.

11. The composition of claim 10 , wherein there is no more than a 3.5-fold increase in the viscosity at 25° C. after storage for three months at 15° C.

12. The composition of claim 1 , wherein the further thermally curable component is a multifunctional epoxy resin.

13. The composition of claim 1 , further comprising a leveling aid, a thermal curing promoter, a stabiliser, and/or a filler.

14. The composition of claim 1 , having a solids content of at least 20 wt %.

15. A method of bonding two articles to one another comprising the steps of
(a) providing a first article with the liquid, thermal-curing, adhesive composition as defined in claim 1 ,
(b) contacting a second article with the adhesive composition, and then
(c) curing the adhesive composition.

16. The method of claim 15 , in which the composition is cured by heating to a temperature of at least 150° C. in step (c).

17. The method of claim 15 , wherein the composition is applied to the first article by screen printing, roller coating, dip coating, curtain coating, spray coating, spin coating, ink jet, gravure coating, offset coating, flexo coating, dispensing, pad printing, brushing, flood coating or aerosol deposition.

18. The method of claim 17 , wherein the composition is applied by screen printing.

19. The method of claim 15 , wherein the first and second articles are layers of a multilayer laminate.

20. The method of claim 15 , wherein the first article is a stiffener member or a heat sink and the second article is a base board.

21. The method of claim 15 , wherein the method is used in the preparation of an electronic component.

22. The method of claim 21 wherein the electronic component is a flexible printed circuit board or rigid-flexible printed circuit board.

23. A flexible printed circuit board or rigid-flexible printed circuit board comprising a cured adhesive of the liquid, thermal-curing, adhesive composition as defined in claim 1 .

24. A two-pack system for use in preparing a liquid, thermal-curing, adhesive composition comprising a first component comprising a polyamideimide having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group; and a second component comprising a thermal curing promoter or a further thermally-curable compound, wherein either the first or second component additionally comprises an aprotic solvent;
wherein the polyamideimide is prepared from a reaction mixture with a molar ratio of diisocyanate to isocyanate-blocking agent of approximately 10:0.1 to 10:2 and
wherein the isocyanate-blocking group is an aliphatic amide.

25. The two-pack system of claim 24 , for use in preparing a liquid, thermal-curing, adhesive composition comprising a polyamideimide, wherein the composition is a liquid at 25° C. and wherein the composition has a viscosity of less than 35 Pa·s at 25° C. after storage for three months at 15° C.

Assignees

• Davis Richard Charles
• Ford Simon Richard
• Hall Stephen Anthony
• Klaus Matthias
• Ognibeni Karl-Heinz
• Sun Chemical Corp

Inventors

• Davis Richard Charles
• Ford Simon Richard
• Hall Stephen Anthony
• Klaus Matthias
• Ognibeni Karl-Heinz

Classifications

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• C09J179/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• H05K3/386 Primary

  by the use of an organic polymeric bonding layer, e.g. adhesive · CPC title

• C08G73/14

  Polyamide-imides · CPC title

• H05K2201/0154

  Polyimide · CPC title